JP2011222596A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP2011222596A JP2011222596A JP2010087257A JP2010087257A JP2011222596A JP 2011222596 A JP2011222596 A JP 2011222596A JP 2010087257 A JP2010087257 A JP 2010087257A JP 2010087257 A JP2010087257 A JP 2010087257A JP 2011222596 A JP2011222596 A JP 2011222596A
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- electrode
- hole
- layer
- semiconductor substrate
- photosensitive resin
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Abstract
【解決手段】
貫通電極9を被覆するとともに、貫通孔6内を充填する保護層10を備える半導体装置1において、保護層10が複数層11、12からなり、複数層の保護層のうち最も半導体基板2の一面2aに近い層が、少なくとも貫通電極の底面9aと側面9bの交差部を被覆し、かつ、ポジ型感光性樹脂を用いて形成されることを特徴とする半導体装置を提供する。
【選択図】図1
Description
これら優れた特徴は、現在急速に進んでいる実装の高密度化や、情報処理速度の高速化が実現できるという点において非常に優位である。
この保護層110を形成する際には、安価なネガ型感光性樹脂が多用される。このネガ型感光性樹脂は、貫通孔106の内部に埋め込まれると同時に、再配線層108を含む半導体基板102の他面102b側を被覆する。ここで使用されるネガ型感光性樹脂はドライフィルム状、またはワニス状の樹脂である。フィルムラミネートやスピンコートなどの手法によって、ネガ型感光性樹脂が貫通孔106の内部へと充填される。
これら、ボイド151やクラック状の空隙152が保護層110に存在することによって、これらのボイドや空隙を起点にクラックが拡大しやすくなり、ひいては貫通電極109の断線が生じやすくなり、結果的に半導体装置101の信頼性が低下することとなる。
すなわち、本発明の半導体装置は、一面に電極パッドを備えた半導体基板と、前記半導体基板の他面から一面まで貫通し、前記電極パッドを露呈する貫通孔と、前記電極パッドの露呈部及び前記貫通孔の側面を被覆し、前記電極パッドと電気的に接続された貫通電極と、前記貫通電極を被覆するとともに、前記貫通孔内を充填する保護層と、を備える半導体装置において、前記保護層は、複数層からなり、前記複数層の保護層のうち最も前記半導体基板の一面に近い層は、少なくとも前記貫通電極の底面と前記貫通電極の側面との交差部を被覆し、かつ、ポジ型感光性樹脂を用いて形成されることを特徴とする。
前記半導体基板の他面に光照射する工程Eと、少なくとも前記貫通電極の底面と前記貫通電極の側面との交差部に前記ポジ型感光性樹脂が残存するように、該ポジ型感光性樹脂を除去する工程Fと、次いで、前記貫通孔内に樹脂を充填する工程Gと、を備えることを特徴とする。
さらに、本発明の半導体装置の製造方法は、前記工程D〜工程Fを複数回繰り返してもよい。
は、少なくとも前記貫通電極の底面と側面との交差部を被覆し、かつ、ポジ型感光性樹脂を用いて形成されるという構成とした。これにより、貫通孔の内部に保護層が確実に充填された半導体装置を提供することができる。また、露光光が届きにくい貫通孔の底面の隅部にポジ型感光性樹脂を充填することになるので、貫通孔の内部の感光性樹脂が露光されないことによる問題を排除できる。ゆえに、成型後において樹脂クラック等の不具合の発生を抑制することができる半導体装置を提供することができる。
さらに、本発明の請求項3に係る半導体装置の製造方法によれば、上記ポジ型感光性樹脂の充填、光照射、樹脂除去の工程を複数回繰り返す構成とした。これにより、少しずつ貫通孔の内部に樹脂が充填されるため、より確実に貫通孔の内部に樹脂が充填され、充填不良が発生しにくくなる。
図1において、符号1は半導体装置、2は半導体基板、3は絶縁部、4は回路素子、5は電極パッド、6は貫通孔、7は絶縁層、8は再配線層、9は貫通電極、20は支持基板、21は接合樹脂を示している。
半導体基板2は、例えば、シリコンやGaAs等の半導体基板である。半導体基板2の厚さは、例えば数百μm程度である。半導体基板2の一面2aは絶縁部3をなしている。
