JP2011108869A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2011108869A JP2011108869A JP2009262761A JP2009262761A JP2011108869A JP 2011108869 A JP2011108869 A JP 2011108869A JP 2009262761 A JP2009262761 A JP 2009262761A JP 2009262761 A JP2009262761 A JP 2009262761A JP 2011108869 A JP2011108869 A JP 2011108869A
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Abstract
【解決手段】半導体基板1の上方に、層間絶縁膜11、21等を介在させて形成された外部接続用電極を備えている。外部接続用電極は、上面を露出するパッドメタル層8と、該パッドメタル層8と半導体基板1との間に形成された第1のメタル層2と、層間絶縁膜21を貫通してパッドメタル層8と第1のメタル層2とを電気的に接続し、且つ、層間絶縁膜21に形成された少なくとも2つの第1のビア22とを有している。第1のビア22同士の最大の間隔bは、パッドメタル層8の幅寸法aよりも大きい。
【選択図】図1
Description
また、半導体パッケージの組立後においても、マザーボードへの実装工程において、リフロー後の冷却プロセス(例えば、240℃〜260℃から20℃〜30℃までの冷却)において、引張方向に対して大きな熱応力がボンディングパッド107に発生し、上述したのと同様に、脆弱な層間絶縁膜102又は層間絶縁膜103を起点として破壊又は剥離が発生するという問題がある。
また、本発明の半導体装置が第2のビアを有する場合に、第2のビアは、2次元的に且つ3つ以上設けられていてもよい。
本発明の第1の実施形態に係る半導体装置ついて図面を参照しながら説明する。
図2に第1の実施形態の第1変形例に係る半導体装置を示す。図2(a)に示すように、パッドメタル層8及びその下の各メタル層2、3、4、5及び6がいずれも平面八角形状の構成であり、且つ各ビア22及び32等は八角形の各頂点付近に設けられている。このような構成でも、パッドメタル8の幅寸法aよりも、メタル2の上のビア22の最大間隔bの方が大きいため、第1の実施形態と同様の効果を得ることができる。
図2(b)に示すように、第2変形例に係る半導体装置は、パッドメタル層8の平面形状が八角形であり、その下の各メタル層2、3、4、5及び6の平面形状が四角形である。この構成では、ビア22の最大間隔bがパッドメタル層8の幅寸法aよりも大きく、その差は図2(a)の第1変形例の場合よりも大きいため、極めて誘電率が低い膜(例えば2.2等)に効果的に適用可能である。
以下、本発明の第2の実施形態に係る半導体装置ついて図面を参照しながら説明する。
以下、本発明の第3の実施形態に係る半導体装置ついて図面を参照しながら説明する。
以下、本発明の第4の実施形態に係る半導体装置ついて図面を参照しながら説明する。
2 メタル層
3 メタル層
4 メタル層
5 メタル層
6 メタル層
7 メタル層
8 パッドメタル層
11 層間絶縁膜
21 層間絶縁膜
31 層間絶縁膜
41 層間絶縁膜
51 層間絶縁膜
61 層間絶縁膜
22 ビア
32 ビア
42 ビア
52 ビア
62 ビア
a パッドメタル層の寸法
b ビアの最大間隔
c ビアの最大間隔
Claims (12)
- 半導体基板の上に、少なくとも2層の層間絶縁膜を介在させて形成された外部接続用電極を備え、
前記外部接続用電極は、
上面を露出する第1のメタル層と、
前記第1のメタル層と前記半導体基板との間に形成された第2のメタル層と、
前記第1のメタル層と前記第2のメタル層との間に形成された第3のメタル層と、
前記第2のメタル層と前記第3のメタル層との間の第1の層間絶縁膜を貫通して、前記第2のメタル層と前記第3のメタル層とを電気的に接続する少なくとも2つの第1のビアとを有し、
前記第1のビア同士の最大の間隔は、前記第1のメタル層の幅寸法よりも大きいことを特徴とする半導体装置。 - 前記外部接続用電極は、
前記第1のメタル層と前記第3のメタル層との間の第2の層間絶縁膜を貫通して、前記第1のメタル層と前記第3のメタル層とを電気的に接続する少なくとも2つの第2のビアをさらに有し、
前記第1のビア同士の最大の間隔は、前記第2のビア同士の最大の間隔よりも大きいことを特徴とする請求項1に記載の半導体装置。 - 前記第1の層間絶縁膜の誘電率は、前記第2の層間絶縁膜の誘電率よりも低いことを特徴とする請求項2に記載の半導体装置。
- 前記第1の層間絶縁膜の厚さは、前記第2の層間絶縁膜の厚さ以上であることを特徴とする請求項3に記載の半導体装置。
- 前記第1の層間絶縁膜の厚さは、前記第2の層間絶縁膜の厚さ以下であることを特徴とする請求項3に記載の半導体装置。
