JP2011192667A - トランジスタおよびその製造方法 - Google Patents
トランジスタおよびその製造方法 Download PDFInfo
- Publication number
- JP2011192667A JP2011192667A JP2010054853A JP2010054853A JP2011192667A JP 2011192667 A JP2011192667 A JP 2011192667A JP 2010054853 A JP2010054853 A JP 2010054853A JP 2010054853 A JP2010054853 A JP 2010054853A JP 2011192667 A JP2011192667 A JP 2011192667A
- Authority
- JP
- Japan
- Prior art keywords
- region
- graphene film
- film
- gate electrode
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 94
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 93
- 239000004065 semiconductor Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims description 30
- 125000004429 atom Chemical group 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 23
- 239000012212 insulator Substances 0.000 description 33
- 230000003647 oxidation Effects 0.000 description 16
- 238000007254 oxidation reaction Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 16
- 239000002184 metal Substances 0.000 description 14
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910004541 SiN Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002074 nanoribbon Substances 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1606—Graphene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0895—Tunnel injectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7391—Gated diode structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7781—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with inverted single heterostructure, i.e. with active layer formed on top of wide bandgap layer, e.g. IHEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7839—Field effect transistors with field effect produced by an insulated gate with Schottky drain or source contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78684—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
Abstract
【解決手段】本発明の一態様に係るトランジスタ100は、導体領域10aと表面に原子が結合した半導体領域10bとを有し、チャネルとして機能するグラフェン膜10と、グラフェン膜10上にゲート絶縁膜11を介して形成されたゲート電極12と、を有し、導体領域10aと半導体領域10bが形成するショットキー接合のトンネル電流をスイッチング動作に用いる。
【選択図】図1
Description
(半導体装置の構成)
図1は、本発明の第1の実施の形態に係るトランジスタ100の断面図である。トランジスタ100は、ショットキーバリアを通過するトンネル電流をスイッチング動作に利用する。
図4A(a)〜(d)、図4B(e)、(f)は、本発明の第1の実施の形態に係るトランジスタ100の製造工程を示す断面図である。
本発明の第1の実施の形態によれば、グラフェン膜10の導体領域10aと半導体領域10bのショットキー接合をスイッチング動作に利用することにより、トランジスタ100は高い電流駆動力と高いカットオフ特性を発揮することができる。
第2の実施の形態は、半導体領域10bの代わりに絶縁体領域が形成される点、ならびに導体領域10a、10cの代わりに半導体領域が形成される点において第1の実施の形態と異なる。なお、第1の実施の形態と同様の点については、説明を省略または簡略化する。
図5は、本発明の第2の実施の形態に係るトランジスタ200の断面図である。トランジスタ200は、絶縁体領域のバンドギャップを通過するダイレクトトンネル電流をスイッチング動作に利用する。
本発明の第2の実施の形態によれば、導体領域20aのエネルギーレベルと導体領域20cのエネルギーレベルとの段差と、絶縁体領域20bのバンドギャップをスイッチング動作に利用することにより、トランジスタ200は高い電流駆動力と高いカットオフ特性を発揮することができる。
本発明は、上記各実施の形態に限定されず、発明の主旨を逸脱しない範囲内において種々変形実施が可能である。
Claims (5)
- 導体的性質を有する第1の領域と、前記第1の領域のドレイン側に隣接し、表面に原子が結合して半導体的性質を有する第2の領域とを有し、前記第1の領域と前記第2の領域がショットキー接合を形成する、チャネルとして機能するグラフェン膜と、
前記グラフェン膜上にゲート絶縁膜を介して形成されたゲート電極と、
を有するトランジスタ。 - 半導体的性質を有する第1の領域と、前記第1の領域のドレイン側に隣接し、表面に原子が結合して絶縁体的性質を有する第2の領域と、前記第2の領域のドレイン側に隣接する半導体的性質を有する第3の領域とを有する、チャネルとして機能するグラフェン膜と、