回路素子4は、例えばメモリ、IC、撮像素子、MEMS素子などの半導体機能素子などである。
接合樹脂21としては、接着性及び電気絶縁性を有する材料からなるものが用いられる。例えば、ポリイミド樹脂、エポキシ樹脂、ベンゾシクロブタン(BCB)樹脂などが望ましい。
電極パッド5は、配線部19を介して、半導体基板2の一面2a側にある回路素子4と電気的に接続されている。配線部19は、半導体基板2の一面2a上に配され、電極パッド5や回路素子4等を電気的に接続して回路をなす。配線部19の材質としては、電極パッド5と同様の材質を用いればよく、AlやCu、アルミニウム−シリコン(Al−Si)合金、アルミニウム−シリコン−銅(Al−Si−Cu)合金等の導電性に優れる材料が好適である。
本実施形態に係る半導体装置1は、この保護層10が、少なくとも貫通孔6の内部に配され、ポジ型感光性樹脂からなる第一の層11、つまり保護層10のうち最も半導体基板2の一面2aに近い層と、ネガ型感光性樹脂からなる第二の層12とから構成されていることを特徴としている。ポジ型感光性樹脂とは、露光部が薬液により除去されるような感光性樹脂であり、ネガ型感光性樹脂とは、露光部以外が薬液により除去されるような感光性樹脂である。
第一の層11には、例えばポリイミド樹脂、シリコーン樹脂、エポキシ樹脂などの様々な樹脂材料を適用することができる。
第二の層12は、第一の層11を覆うように、貫通孔6の内部及び半導体基板2の他面2b側を被覆している。第二の層12は、少なくとも再配線層8の接続部が露呈されるようにパターニングされ、この接続部に半球状のはんだバンプ15が形成される。第二の層12には、ポジ型、ネガ型を問わず、どちらのタイプの感光性樹脂でも適用可能である。第二の層12には、例えば、ポリイミド樹脂、シリコーン樹脂、エポキシ樹脂などの様々な樹脂材料を用いることができる。
さらに、本実施形態に係る半導体装置1は、少なくとも貫通電極9の底面と側面の交差部を、ポジ型感光性樹脂からなる第一の層11で被覆した構成である。ポジ型感光性樹脂は、感光反応の大小に関わらず、所望の熱硬化処理を経た後においては安定した強度の樹脂層を得ることができる。ゆえに、光が届きにくい貫通孔内部において、少なくとも貫通電極9の底面と側面の交差部にポジ型感光性樹脂からなる第一の層11を配することによって、従来、貫通電極9の底面と側面の交差部において発生し易かった保護層10のクラック等の発生を抑制することができる。
(1)まず、回路素子4を備えた半導体基板2を用意し、半導体基板2の一面2aに電極パッド5及び配線部19を形成する(工程A)。
絶縁層7は、例えばSiO2をプラズマCVD等により成膜することで形成される。再配線層8及び貫通電極9の形成方法は、特に限定されるものではなく、例えばスパッタリング法、蒸着法、めっき法等、あるいはこれらの2つ以上の方法の組み合わせが挙げられる。また、再配線層8及び貫通電極9のパターニングには、フォトリソグラフィ技術が好適に用いられる。
ポジ型感光性樹脂11aは、容易に貫通孔6の内部まで樹脂が入り込むことができるように、低粘度の液状樹脂が好ましい。具体的には、粘度50〜300cPのポジ型感光性樹脂が適用できる。
ポジ型感光性樹脂11aの塗布方法としては、貫通孔6の内部まで樹脂が入り込むことができる方法が好ましい。例えばスピンコート塗布法、スプレー塗布法等が好ましい。その他、真空圧下でポジ型感光性11aを塗布した後、半導体基板2を大気圧環境下へ戻すことによって、貫通孔6の内部へ差圧充填する手法を採用することもできる。
次いで、この状態で熱処理を行い、ポジ型感光性樹脂の余分な感光基成分、溶剤成分等の揮発、及び熱硬化反応を生じさせる。
次いで、図2(d)に示すように、ネガ型感光性樹脂12aを塗布する。ネガ型感光性樹脂12aの塗布方法としては、スピンコート塗布法、フィルムラミネート法、スプレー塗布法等を採用することができる。更には、真空圧下でネガ型感光性樹脂12aを塗布した後、半導体基板2を大気圧環境下へ戻すことによって、貫通孔6の内部へ差圧充填する手法を採用することもできる。
次いで、図2(e)に示すように、ネガ型感光性樹脂12aを現像して不要な感光性樹脂を除去する。残した感光性樹脂12に対して、キュア、及びデスカムを施す。
最後に、はんだバンプ15を形成して、図1に示すような半導体装置1を得ることができる。
このように、ポジ型感光性樹脂11aの塗布、露光、感光性樹脂の除去を複数回繰り返し行うことによって、少しずつ貫通孔6の内部に樹脂が充填されるため、充填不良が発生しにくくなる。
