JP2011049600A - 光電素子および光電素子の製造方法 - Google Patents
光電素子および光電素子の製造方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022416—Electrodes for devices characterised by at least one potential jump barrier or surface barrier comprising ring electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Abstract
【解決手段】アクティブゾーンおよびラテラル方向のメイン延在方向を有する半導体機能領域を含んでいる形式のものにおいて、当該半導体機能領域は、前記アクティブゾーンを通る少なくとも1つの孔部を有しており、当該孔部の領域内に接続導体材料が配置されており、当該接続導体材料は、前記アクティブゾーンから、少なくとも孔部の部分領域において電気的に絶縁されている、ことを特徴とする光電素子。
【選択図】図2
Description
図2には、概略的な断面図に基づいて本発明による光電素子の第2の実施例が示されており、
図3には、概略的な断面図に基づいて本発明による光電素子の第3の実施例が示されており、
図4には、図4a〜4iにおいて、種々の概略的な図で示された中間ステップに基づく、光電素子の本発明による製造方法の第1の実施例が示されており、
図5には、多数の光電素子を有する、本発明による装置の実施例が示されており、
図6には、図6a〜6eにおいて、概略的に示された中間ステップに基づく、光電素子の本発明による製造方法の第2の実施例が示されており、
図7には、図1に示された実施例の別形態の概略的な断面図が示されており、
図8には、図2に示された実施例の別形態の概略的な断面図が示されており、
図9には、図9a〜9iにおける、概略的な断面図及び平面図に基づいて、半導体機能領域の電気的な接触接続のための接触接続構造体を構成する種々の形態が示されており、
図10には、図10a〜10kにおいて、概略的に示された中間ステップに基づく、光電素子の本発明による製造方法の第3の実施例が示されており、
図11には、図11a〜11gにおいて、概略的に示された中間ステップに基づく、光電素子の本発明による製造方法の第4の実施例が示されており、
同種類のエレメントおよび同じ作用を有するエレメントにはこれらの図面において同じ参照番号が付与されている。
Claims (3)
- 光電素子(1)であって、
当該光電素子は、アクティブゾーン(400)およびラテラル方向のメイン延在方向を有する半導体機能領域(2)を含んでいる形式のものにおいて、
当該半導体機能領域は、前記アクティブゾーンを通る少なくとも1つの孔部(9、27、29)を有しており、当該孔部の領域内に接続導体材料(8)が配置されており、
当該接続導体材料は、前記アクティブゾーンから、少なくとも孔部の部分領域において電気的に絶縁されている、
ことを特徴とする光電素子。 - 光電素子(1)であって、
当該光電素子は、アクティブゾーン(400)およびラテラル方向のメイン延在方向を有する半導体機能領域(2)を含んでいる形式のものにおいて、
当該半導体機能領域は、ラテラル方向の、前記アクティブゾーンと接する側面(26)を有しており、当該側面にはラテラル方向において接続導体材料(8)が後続配置されており、
当該接続導体材料は、前記アクティブゾーンから、少なくとも前記側面の部分領域において電気的に絶縁されている、
ことを特徴とする光電素子。 - 光電素子の製法方法であって、以下のステップを特徴とする、すなわち、
a)支持体層(300)上に配置された半導体層列(200)を伴うウェハ結合体を準備し、当該半導体層列はアクティブゾーン(400)およびラテラル方向のメイン延在方向を有しており、
b)アクティブゾーンを通る少なくとも1つの孔部(9、27、29)が生じる、ないしは、少なくとも1つのラテラル方向の、アクティブゾーンとラテラル方向で接する側面(26)が構成されるように半導体層列を構造化し、
c)アクティブゾーンが少なくとも孔部ないし側面の部分領域において電気的に接続導体材料から絶縁されるように、接続導体材料(8)を前記孔部ないし側面の領域内に配置し、
d)光電素子(1)に個別化し、ここで当該光電素子の電気的な接触接続は少なくとも部分的に接続導体材料を介して行われる、
を特徴とする、光電素子の製造方法。
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US (1) | US8835937B2 (ja) |
EP (1) | EP1716597B1 (ja) |
JP (2) | JP5305594B2 (ja) |
KR (2) | KR101228428B1 (ja) |
CN (2) | CN1922733A (ja) |
DE (1) | DE102005007601B4 (ja) |
TW (2) | TWI317180B (ja) |
WO (1) | WO2005081319A1 (ja) |
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---|---|---|---|---|
JP2010500766A (ja) * | 2006-08-10 | 2010-01-07 | アイスモス・テクノロジー・リミテッド | ウエハ貫通ビアを備えたフォトダイオードアレイの製造方法 |
US7439548B2 (en) * | 2006-08-11 | 2008-10-21 | Bridgelux, Inc | Surface mountable chip |
DE102006046038A1 (de) * | 2006-09-28 | 2008-04-03 | Osram Opto Semiconductors Gmbh | LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers |
KR100818466B1 (ko) | 2007-02-13 | 2008-04-02 | 삼성전기주식회사 | 반도체 발광소자 |
KR100856230B1 (ko) * | 2007-03-21 | 2008-09-03 | 삼성전기주식회사 | 발광장치, 발광장치의 제조방법 및 모놀리식 발광다이오드어레이 |
DE102007019776A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente |
DE102007019775A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102007022947B4 (de) * | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
DE102007046337A1 (de) * | 2007-09-27 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
KR100891761B1 (ko) | 2007-10-19 | 2009-04-07 | 삼성전기주식회사 | 반도체 발광소자, 그의 제조방법 및 이를 이용한 반도체발광소자 패키지 |
DE102008013030A1 (de) | 2007-12-14 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
DE102008015941A1 (de) | 2007-12-21 | 2009-06-25 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung |
DE102008006988A1 (de) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102008010512A1 (de) | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