前記第3の領域の材料よりも仕事関数が小さい材料からなる、前記グラフェン膜上にゲート絶縁膜を介して形成されたゲート電極と、
を有するトランジスタ。 - 前記第2の領域のソース側端部は、前記ゲート電極のソース側端部の直下、または前記ゲート電極の前記ソース側端部よりもソース側にあり、
前記第2の領域のドレイン側端部は、前記ゲート電極の前記ソース側端部の直下、または前記ゲート電極の前記ソース側端部よりもドレイン側にある、
請求項1または2に記載のトランジスタ。 - 前記原子は、酸素原子、窒素原子、水素原子の少なくともいずれか1つを含む、
請求項1〜3のいずれか1つに記載のトランジスタ。 - グラフェン膜の一部に改質処理を施して表面に原子を結合させ、前記グラフェン膜をソース側の領域とドレイン側の領域に分断する改質領域を形成する工程と、
前記グラフェン膜上にゲート絶縁膜を介してゲート電極を形成する工程と、
前記グラフェン膜の前記ソース側の領域および前記ドレイン側の領域に、それぞれソース電極およびドレイン電極を接続する工程と、
を含むトランジスタの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010054853A JP2011192667A (ja) | 2010-03-11 | 2010-03-11 | トランジスタおよびその製造方法 |
US13/044,727 US20110220865A1 (en) | 2010-03-11 | 2011-03-10 | Transistor and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010054853A JP2011192667A (ja) | 2010-03-11 | 2010-03-11 | トランジスタおよびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011192667A true JP2011192667A (ja) | 2011-09-29 |
Family
ID=44559073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010054853A Pending JP2011192667A (ja) | 2010-03-11 | 2010-03-11 | トランジスタおよびその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110220865A1 (ja) |
JP (1) | JP2011192667A (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013046073A (ja) * | 2011-08-26 | 2013-03-04 | Samsung Electronics Co Ltd | チューナブルバリアを備えるグラフェンスイッチング素子 |
JP2013222972A (ja) * | 2012-04-18 | 2013-10-28 | Samsung Electronics Co Ltd | チューナブルバリアを備えたグラフェンスイッチング素子 |
CN103715259A (zh) * | 2012-10-09 | 2014-04-09 | 三星电子株式会社 | 包括石墨烯沟道的隧穿场效应晶体管 |
JP2014204122A (ja) * | 2013-04-09 | 2014-10-27 | アイメックImec | グラフェン系の電界効果トランジスタ |
JP2015191975A (ja) * | 2014-03-27 | 2015-11-02 | 富士通株式会社 | 電子デバイス及びその製造方法 |
JP2016076542A (ja) * | 2014-10-03 | 2016-05-12 | 富士通株式会社 | 電子装置及び電子装置の製造方法 |
KR20170059976A (ko) * | 2014-09-26 | 2017-05-31 | 인텔 코포레이션 | 금속 옥사이드 금속 전계 효과 트랜지스터들(momfets) |
US9741859B2 (en) | 2014-09-05 | 2017-08-22 | Sumitomo Electric Industries, Ltd. | Semiconductor device with graphene layer as channel |
US10217823B2 (en) | 2016-12-14 | 2019-02-26 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5439120B2 (ja) * | 2009-11-02 | 2014-03-12 | 株式会社東芝 | 半導体装置およびその製造方法 |
KR101715355B1 (ko) | 2010-11-30 | 2017-03-13 | 삼성전자주식회사 | 그래핀 전자 소자 |
US8969154B2 (en) | 2011-08-23 | 2015-03-03 | Micron Technology, Inc. | Methods for fabricating semiconductor device structures and arrays of vertical transistor devices |
KR101217216B1 (ko) * | 2011-08-31 | 2012-12-31 | 서울대학교산학협력단 | 전자 소자 및 그 제조 방법 |
US8633055B2 (en) | 2011-12-13 | 2014-01-21 | International Business Machines Corporation | Graphene field effect transistor |
KR101910976B1 (ko) | 2012-07-16 | 2018-10-23 | 삼성전자주식회사 | 그래핀을 이용한 전계효과 트랜지스터 |
KR101919420B1 (ko) * | 2012-10-08 | 2019-02-08 | 삼성전자주식회사 | 그래핀 스위칭 소자를 이용한 메모리 어레이 |
KR101910579B1 (ko) * | 2012-10-29 | 2018-10-22 | 삼성전자주식회사 | 튜너블 배리어를 구비한 그래핀 스위칭 소자 |
WO2014076613A1 (en) * | 2012-11-14 | 2014-05-22 | Koninklijke Philips N.V. | Method for patterning of graphene and graphene like materials |
US9373685B2 (en) | 2013-02-15 | 2016-06-21 | Samsung Electronics Co., Ltd. | Graphene device and electronic apparatus |
