JP2011071324A5 - - Google Patents

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Publication number
JP2011071324A5
JP2011071324A5 JP2009221238A JP2009221238A JP2011071324A5 JP 2011071324 A5 JP2011071324 A5 JP 2011071324A5 JP 2009221238 A JP2009221238 A JP 2009221238A JP 2009221238 A JP2009221238 A JP 2009221238A JP 2011071324 A5 JP2011071324 A5 JP 2011071324A5
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JP
Japan
Prior art keywords
insulating film
fuse element
wiring layer
film
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009221238A
Other languages
English (en)
Japanese (ja)
Other versions
JP5507178B2 (ja
JP2011071324A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2009221238A external-priority patent/JP5507178B2/ja
Priority to JP2009221238A priority Critical patent/JP5507178B2/ja
Priority to TW099130322A priority patent/TWI555162B/zh
Priority to KR1020100090888A priority patent/KR101663836B1/ko
Priority to CN201010290650.6A priority patent/CN102034791B/zh
Priority to US12/888,183 priority patent/US8324708B2/en
Publication of JP2011071324A publication Critical patent/JP2011071324A/ja
Publication of JP2011071324A5 publication Critical patent/JP2011071324A5/ja
Publication of JP5507178B2 publication Critical patent/JP5507178B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009221238A 2009-09-25 2009-09-25 半導体集積回路装置およびその製造方法 Active JP5507178B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009221238A JP5507178B2 (ja) 2009-09-25 2009-09-25 半導体集積回路装置およびその製造方法
TW099130322A TWI555162B (zh) 2009-09-25 2010-09-08 半導體積體電路裝置及其製造方法
KR1020100090888A KR101663836B1 (ko) 2009-09-25 2010-09-16 반도체 집적 회로 장치 및 그 제조 방법
CN201010290650.6A CN102034791B (zh) 2009-09-25 2010-09-21 半导体集成电路装置及其制造方法
US12/888,183 US8324708B2 (en) 2009-09-25 2010-09-22 Semiconductor integrated circuit device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009221238A JP5507178B2 (ja) 2009-09-25 2009-09-25 半導体集積回路装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2011071324A JP2011071324A (ja) 2011-04-07
JP2011071324A5 true JP2011071324A5 (https=) 2012-08-30
JP5507178B2 JP5507178B2 (ja) 2014-05-28

Family

ID=43779359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009221238A Active JP5507178B2 (ja) 2009-09-25 2009-09-25 半導体集積回路装置およびその製造方法

Country Status (5)

Country Link
US (1) US8324708B2 (https=)
JP (1) JP5507178B2 (https=)
KR (1) KR101663836B1 (https=)
CN (1) CN102034791B (https=)
TW (1) TWI555162B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5981260B2 (ja) * 2011-09-30 2016-08-31 エスアイアイ・セミコンダクタ株式会社 半導体装置
US9818691B2 (en) * 2015-03-12 2017-11-14 Sii Semiconductor Corporation Semiconductor device having a fuse element
US9917055B2 (en) * 2015-03-12 2018-03-13 Sii Semiconductor Corporation Semiconductor device having fuse element
JP6620024B2 (ja) * 2015-03-12 2019-12-11 エイブリック株式会社 半導体装置
JP6620023B2 (ja) * 2015-03-12 2019-12-11 エイブリック株式会社 半導体装置およびその製造方法
JP7158160B2 (ja) * 2018-03-05 2022-10-21 エイブリック株式会社 半導体装置
JP6803595B1 (ja) * 2020-09-16 2020-12-23 アルディーテック株式会社 半導体発光素子チップ集積装置およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03171758A (ja) * 1989-11-30 1991-07-25 Nec Corp 半導体装置及びその製造方法
JPH0521605A (ja) * 1991-07-12 1993-01-29 Sony Corp 半導体装置
JPH0722508A (ja) * 1993-06-24 1995-01-24 Hitachi Ltd 半導体集積回路装置
JPH0737988A (ja) * 1993-07-20 1995-02-07 Hitachi Ltd 半導体集積回路装置の製造方法
JP3147149B2 (ja) * 1997-02-07 2001-03-19 日本電気株式会社 半導体装置及びその製造方法
US6589712B1 (en) * 1998-11-04 2003-07-08 Yi-Ren Hsu Method for forming a passivation layer using polyimide layer as a mask
JP2002050692A (ja) * 2000-08-01 2002-02-15 Nec Corp 半導体装置およびその製造方法
CN100501973C (zh) * 2005-03-30 2009-06-17 雅马哈株式会社 适合半导体器件的熔丝断开方法
JP2010118427A (ja) * 2008-11-12 2010-05-27 Nec Electronics Corp 半導体装置および半導体装置の製造方法

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