図3は、本実施形態に係る半導体装置のその他の実施形態の一例を示す段面図である。なお、本実施形態では、上述した第1実施形態との相違点を中心に述べ、同様の部分についてはその説明を省略する。
この第三の層12bは、第一の層11b及び第二の層13bの両方の樹脂に対して接着性を有する材料によって形成されている。第三の層12bは樹脂に限らず、金属層であってもよい。このような構成にすることによって、第一の層11bと第二の層13bとの接着性が高くない場合に、第三の層12bを両層の間に介在させることによって、第一の層11bと第二の層13bとの接着性を高めることができる。
このように、複数の樹脂層で保護層10fを構成した場合、それぞれの層の目的に応じた機能を持たせることが可能となる。例えば、第一の層11f、第三の層13fには、貫通孔への充填が容易な材料を適用し、第二の層12fと第四の層14fには再配線を保護する保護膜としての機能や、パターン加工性に優れた材料を適用することができる。
6…貫通孔、7…絶縁層、8…再配線層、9…貫通電極、10…保護層、11…第一の層、12…第二の層、19…配線部。
Claims (3)
- 一面に電極パッドを備えた半導体基板と、
前記半導体基板の他面から一面まで貫通し、前記電極パッドを露呈する貫通孔と、
前記電極パッドの露呈部及び前記貫通孔の側面を被覆し、前記電極パッドと電気的に接続された貫通電極と、
前記貫通電極を被覆するとともに、前記貫通孔内を充填する保護層と、
を備える半導体装置において、
前記保護層は、複数層からなり、
前記複数層の保護層のうち最も前記半導体基板の一面に近い層は、少なくとも前記貫通電極の底面と側面の交差部を被覆し、かつ、ポジ型感光性樹脂を用いて形成されることを特徴とする半導体装置。 - 半導体基板の一面に電極パッドを形成する工程Aと、
前記半導体基板の他面から一面にかけて貫通する貫通孔を形成し、前記電極パッドを露呈する工程Bと、
前記電極パッドの露呈部及び前記貫通孔の側面を被覆する貫通電極を形成する工程Cと、
ポジ型感光性樹脂を用いて前記貫通電極を被覆する工程Dと、
前記半導体基板の他面に光照射する工程Eと、
少なくとも前記貫通電極の底面と側面の交差部に前記ポジ型感光性樹脂が残存するように、該ポジ型感光性樹脂を除去する工程Fと、
次いで、前記貫通孔内に樹脂を充填する工程Gと、
を備える半導体装置の製造方法。 - 前記工程D〜工程Fを複数回繰り返すことを特徴とする請求項2に記載の半導体装置の製造方法。
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Cited By (6)
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JP2014212183A (ja) * | 2013-04-18 | 2014-11-13 | 大日本印刷株式会社 | 貫通電極基板の製造方法、貫通電極基板、および半導体装置 |
JP2016082230A (ja) * | 2014-10-13 | 2016-05-16 | ゼネラル・エレクトリック・カンパニイ | ワイヤボンドを有するパワーオーバーレイ構造体およびその製造方法 |
JP2018533225A (ja) * | 2015-10-10 | 2018-11-08 | チャイナ ウェイファー レベル シーエスピー カンパニー リミテッド | イメージセンシングチップのパッケージ化方法及びパッケージ構造 |
WO2019069669A1 (ja) * | 2017-10-02 | 2019-04-11 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、半導体装置の製造方法、及び、電子機器 |
JP2020202353A (ja) * | 2019-06-13 | 2020-12-17 | キヤノン株式会社 | 半導体装置およびその製造方法 |
JP7354885B2 (ja) | 2020-03-12 | 2023-10-03 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
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JP2014212183A (ja) * | 2013-04-18 | 2014-11-13 | 大日本印刷株式会社 | 貫通電極基板の製造方法、貫通電極基板、および半導体装置 |
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