DE102008026841A1 (de) | 2008-02-22 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
DE102008011848A1 (de) | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
WO2009106063A1 (de) * | 2008-02-29 | 2009-09-03 | Osram Opto Semiconductors Gmbh | Monolithischer, optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen |
DE102008016525A1 (de) * | 2008-03-31 | 2009-11-26 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
DE102008013028A1 (de) | 2008-03-07 | 2009-09-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil, Gerät zur Aufzeichnung von Bildinformation und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
DE102008016487A1 (de) | 2008-03-31 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
DE102008021620A1 (de) | 2008-04-30 | 2009-11-05 | Osram Opto Semiconductors Gmbh | Strahlung emittierender Dünnfilm-Halbleiterchip und Verfahren zur Herstellung eines Strahlung emittierenden Dünnfilm-Halbleiterchips |
DE102008025491A1 (de) | 2008-05-28 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Leiterplatte |
DE102008030584A1 (de) * | 2008-06-27 | 2009-12-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement |
DE102008034708A1 (de) * | 2008-07-25 | 2010-02-04 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102008038748B4 (de) | 2008-08-12 | 2022-08-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares, optoelektronisches Halbleiterbauteil |
DE102008047579B4 (de) | 2008-09-17 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Leuchtmittel |
DE102008048650A1 (de) | 2008-09-24 | 2010-04-01 | Osram Opto Semiconductors Gmbh | Strahlung emittierende Vorrichtung |
DE102008049535A1 (de) * | 2008-09-29 | 2010-04-08 | Osram Opto Semiconductors Gmbh | LED-Modul und Herstellungsverfahren |
DE102008051048A1 (de) * | 2008-10-09 | 2010-04-15 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper |
US8008683B2 (en) | 2008-10-22 | 2011-08-30 | Samsung Led Co., Ltd. | Semiconductor light emitting device |
DE102008061152B4 (de) | 2008-12-09 | 2017-03-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
DE102008062932A1 (de) | 2008-12-23 | 2010-06-24 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102009004724A1 (de) | 2009-01-15 | 2010-07-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil |
DE102009019161A1 (de) * | 2009-04-28 | 2010-11-04 | Osram Opto Semiconductors Gmbh | Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode |
WO2011010436A1 (ja) | 2009-07-22 | 2011-01-27 | パナソニック株式会社 | 発光ダイオード |
DE102009034370A1 (de) | 2009-07-23 | 2011-01-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optischen Elements für ein optoelektronisches Bauteil |
DE102009036621B4 (de) * | 2009-08-07 | 2023-12-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
WO2011046388A2 (ko) * | 2009-10-15 | 2011-04-21 | 엘지이노텍주식회사 | 태양광 발전장치 및 이의 제조방법 |
DE102009059887A1 (de) | 2009-12-21 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Optoelektronischer Halbleiterchip |
KR101654340B1 (ko) * | 2009-12-28 | 2016-09-06 | 서울바이오시스 주식회사 | 발광 다이오드 |
KR101106151B1 (ko) * | 2009-12-31 | 2012-01-20 | 서울옵토디바이스주식회사 | 발광 소자 및 그것을 제조하는 방법 |
JP5101645B2 (ja) * | 2010-02-24 | 2012-12-19 | 株式会社東芝 | 半導体発光装置 |
TWI470832B (zh) * | 2010-03-08 | 2015-01-21 | Lg Innotek Co Ltd | 發光裝置 |
JP2011199221A (ja) * | 2010-03-24 | 2011-10-06 | Hitachi Cable Ltd | 発光ダイオード |
DE202010000518U1 (de) | 2010-03-31 | 2011-08-09 | Turck Holding Gmbh | Lampe mit einer in einem hermetisch verschlossenen Gehäuse angeordneten LED |
WO2011125311A1 (ja) * | 2010-04-01 | 2011-10-13 | パナソニック株式会社 | 発光ダイオード素子および発光ダイオード装置 |