FI20145408A (fi) * | 2014-05-05 | 2015-11-06 | Jyväskylän Yliopisto | Menetelmä hiilinanomateriaalikappaleen kuvioimiseksi sekä prosessoitu hiilinanomateriaalikappale |
US9812604B2 (en) * | 2014-05-30 | 2017-11-07 | Klaus Y. J. Hsu | Photosensing device with graphene |
CN104022017B (zh) * | 2014-06-10 | 2017-05-10 | 京东方科技集团股份有限公司 | 一种石墨烯图案化的方法及显示基板的制作方法 |
KR102237826B1 (ko) | 2014-07-18 | 2021-04-08 | 삼성전자주식회사 | 그래핀 소자와 그 제조 및 동작방법과 그래핀 소자를 포함하는 전자장치 |
KR102266615B1 (ko) | 2014-11-17 | 2021-06-21 | 삼성전자주식회사 | 전계 효과 트랜지스터를 포함하는 반도체 소자 및 그 제조 방법 |
US10261139B2 (en) * | 2016-02-19 | 2019-04-16 | The United States Of America, As Represented By The Secretary Of The Navy | Method of making a magnetic field sensor |
US10038060B2 (en) * | 2016-05-19 | 2018-07-31 | Qualcomm Incorporated | Graphene NMOS transistor using nitrogen dioxide chemical adsorption |
KR102651544B1 (ko) * | 2016-11-21 | 2024-03-28 | 삼성전자주식회사 | 광대역 다기능 광학소자와 그 제조 및 동작방법 |
CN106842732A (zh) * | 2017-04-18 | 2017-06-13 | 京东方科技集团股份有限公司 | 石墨烯电极及其制备方法、显示面板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008023669A1 (fr) * | 2006-08-21 | 2008-02-28 | Fujitsu Limited | Nanomatériau carboné semi-conducteur du type n, son procédé de production et procédé de fabrication d'un dispositif semi-conducteur |
WO2008108383A1 (ja) * | 2007-03-02 | 2008-09-12 | Nec Corporation | グラフェンを用いる半導体装置及びその製造方法 |
JP2009094190A (ja) * | 2007-10-05 | 2009-04-30 | Fujitsu Ltd | 半導体装置 |
JP2009277803A (ja) * | 2008-05-13 | 2009-11-26 | Fujitsu Ltd | 半導体装置、半導体装置の製造方法およびトランジスタ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090174435A1 (en) * | 2007-10-01 | 2009-07-09 | University Of Virginia | Monolithically-Integrated Graphene-Nano-Ribbon (GNR) Devices, Interconnects and Circuits |
US8173095B2 (en) * | 2008-03-18 | 2012-05-08 | Georgia Tech Research Corporation | Method and apparatus for producing graphene oxide layers on an insulating substrate |
JP5544796B2 (ja) * | 2009-09-10 | 2014-07-09 | ソニー株式会社 | 3端子型電子デバイス及び2端子型電子デバイス |
US8106383B2 (en) * | 2009-11-13 | 2012-01-31 | International Business Machines Corporation | Self-aligned graphene transistor |
-
2010
- 2010-03-11 JP JP2010054853A patent/JP2011192667A/ja active Pending
-
2011
- 2011-03-10 US US13/044,727 patent/US20110220865A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008023669A1 (fr) * | 2006-08-21 | 2008-02-28 | Fujitsu Limited | Nanomatériau carboné semi-conducteur du type n, son procédé de production et procédé de fabrication d'un dispositif semi-conducteur |
WO2008108383A1 (ja) * | 2007-03-02 | 2008-09-12 | Nec Corporation | グラフェンを用いる半導体装置及びその製造方法 |
JP2009094190A (ja) * | 2007-10-05 | 2009-04-30 | Fujitsu Ltd | 半導体装置 |
JP2009277803A (ja) * | 2008-05-13 | 2009-11-26 | Fujitsu Ltd | 半導体装置、半導体装置の製造方法およびトランジスタ |
Non-Patent Citations (2)
Title |
---|
JPN6012041284; Q.Zhang et al.: 'Graphene nanoribbon tunnel transistors' IEEE Electron Device Letters vol.29, 200812, pp.1344-1346 * |