- 前記第2のビアは、2次元的に且つ3つ以上設けられていることを特徴とする請求項2に記載の半導体装置。
- 前記第1のメタル層にはビアが直接に設けられていないことを特徴とする請求項1に記載の半導体装置。
- 半導体基板の上に、少なくとも2層の層間絶縁膜を介在させて形成された外部接続用電極を備え、
前記外部接続用電極は、
上面を露出する第1のメタル層と、
前記第1のメタル層と前記半導体基板との間に形成された第2のメタル層と、
前記第1のメタル層と前記第2のメタル層との間に形成された第3のメタル層と、
前記第1のメタル層と前記第3のメタル層との間に形成された第4のメタル層と、
前記第3のメタル層と前記第2のメタル層との間に形成された第5のメタル層と、
前記第5のメタル層と前記第2のメタル層との間の第1の層間絶縁膜を貫通して、前記第5のメタル層と前記第2のメタル層とを電気的に接続する少なくとも2つの第1のビアと、
前記第1のメタル層と前記第4のメタル層との間の第2の層間絶縁膜を貫通して、前記第1のメタル層と前記第4のメタル層とを電気的に接続する少なくとも2つの第2のビアと、
前記第4のメタル層と前記第3のメタル層との間の第3の層間絶縁膜を貫通して、前記第4のメタル層と前記第3のメタル層とを電気的に接続する少なくとも2つの第3のビアと、
前記第3のメタル層と前記第5のメタル層との間の第4の層間絶縁膜を貫通して、前記第3のメタル層と前記第5のメタル層とを電気的に接続する少なくとも2つの第4のビアとを有し、
前記第1のビア同士の最大の間隔は、前記第1のメタル層の幅寸法及び前記第2のビア同士の最大の間隔よりも大きく、
前記第3のビア同士の最大の間隔は、前記第2のビア同士の最大の間隔よりも小さく、且つ、前記第1のビア同士の最大の間隔は、前記第4のビア同士の最大の間隔よりも大きいことを特徴とする半導体装置。 - 前記第1の層間絶縁膜の誘電率は、3.0以下であることを特徴とする請求項1〜8のいずれか1項に記載の半導体装置。
- 前記半導体基板は、半導体素子が形成された素子形成領域を有し、
前記外部接続用電極は、前記素子形成領域の上方に形成されていることを特徴とする請求項1〜9のいずれか1項に記載の半導体装置。 - 同一平面上に形成された前記少なくとも2つの各ビア同士を結ぶ中間点は、前記半導体基板の主面と垂直な方向に同心上に形成されていることを特徴とする請求項1〜10のいずれか1項に記載の半導体装置。
- 前記各メタル層は、前記半導体基板の主面と垂直な方向に同心上に形成されていることを特徴とする請求項1〜11のいずれか1項に記載の半導体装置。
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JP2017084944A (ja) * | 2015-10-27 | 2017-05-18 | 株式会社デンソー | 半導体装置 |
JP2021528843A (ja) * | 2018-06-15 | 2021-10-21 | テキサス インスツルメンツ インコーポレイテッド | ウェハスケールチップパッケージのための半導体構造及び方法 |
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JP2008198916A (ja) * | 2007-02-15 | 2008-08-28 | Spansion Llc | 半導体装置及びその製造方法 |
CN103378030B (zh) * | 2012-04-18 | 2016-04-20 | 中芯国际集成电路制造(上海)有限公司 | 硅通孔结构 |
US20130320522A1 (en) * | 2012-05-30 | 2013-12-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Re-distribution Layer Via Structure and Method of Making Same |
FR2996354A1 (fr) * | 2012-10-01 | 2014-04-04 | St Microelectronics Crolles 2 | Dispositif semiconducteur comprenant une structure d'arret de fissure |
TWI676279B (zh) * | 2013-10-04 | 2019-11-01 | 新力股份有限公司 | 半導體裝置及固體攝像元件 |
CN107072044B (zh) * | 2017-06-05 | 2024-04-12 | 广东顺德施瑞科技有限公司 | 一种双面柔性线路板 |
JP2021034560A (ja) * | 2019-08-23 | 2021-03-01 | キオクシア株式会社 | 半導体装置およびその製造方法 |
CN117059590B (zh) * | 2023-10-11 | 2024-03-12 | 荣耀终端有限公司 | 晶圆结构及芯片 |
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