JP4657374B1 (ja) * | 2010-06-16 | 2011-03-23 | 有限会社ナプラ | 発光ダイオード、発光装置、照明装置及びディスプレイ |
DE102010024079A1 (de) | 2010-06-17 | 2011-12-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
KR101688379B1 (ko) * | 2010-07-12 | 2016-12-22 | 삼성전자주식회사 | 발광 디바이스 및 그 제조방법 |
KR101784417B1 (ko) * | 2010-07-12 | 2017-11-07 | 삼성전자주식회사 | 발광 디바이스 및 그 제조방법 |
DE102010031237A1 (de) | 2010-07-12 | 2012-01-12 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102010038405A1 (de) | 2010-07-26 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements |
DE102010032497A1 (de) | 2010-07-28 | 2012-02-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips |
DE102010039382A1 (de) | 2010-08-17 | 2012-02-23 | Osram Opto Semiconductors Gmbh | Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements |
KR101114191B1 (ko) * | 2010-09-17 | 2012-03-13 | 엘지이노텍 주식회사 | 발광소자 |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
DE102010043378A1 (de) | 2010-11-04 | 2012-05-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102010053809A1 (de) * | 2010-12-08 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement, Verfahren zu dessen Herstellung und Verwendung eines derartigen Bauelements |
DE102010063760B4 (de) | 2010-12-21 | 2022-12-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
DE102010056056A1 (de) * | 2010-12-23 | 2012-06-28 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines elektrischen Anschlussträgers |
KR101762173B1 (ko) | 2011-01-13 | 2017-08-04 | 삼성전자 주식회사 | 웨이퍼 레벨 발광 소자 패키지 및 그의 제조 방법 |
DE102011003969B4 (de) | 2011-02-11 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102011011378A1 (de) | 2011-02-16 | 2012-08-16 | Osram Opto Semiconductors Gmbh | Trägersubstrat und Verfahren zur Herstellung von Halbleiterchips |
WO2012123840A1 (en) * | 2011-03-14 | 2012-09-20 | Koninklijke Philips Electronics N.V. | Led having vertical contacts redistributed for flip chip mounting |
US9246052B2 (en) | 2011-07-15 | 2016-01-26 | Institute Of Semiconductors, Chinese Academy Of Sciences | Packaging structure of light emitting diode and method of manufacturing the same |
DE102011079403A1 (de) | 2011-07-19 | 2013-01-24 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
KR101276053B1 (ko) * | 2011-07-22 | 2013-06-17 | 삼성전자주식회사 | 반도체 발광소자 및 발광장치 |
DE102011080458A1 (de) | 2011-08-04 | 2013-02-07 | Osram Opto Semiconductors Gmbh | Optoelektronische anordnung und verfahren zur herstellung einer optoelektronischen anordnung |
DE102011054891B4 (de) | 2011-10-28 | 2017-10-19 | Osram Opto Semiconductors Gmbh | Verfahren zum Durchtrennen eines Halbleiterbauelementverbunds |
EP2600168A1 (de) * | 2011-12-01 | 2013-06-05 | Leica Geosystems AG | Entfernungsmesser |
DE102011087543A1 (de) | 2011-12-01 | 2013-06-06 | Osram Opto Semiconductors Gmbh | Optoelektronische anordnung |
DE102011087614A1 (de) | 2011-12-02 | 2013-06-06 | Osram Opto Semiconductors Gmbh | Optoelektronische Anordnung |
JP5700561B2 (ja) * | 2011-12-12 | 2015-04-15 | 日本電信電話株式会社 | 受光素子 |
DE102012200416B4 (de) | 2012-01-12 | 2018-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls |
DE102012200973A1 (de) | 2012-01-24 | 2013-07-25 | Osram Opto Semiconductors Gmbh | Leuchte und verfahren zur herstellung einer leuchte |
US9368702B2 (en) | 2012-02-10 | 2016-06-14 | Koninklijke Philips N.V. | Molded lens forming a chip scale LED package and method of manufacturing the same |
KR101911865B1 (ko) | 2012-03-07 | 2018-10-25 | 엘지이노텍 주식회사 | 발광소자 |
JP2013232503A (ja) * | 2012-04-27 | 2013-11-14 | Toshiba Corp | 半導体発光装置 |
DE102012209325B4 (de) | 2012-06-01 | 2021-09-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Modul |
