JP2011216529A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP2011216529A
JP2011216529A JP2010080509A JP2010080509A JP2011216529A JP 2011216529 A JP2011216529 A JP 2011216529A JP 2010080509 A JP2010080509 A JP 2010080509A JP 2010080509 A JP2010080509 A JP 2010080509A JP 2011216529 A JP2011216529 A JP 2011216529A
Authority
JP
Japan
Prior art keywords
semiconductor chip
dicing
semiconductor
wafer
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010080509A
Other languages
English (en)
Japanese (ja)
Inventor
Kazutaka Tatebe
一貴 建部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2010080509A priority Critical patent/JP2011216529A/ja
Priority to CN201180015691.7A priority patent/CN102822946B/zh
Priority to PCT/JP2011/056890 priority patent/WO2011125492A1/ja
Priority to KR1020127025603A priority patent/KR20130009799A/ko
Priority to TW100110675A priority patent/TWI427691B/zh
Publication of JP2011216529A publication Critical patent/JP2011216529A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP2010080509A 2010-03-31 2010-03-31 半導体装置の製造方法 Pending JP2011216529A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010080509A JP2011216529A (ja) 2010-03-31 2010-03-31 半導体装置の製造方法
CN201180015691.7A CN102822946B (zh) 2010-03-31 2011-03-23 半导体装置的制造方法
PCT/JP2011/056890 WO2011125492A1 (ja) 2010-03-31 2011-03-23 半導体装置の製造方法
KR1020127025603A KR20130009799A (ko) 2010-03-31 2011-03-23 반도체 장치의 제조 방법
TW100110675A TWI427691B (zh) 2010-03-31 2011-03-29 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010080509A JP2011216529A (ja) 2010-03-31 2010-03-31 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JP2011216529A true JP2011216529A (ja) 2011-10-27

Family

ID=44762446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010080509A Pending JP2011216529A (ja) 2010-03-31 2010-03-31 半導体装置の製造方法

Country Status (5)

Country Link
JP (1) JP2011216529A (ko)
KR (1) KR20130009799A (ko)
CN (1) CN102822946B (ko)
TW (1) TWI427691B (ko)
WO (1) WO2011125492A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013214739A (ja) * 2012-03-30 2013-10-17 Vesi Switzerland Ag 金属箔から半導体チップを剥離する方法
WO2023100831A1 (ja) * 2021-11-30 2023-06-08 ボンドテック株式会社 チップ周部剥離装置、チップ供給装置、チップ供給システム、チップ接合システム、ピックアップ装置、チップ周部剥離方法、チップ供給方法、チップ接合方法およびピックアップ方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
JP2013191781A (ja) * 2012-03-14 2013-09-26 Fuji Electric Co Ltd 半導体製造装置および半導体製造装置の制御方法
JP6785162B2 (ja) * 2017-01-12 2020-11-18 株式会社ディスコ 分割装置
KR102371543B1 (ko) * 2017-05-12 2022-03-07 세메스 주식회사 다이 픽업을 위한 정렬 좌표 설정 방법 및 이를 이용하는 다이 픽업 방법
CN109256354B (zh) * 2017-07-14 2021-01-12 财团法人工业技术研究院 转移支撑件及转移模块
JP2019029650A (ja) * 2017-07-26 2019-02-21 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置、半導体チップの実装装置および実装方法
US20220293554A1 (en) 2019-08-26 2022-09-15 Lintec Corporation Method of manufacturing laminate
JP2022034947A (ja) * 2020-08-19 2022-03-04 キオクシア株式会社 半導体装置およびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322741A (ja) * 1986-06-13 1988-01-30 アウデイ　アクチエンゲゼルシヤフト 特殊目的に使用される自動車
JP2005327970A (ja) * 2004-05-17 2005-11-24 Matsushita Electric Ind Co Ltd 部品突上げ装置、部品実装装置、及び部品突上げ方法
JP2007042996A (ja) * 2005-08-05 2007-02-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP2007115934A (ja) * 2005-10-21 2007-05-10 Matsushita Electric Ind Co Ltd 電子部品突き上げ装置及び電子部品の供給方法
JP2009188157A (ja) * 2008-02-06 2009-08-20 Panasonic Corp チップ剥離装置およびチップ剥離方法ならびにチップピックアップ装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050670A (ja) * 2000-08-04 2002-02-15 Toshiba Corp ピックアップ装置及びピックアップ方法
JP2003264203A (ja) * 2002-03-11 2003-09-19 Hitachi Ltd 半導体装置の製造方法
TWI225279B (en) * 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
MY151354A (en) * 2007-10-09 2014-05-15 Hitachi Chemical Co Ltd Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322741A (ja) * 1986-06-13 1988-01-30 アウデイ　アクチエンゲゼルシヤフト 特殊目的に使用される自動車
JP2005327970A (ja) * 2004-05-17 2005-11-24 Matsushita Electric Ind Co Ltd 部品突上げ装置、部品実装装置、及び部品突上げ方法
JP2007042996A (ja) * 2005-08-05 2007-02-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP2007115934A (ja) * 2005-10-21 2007-05-10 Matsushita Electric Ind Co Ltd 電子部品突き上げ装置及び電子部品の供給方法
JP2009188157A (ja) * 2008-02-06 2009-08-20 Panasonic Corp チップ剥離装置およびチップ剥離方法ならびにチップピックアップ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013214739A (ja) * 2012-03-30 2013-10-17 Vesi Switzerland Ag 金属箔から半導体チップを剥離する方法
WO2023100831A1 (ja) * 2021-11-30 2023-06-08 ボンドテック株式会社 チップ周部剥離装置、チップ供給装置、チップ供給システム、チップ接合システム、ピックアップ装置、チップ周部剥離方法、チップ供給方法、チップ接合方法およびピックアップ方法

Also Published As

Publication number Publication date
CN102822946A (zh) 2012-12-12
WO2011125492A1 (ja) 2011-10-13
KR20130009799A (ko) 2013-01-23
TWI427691B (zh) 2014-02-21
TW201207922A (en) 2012-02-16
CN102822946B (zh) 2015-06-03

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