JP2011086942A - バルクFinFETを形成するSTI領域中のボイド - Google Patents
バルクFinFETを形成するSTI領域中のボイド Download PDFInfo
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- JP2011086942A JP2011086942A JP2010231121A JP2010231121A JP2011086942A JP 2011086942 A JP2011086942 A JP 2011086942A JP 2010231121 A JP2010231121 A JP 2010231121A JP 2010231121 A JP2010231121 A JP 2010231121A JP 2011086942 A JP2011086942 A JP 2011086942A
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- 239000011800 void material Substances 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims description 22
- 239000003989 dielectric material Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 15
- 230000003071 parasitic effect Effects 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823431—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
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- H01L27/0203—Particular design considerations for integrated circuits
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/845—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- Computer Hardware Design (AREA)
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- Insulated Gate Type Field-Effect Transistor (AREA)
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Abstract
【解決手段】本発明の実施形態にかかる集積回路構造の一態様は、基板20と、基板20上にあり、1つがボイド38を含む2個の絶縁領域40と、2個の絶縁領域40の間にあり、且つ、隣接する第1半導体ストリップ42と、を備えている。第1半導体ストリップ42は、2個の絶縁領域40の上表面上にフィン60を形成する頂部を有することを特徴としている。
【選択図】図9
Description
別の実施形態も開示される。
102 基板
106 ゲート誘電体
108 ゲート
110 キャパシタ
120 STI領域
122 半導体ストリップ
20 半導体基板
22 パッド層
24 マスク層
26 フォトレジスト
28 開口
32 トレンチ
34 酸化物ライナー
36 酸化物
38 ボイド
39 開口
40、40' STI領域
42 半導体ストリップ
43 シーム
52 凹部
60 フィン
62 ゲート誘電体
64 ゲート電極
66 フィン型電界効果トランジスタ
80 寄生容量
S スペーサ
W 幅
D 深さ
D'、D" 距離
Claims (15)
- 基板と、
前記基板上にあり、1つがボイドを含む2個の絶縁領域と、
前記2個の絶縁領域間にあり、且つ、前記2個の絶縁領域に隣接する第1半導体ストリップと、を備え、
前記第1半導体ストリップは、前記2個の絶縁領域の上表面上にフィンを形成する頂部を有することを特徴とする集積回路構造。 - 前記フィンの上表面と側壁上のゲート誘電体と、
前記ゲート誘電体上にあり、前記ボイド真上に一部分を有するゲート電極と、
を更に含むことを特徴とする請求項1に記載の集積回路構造。 - 第2半導体ストリップを更に含み、
前記2個の絶縁領域の1つは、前記第1半導体ストリップと前記第2半導体ストリップ間にあり、且つ、前記第1半導体ストリップと前記第2半導体ストリップに近接し、且つ、前記ゲート誘電体と前記ゲート電極は、前記第1半導体ストリップと前記第2半導体ストリップの真上に延伸することを特徴とする請求項1に記載の集積回路構造。 - 前記ゲート電極から水平に分離される追加の絶縁領域を更に有し、
前記追加の絶縁領域は、どのFinFETのどのゲート電極下にも形成されておらず、且つ、前記追加の絶縁領域は、いかなるボイドも含まないことを特徴とする請求項1に記載の集積回路構造。 - 前記ゲート電極は前記ボイドに露出することを特徴とする請求項1に記載の集積回路構造。
- 前記ボイドは、前記2個の絶縁領域の1つの上表面より低い頂面を有することを特徴とする請求項1に記載の集積回路構造。
- 前記第1半導体ストリップ、前記第2半導体ストリップ、及び、前記半導体基板は、シリコンから形成され、前記第1半導体ストリップと前記第2半導体ストリップは、連続して、前記半導体基板に接続されることを特徴とする請求項3に記載の集積回路構造。
- 集積回路構造の形成方法であって、
半導体基板を提供するステップと、
前記半導体基板中に、2個の絶縁領域を形成し、前記半導体基板のストリップが前記2個の絶縁領域を介し、且つ、前記2個の絶縁領域に隣接するステップと、
前記2個の絶縁領域の頂面を陥凹するステップと、を備え、
前記2個の絶縁領域の上表面上の前記半導体基板の前記ストリップの頂部は第1フィンを形成し、前記の陥凹ステップ後、前記2個の絶縁領域の1つがボイドを含むことを特徴とする方法。 - 前記2個の絶縁領域を形成する前記ステップは、
前記半導体基板をエッチングして、トレンチを形成するステップと、
誘電材料を前記トレンチに充填して、前記2個の絶縁領域を形成するステップと、
からなることを特徴とする請求項8に記載の方法。 - 前記ボイドは、前記トレンチを充填する前記ステップで生成されることを特徴とする請求項9に記載の方法。
- 前記ボイドは、前記2個の絶縁領域の前記頂面を陥凹する前記ステップで生成されることを特徴とする請求項9に記載の方法。
- 前記フィンの上表面と側壁上に、ゲート誘電体を形成するステップと、
前記ゲート誘電体上にあり、前記ボイド真上に一部分を有するゲート電極を形成するステップと、をさらに備えることを特徴とする請求項8に記載の方法。 - 前記ゲート電極は前記ボイドに隣接することを特徴とする請求項12に記載の方法。
- 陥凹する前記ステップで、前記2個の絶縁領域の上表面上に第2フィンを形成するステップを更に含み、
前記2個の絶縁領域の1つは、前記第1フィンと前記第2フィン間で水平で、且つ、前記ゲート誘電体と前記ゲート電極は、前記第1フィンと前記第2フィン真上に延伸することを特徴とする請求項12に記載の方法。 - 前記2個の絶縁領域を形成する前記ステップで、同時に、前記ゲート電極から水平に分離される追加の絶縁領域を形成し、
前記追加の絶縁領域は、どのFinFETのどのゲート電極下でもなく、且つ、前記追加の絶縁領域は、いかなるボイドも含まないことを特徴とする請求項8に記載の方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US25158709P | 2009-10-14 | 2009-10-14 | |
US61/251,587 | 2009-10-14 | ||
US12/612,442 | 2009-11-04 | ||
US12/612,442 US8519481B2 (en) | 2009-10-14 | 2009-11-04 | Voids in STI regions for forming bulk FinFETs |
Publications (2)
Publication Number | Publication Date |
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JP2011086942A true JP2011086942A (ja) | 2011-04-28 |
JP5307783B2 JP5307783B2 (ja) | 2013-10-02 |
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JP2010231121A Active JP5307783B2 (ja) | 2009-10-14 | 2010-10-14 | バルクFinFETを形成するSTI領域中のボイド |
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US (2) | US8519481B2 (ja) |
JP (1) | JP5307783B2 (ja) |
KR (1) | KR101243414B1 (ja) |
CN (1) | CN102044469B (ja) |
TW (1) | TWI430446B (ja) |
Cited By (1)
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KR20160073700A (ko) * | 2014-12-17 | 2016-06-27 | 삼성전자주식회사 | 매립형 게이트 구조체를 갖는 반도체 소자 및 그 제조 방법 |
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US8723271B2 (en) | 2014-05-13 |
US8519481B2 (en) | 2013-08-27 |
US20130277757A1 (en) | 2013-10-24 |
CN102044469A (zh) | 2011-05-04 |
KR101243414B1 (ko) | 2013-03-13 |
JP5307783B2 (ja) | 2013-10-02 |
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US20110084340A1 (en) | 2011-04-14 |
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