DE102012105176B4 (de) * | 2012-06-14 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
TWI572068B (zh) | 2012-12-07 | 2017-02-21 | 晶元光電股份有限公司 | 發光元件 |
WO2014049154A2 (de) | 2012-09-27 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement mit schutzschaltung |
DE102012217932B4 (de) | 2012-10-01 | 2019-11-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit Schutzschaltung |
DE102012217652B4 (de) * | 2012-09-27 | 2021-01-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauteil |
DE102012109905B4 (de) * | 2012-10-17 | 2021-11-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen |
KR20140076204A (ko) * | 2012-12-12 | 2014-06-20 | 서울바이오시스 주식회사 | 발광다이오드 및 그 제조방법 |
US10439107B2 (en) | 2013-02-05 | 2019-10-08 | Cree, Inc. | Chip with integrated phosphor |
US9318674B2 (en) | 2013-02-05 | 2016-04-19 | Cree, Inc. | Submount-free light emitting diode (LED) components and methods of fabricating same |
DE102013103079A1 (de) * | 2013-03-26 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
JP2016528728A (ja) * | 2013-07-18 | 2016-09-15 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 高反射フリップチップledダイ |
EP3022779B1 (en) * | 2013-07-19 | 2020-03-18 | Lumileds Holding B.V. | Pc led with optical element and without substrate carrier |
DE102013110041B4 (de) | 2013-09-12 | 2023-09-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und optoelektronisches Bauelement |
US11398579B2 (en) | 2013-09-30 | 2022-07-26 | Commissariat à l'énergie atomique et aux énergies alternatives | Method for producing optoelectronic devices comprising light-emitting diodes |
FR3011383B1 (fr) * | 2013-09-30 | 2017-05-26 | Commissariat Energie Atomique | Procede de fabrication de dispositifs optoelectroniques a diodes electroluminescentes |
EP2860769A1 (en) * | 2013-10-11 | 2015-04-15 | Azzurro Semiconductors AG | Layer structure for surface-emitting thin-film p-side-up light-emitting diode |
CN103594583A (zh) * | 2013-11-07 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | 一种倒装发光二极管 |
DE102014101492A1 (de) * | 2014-02-06 | 2015-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
DE102014102183A1 (de) * | 2014-02-20 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Herstellung optoelektronischer Bauelemente |
KR102181398B1 (ko) * | 2014-06-11 | 2020-11-23 | 엘지이노텍 주식회사 | 발광소자 및 조명시스템 |
DE102014118349B4 (de) | 2014-12-10 | 2023-07-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement und Verfahren zur Herstellung einer Mehrzahl von Halbleiterbauelementen |
US10217914B2 (en) * | 2015-05-27 | 2019-02-26 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device |
KR102460072B1 (ko) * | 2015-09-10 | 2022-10-31 | 삼성전자주식회사 | 반도체 발광 소자 |
DE102015117198A1 (de) * | 2015-10-08 | 2017-04-13 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
SE1650769A1 (sv) * | 2016-06-01 | 2017-10-24 | Fingerprint Cards Ab | Fingerprint sensing device and method for manufacturing a fingerprint sensing device |
DE102016111058A1 (de) * | 2016-06-16 | 2017-12-21 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Laserdiodenbarrens und Laserdiodenbarren |
DE102016111442A1 (de) * | 2016-06-22 | 2017-12-28 | Osram Opto Semiconductors Gmbh | Halbleiterlichtquelle |
FR3054725B1 (fr) * | 2016-07-26 | 2019-05-17 | Institut Polytechnique De Grenoble | Dispositif optoelectronique et son procede de fabrication |
DE102016114204B4 (de) * | 2016-08-01 | 2018-12-20 | Ketek Gmbh | Strahlungsdetektor und Verfahren zur Herstellung einer Mehrzahl von Strahlungsdetektoren |
