JP2011151114A5 - - Google Patents
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- Publication number
- JP2011151114A5 JP2011151114A5 JP2010009979A JP2010009979A JP2011151114A5 JP 2011151114 A5 JP2011151114 A5 JP 2011151114A5 JP 2010009979 A JP2010009979 A JP 2010009979A JP 2010009979 A JP2010009979 A JP 2010009979A JP 2011151114 A5 JP2011151114 A5 JP 2011151114A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- pattern
- repairing
- heating
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 44
- 229910052710 silicon Inorganic materials 0.000 claims description 44
- 239000010703 silicon Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 229940070337 ammonium silicofluoride Drugs 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010009979A JP5629098B2 (ja) | 2010-01-20 | 2010-01-20 | シリコン基板上のパターン修復方法 |
| CN2011100253660A CN102140638A (zh) | 2010-01-20 | 2011-01-19 | 硅基板上的图案修复方法和硅基板上的图案修复装置 |
| TW100101954A TWI534857B (zh) | 2010-01-20 | 2011-01-19 | Method of Pattern Repair on Silicon Substrate |
| KR1020110005479A KR20110085929A (ko) | 2010-01-20 | 2011-01-19 | 실리콘 기판상의 패턴 복구 방법 및 장치 |
| EP11151363.6A EP2348524B1 (en) | 2010-01-20 | 2011-01-19 | Method for recovering pattern on silicon substrate |
| US13/010,203 US20110174337A1 (en) | 2010-01-20 | 2011-01-20 | Method and apparatus for recovering pattern on silicon substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010009979A JP5629098B2 (ja) | 2010-01-20 | 2010-01-20 | シリコン基板上のパターン修復方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011151114A JP2011151114A (ja) | 2011-08-04 |
| JP2011151114A5 true JP2011151114A5 (enExample) | 2013-03-07 |
| JP5629098B2 JP5629098B2 (ja) | 2014-11-19 |
Family
ID=44022937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010009979A Active JP5629098B2 (ja) | 2010-01-20 | 2010-01-20 | シリコン基板上のパターン修復方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110174337A1 (enExample) |
| EP (1) | EP2348524B1 (enExample) |
| JP (1) | JP5629098B2 (enExample) |
| KR (1) | KR20110085929A (enExample) |
| CN (1) | CN102140638A (enExample) |
| TW (1) | TWI534857B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8440573B2 (en) * | 2010-01-26 | 2013-05-14 | Lam Research Corporation | Method and apparatus for pattern collapse free wet processing of semiconductor devices |
| CN105990096B (zh) * | 2015-02-15 | 2020-03-27 | 盛美半导体设备(上海)股份有限公司 | 半导体结构的清洗方法 |
| JP6533576B2 (ja) | 2015-07-13 | 2019-06-19 | 富士フイルム株式会社 | パターン構造の処理方法、電子デバイスの製造方法およびパターン構造の倒壊抑制用処理液 |
| JP6466315B2 (ja) * | 2015-12-25 | 2019-02-06 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| JP6875811B2 (ja) | 2016-09-16 | 2021-05-26 | 株式会社Screenホールディングス | パターン倒壊回復方法、基板処理方法および基板処理装置 |
| JP2021022598A (ja) * | 2019-07-24 | 2021-02-18 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び配線パターン形成システム |
| JP7130791B2 (ja) * | 2021-02-08 | 2022-09-05 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0319217A (ja) * | 1989-06-15 | 1991-01-28 | Nec Corp | 微細パターン形成方法 |
| US5017998A (en) * | 1989-09-14 | 1991-05-21 | Fujitsu Limited | Semiconductor device using SOI substrate |
| JP2632262B2 (ja) | 1991-08-20 | 1997-07-23 | 大日本スクリーン製造株式会社 | シリコンウエハ上のコンタクトホール内の自然酸化膜の除去方法 |
| JPH05129263A (ja) * | 1991-11-01 | 1993-05-25 | Kawasaki Steel Corp | 半導体基板の処理方法 |
| JPH05326478A (ja) * | 1992-05-26 | 1993-12-10 | Nippon Steel Corp | ウェーハの洗浄方法およびその装置 |
| JPH08264507A (ja) | 1995-03-20 | 1996-10-11 | Matsushita Electron Corp | シリコンのエッチング方法 |
| JPH11340183A (ja) | 1998-05-27 | 1999-12-10 | Morita Kagaku Kogyo Kk | 半導体装置用洗浄液およびそれを用いた半導体装置の製 造方法 |
| KR100486690B1 (ko) * | 2002-11-29 | 2005-05-03 | 삼성전자주식회사 | 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법 |
| US7877161B2 (en) * | 2003-03-17 | 2011-01-25 | Tokyo Electron Limited | Method and system for performing a chemical oxide removal process |
| US7094613B2 (en) * | 2003-10-21 | 2006-08-22 | Applied Materials, Inc. | Method for controlling accuracy and repeatability of an etch process |
| KR100542464B1 (ko) * | 2003-11-20 | 2006-01-11 | 학교법인 한양학원 | 원자력간 현미경 리소그래피 기술을 이용한 극자외선 노광공정용 반사형 다층 박막 미러의 제조방법 |
| CN101156233B (zh) * | 2005-03-31 | 2010-12-08 | 东京毅力科创株式会社 | 氧化硅膜的制造方法和等离子体处理装置 |
| JP5319868B2 (ja) * | 2005-10-17 | 2013-10-16 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US20070224811A1 (en) * | 2006-03-16 | 2007-09-27 | Xinming Wang | Substrate processing method and substrate processing apparatus |
| JP2007311540A (ja) * | 2006-05-18 | 2007-11-29 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP5233097B2 (ja) * | 2006-08-15 | 2013-07-10 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記憶媒体 |
| US20080045030A1 (en) * | 2006-08-15 | 2008-02-21 | Shigeru Tahara | Substrate processing method, substrate processing system and storage medium |
| JP4961894B2 (ja) * | 2006-08-25 | 2012-06-27 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| US20080085090A1 (en) * | 2006-10-10 | 2008-04-10 | Meek David W | Crimp and crimp mechanism for fiber optic connector |
| JP5204964B2 (ja) * | 2006-10-17 | 2013-06-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2008186865A (ja) * | 2007-01-26 | 2008-08-14 | Tokyo Electron Ltd | 基板処理装置 |
| JP4818140B2 (ja) * | 2007-01-31 | 2011-11-16 | 東京エレクトロン株式会社 | 基板の処理方法及び基板処理装置 |
| JP4776575B2 (ja) * | 2007-03-28 | 2011-09-21 | 株式会社東芝 | 表面処理方法、エッチング処理方法および電子デバイスの製造方法 |
| JP5374039B2 (ja) * | 2007-12-27 | 2013-12-25 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記憶媒体 |
-
2010
- 2010-01-20 JP JP2010009979A patent/JP5629098B2/ja active Active
-
2011
- 2011-01-19 KR KR1020110005479A patent/KR20110085929A/ko not_active Ceased
- 2011-01-19 EP EP11151363.6A patent/EP2348524B1/en active Active
- 2011-01-19 TW TW100101954A patent/TWI534857B/zh active
- 2011-01-19 CN CN2011100253660A patent/CN102140638A/zh active Pending
- 2011-01-20 US US13/010,203 patent/US20110174337A1/en not_active Abandoned
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