JP2011051015A5 - - Google Patents
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- Publication number
- JP2011051015A5 JP2011051015A5 JP2010134809A JP2010134809A JP2011051015A5 JP 2011051015 A5 JP2011051015 A5 JP 2011051015A5 JP 2010134809 A JP2010134809 A JP 2010134809A JP 2010134809 A JP2010134809 A JP 2010134809A JP 2011051015 A5 JP2011051015 A5 JP 2011051015A5
- Authority
- JP
- Japan
- Prior art keywords
- titanium
- weight percentage
- metal
- content
- reactive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000010936 titanium Substances 0.000 description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- 229910000765 intermetallic Inorganic materials 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- -1 alumina Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0902894 | 2009-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011051015A JP2011051015A (ja) | 2011-03-17 |
| JP2011051015A5 true JP2011051015A5 (cg-RX-API-DMAC7.html) | 2014-05-15 |
Family
ID=41508716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010134809A Pending JP2011051015A (ja) | 2009-06-15 | 2010-06-14 | 反応性ろう付によるアセンブリ方法及びこの方法を用いて構成した真空カートリッジ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100316885A1 (cg-RX-API-DMAC7.html) |
| EP (2) | EP2390037A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2011051015A (cg-RX-API-DMAC7.html) |
| CN (1) | CN101920364B (cg-RX-API-DMAC7.html) |
| RU (1) | RU2536840C2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2360316B1 (es) | 2008-12-10 | 2012-05-08 | Antonio Avila Chulia | Procedimiento para la encriptación y autentificación de una señal de datos. |
| CN103367038A (zh) * | 2013-06-21 | 2013-10-23 | 无锡康伟工程陶瓷有限公司 | 固态继电器瓷接件 |
| CH708666A1 (de) * | 2013-10-08 | 2015-04-15 | Kistler Holding Ag | Verfahren zur Herstellung einer Metall-Keramiklötverbindung. |
| CN104134570A (zh) * | 2014-08-12 | 2014-11-05 | 无锡康伟工程陶瓷有限公司 | 真空继电器瓷片 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3455663A (en) * | 1966-03-24 | 1969-07-15 | Mallory & Co Inc P R | Composite metal joint and a copper-silver,titanium brazing alloy |
| US4328921A (en) * | 1980-06-02 | 1982-05-11 | Cominco Ltd. | Attachment of solder preform to a cover for a sealed container |
| JPS61279395A (ja) * | 1985-06-05 | 1986-12-10 | Tanaka Kikinzoku Kogyo Kk | セラミックス用ろう材 |
| JPS61283492A (ja) * | 1985-06-07 | 1986-12-13 | Tanaka Kikinzoku Kogyo Kk | セラミツクス用ろう材 |
| JPS61283491A (ja) * | 1985-06-07 | 1986-12-13 | Tanaka Kikinzoku Kogyo Kk | セラミックス用ろう材 |
| JPS61286088A (ja) * | 1985-06-11 | 1986-12-16 | Tanaka Kikinzoku Kogyo Kk | セラミックス用ろう材 |
| US4740429A (en) * | 1985-07-22 | 1988-04-26 | Ngk Insulators, Ltd. | Metal-ceramic joined articles |
| JPH0635077B2 (ja) * | 1985-10-02 | 1994-05-11 | 田中貴金属工業株式会社 | セラミックス用ろう材 |
| US4713644A (en) * | 1986-10-14 | 1987-12-15 | Cooper Industries, Inc. | Vacuum fuse |
| JPH05261588A (ja) * | 1992-03-18 | 1993-10-12 | Nippon Cement Co Ltd | セラミックスと金属の接合用ロウ材及びその接合方法 |
| RU2029753C1 (ru) * | 1992-04-30 | 1995-02-27 | Благовещенский технологический институт | Способ получения конусного охватывающего соединения алюмооксидной керамики с металлом |
| JPH0680481A (ja) * | 1992-08-31 | 1994-03-22 | Nippon Cement Co Ltd | 酸化物セラミックスと金属との接合体の製造方法 |
| JPH06183852A (ja) * | 1992-12-17 | 1994-07-05 | Nippon Cement Co Ltd | 酸化ベリリウムセラミックスと金属との接合方法 |
| US5736783A (en) * | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
| JP3866320B2 (ja) * | 1995-02-09 | 2007-01-10 | 日本碍子株式会社 | 接合体、および接合体の製造方法 |
| JPH09132473A (ja) * | 1995-11-07 | 1997-05-20 | Shichizun Iwate:Kk | セラミックス用ろう材 |
| JPH09249462A (ja) * | 1996-03-12 | 1997-09-22 | Ngk Insulators Ltd | 接合体、その製造方法およびセラミックス部材用ろう材 |
| JP3512940B2 (ja) * | 1996-03-12 | 2004-03-31 | 株式会社東芝 | 真空気密容器用封着ろう材および真空気密容器の製造方法 |
| JPH1092276A (ja) * | 1996-09-18 | 1998-04-10 | Shibafu Eng Kk | 真空バルブ及びその製造方法 |
| US6020628A (en) * | 1997-07-21 | 2000-02-01 | Olin Corporation | Optical component package with a hermetic seal |
| CN101298108B (zh) * | 2008-05-30 | 2011-08-17 | 中国航空工业第一集团公司北京航空材料研究院 | 用于钛合金与钢真空钎焊的工艺方法 |
-
2010
- 2010-05-19 EP EP11354039A patent/EP2390037A1/fr not_active Withdrawn
- 2010-05-19 EP EP10354023.3A patent/EP2263820B1/fr not_active Not-in-force
- 2010-06-09 US US12/801,445 patent/US20100316885A1/en not_active Abandoned
- 2010-06-11 RU RU2010123963/02A patent/RU2536840C2/ru active
- 2010-06-14 JP JP2010134809A patent/JP2011051015A/ja active Pending
- 2010-06-17 CN CN201010207238.3A patent/CN101920364B/zh not_active Expired - Fee Related
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