JPN7012003211; M.Luisier and G.Klimeck: 'Performance analysis of statistical samples of graphene nanoribbon tunneling transistors with line e' Applied Physics Letters vol.94, 20090602, art.223505 * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013046073A (ja) * | 2011-08-26 | 2013-03-04 | Samsung Electronics Co Ltd | チューナブルバリアを備えるグラフェンスイッチング素子 |
JP2013222972A (ja) * | 2012-04-18 | 2013-10-28 | Samsung Electronics Co Ltd | チューナブルバリアを備えたグラフェンスイッチング素子 |
CN103715259A (zh) * | 2012-10-09 | 2014-04-09 | 三星电子株式会社 | 包括石墨烯沟道的隧穿场效应晶体管 |
CN103715259B (zh) * | 2012-10-09 | 2017-12-29 | 三星电子株式会社 | 包括石墨烯沟道的隧穿场效应晶体管 |
JP2014204122A (ja) * | 2013-04-09 | 2014-10-27 | アイメックImec | グラフェン系の電界効果トランジスタ |
JP2015191975A (ja) * | 2014-03-27 | 2015-11-02 | 富士通株式会社 | 電子デバイス及びその製造方法 |
US9741859B2 (en) | 2014-09-05 | 2017-08-22 | Sumitomo Electric Industries, Ltd. | Semiconductor device with graphene layer as channel |
KR20170059976A (ko) * | 2014-09-26 | 2017-05-31 | 인텔 코포레이션 | 금속 옥사이드 금속 전계 효과 트랜지스터들(momfets) |
KR102353662B1 (ko) | 2014-09-26 | 2022-01-21 | 인텔 코포레이션 | 금속 옥사이드 금속 전계 효과 트랜지스터들(momfets) |
JP2016076542A (ja) * | 2014-10-03 | 2016-05-12 | 富士通株式会社 | 電子装置及び電子装置の製造方法 |
US10217823B2 (en) | 2016-12-14 | 2019-02-26 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US20110220865A1 (en) | 2011-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2011192667A (ja) | トランジスタおよびその製造方法 | |
US9431520B2 (en) | Graphene nanoribbons and carbon nanotubes fabricated from SiC fins or nanowire templates | |
TWI514568B (zh) | 增強模式氮化鎵高電子遷移率電晶體元件及其製造方法 | |
JP2011198938A (ja) | トランジスタ | |
US7791108B2 (en) | Nanowire tunneling transistor | |
JP6078218B2 (ja) | 薄膜トランジスタ及びその製造方法 | |
JP6043022B2 (ja) | 半導電性グラフェン構造、このような構造の形成方法およびこのような構造を含む半導体デバイス | |
JP5513955B2 (ja) | 半導体装置およびその製造方法 | |
US8134142B2 (en) | Tunneling transistor with barrier | |
JP2006114912A (ja) | キャリヤトラッピング物質を含む単極性ナノチューブトランジスタ及びその製造方法 | |
US20110233513A1 (en) | Enhanced bonding interfaces on carbon-based materials for nanoelectronic devices | |
JP2009238955A (ja) | 半導体基板、半導体装置、および半導体装置の製造方法 | |
KR101919426B1 (ko) | 그래핀 전자 소자 및 그 제조 방법 | |
US7511344B2 (en) | Field effect transistor | |
JP2008543052A (ja) | 超格子誘電界面層を有する半導体素子 | |
TW201919109A (zh) | 半導體元件的製造方法 | |
JP2009094190A (ja) | 半導体装置 | |
US8658461B2 (en) | Self aligned carbide source/drain FET | |
JP2008235752A (ja) | 半導体装置およびその製造方法 | |
Kim et al. | Electrostatically transparent graphene quantum-dot trap layers for efficient nonvolatile memory | |
JP2013004718A (ja) | 半導体装置及びその製造方法 | |
CN112599590A (zh) | 半导体结构 | |
JP2009536463A (ja) | 超格子チャネルを有する浮遊ゲートメモリセルを含む半導体素子及び関連方法 | |
CN108140672A (zh) | 一种隧穿场效应晶体管及其制作方法 | |
JP2023015378A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20110627 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20110628 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20110629 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20110630 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120215 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120814 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130104 |