DE102017107198A1 (de) * | 2017-04-04 | 2018-10-04 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Halbleiterchip und optoelektronischer Halbleiterchip |
US10572747B2 (en) * | 2017-05-31 | 2020-02-25 | Innolux Corporation | Display apparatus |
US10546842B2 (en) | 2017-05-31 | 2020-01-28 | Innolux Corporation | Display device and method for forming the same |
DE102017112223A1 (de) * | 2017-06-02 | 2018-12-06 | Osram Opto Semiconductors Gmbh | Halbleiterlaser-Bauteil und Verfahren zur Herstellung eines Halbleiterlaser-Bauteils |
CN109004037A (zh) * | 2017-06-07 | 2018-12-14 | 中国科学院物理研究所 | 光电子器件及其制造方法 |
WO2019031745A2 (ko) * | 2017-08-11 | 2019-02-14 | 서울바이오시스주식회사 | 발광 다이오드 |
KR102499308B1 (ko) | 2017-08-11 | 2023-02-14 | 서울바이오시스 주식회사 | 발광 다이오드 |
DE102017119344A1 (de) * | 2017-08-24 | 2019-02-28 | Osram Opto Semiconductors Gmbh | Träger und Bauteil mit Pufferschicht sowie Verfahren zur Herstellung eines Bauteils |
DE102017119778A1 (de) | 2017-08-29 | 2019-02-28 | Osram Opto Semiconductors Gmbh | Laserbauelement, Verwendung eines Laserbauelements, Vorrichtung mit Laserbauelement und Verfahren zur Herstellung von Laserbauelementen |
CN107946382A (zh) * | 2017-11-16 | 2018-04-20 | 南京日托光伏科技股份有限公司 | Mwt与hit结合的太阳能电池及其制备方法 |
DE102018106685A1 (de) * | 2018-03-21 | 2019-09-26 | Osram Opto Semiconductors Gmbh | Halbleiterlaser und projektor |
DE102018123931A1 (de) * | 2018-09-27 | 2020-04-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement mit Saphirträger und Verfahren zur Herstellung des optoelektronischen Halbleiterbauelements |
DE102018132824A1 (de) * | 2018-12-19 | 2020-06-25 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung einer optoelektronischen leuchtvorrichtung |
JP6766900B2 (ja) * | 2019-01-15 | 2020-10-14 | 日亜化学工業株式会社 | 発光装置 |
EP3872872B1 (en) | 2019-06-06 | 2022-11-30 | Nuvoton Technology Corporation Japan | Semiconductor light emitting element and semiconductor light emitting device |
KR102530795B1 (ko) * | 2021-02-04 | 2023-05-10 | 웨이브로드 주식회사 | 엘이디 패키지를 제조하는 방법 |
CN114171540A (zh) * | 2021-12-08 | 2022-03-11 | 镭昱光电科技(苏州)有限公司 | 微显示led芯片结构及其制作方法 |
WO2023169673A1 (en) * | 2022-03-09 | 2023-09-14 | Ams-Osram International Gmbh | Optoelectronic package and method for manufactuiring an optoelectronic package |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03177080A (ja) * | 1989-12-05 | 1991-08-01 | Nkk Corp | 発光ダイオードアレー |
JP2001339100A (ja) * | 2000-05-30 | 2001-12-07 | Shin Etsu Handotai Co Ltd | 発光素子及びその製造方法 |
JP2002064112A (ja) * | 2000-08-22 | 2002-02-28 | Sanyu Rec Co Ltd | 光電子部品の製造方法 |
US20020117681A1 (en) * | 2001-02-23 | 2002-08-29 | Weeks T. Warren | Gallium nitride material devices and methods including backside vias |
WO2003044872A1 (en) * | 2001-11-19 | 2003-05-30 | Sanyo Electric Co., Ltd. | Compound semiconductor light emitting device and its manufacturing method |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1313153A3 (en) * | 1992-07-23 | 2005-05-04 | Toyoda Gosei Co., Ltd. | Light-emitting device of gallium nitride compound semiconductor |
JP2657743B2 (ja) | 1992-10-29 | 1997-09-24 | 豊田合成株式会社 | 窒素−3族元素化合物半導体発光素子 |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
TW365071B (en) * | 1996-09-09 | 1999-07-21 | Toshiba Corp | Semiconductor light emitting diode and method for manufacturing the same |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
US6281524B1 (en) | 1997-02-21 | 2001-08-28 | Kabushiki Kaisha Toshiba | Semiconductor light-emitting device |
JPH10294491A (ja) * | 1997-04-22 | 1998-11-04 | Toshiba Corp | 半導体発光素子およびその製造方法ならびに発光装置 |
US6633120B2 (en) * | 1998-11-19 | 2003-10-14 | Unisplay S.A. | LED lamps |
JP4370071B2 (ja) | 1999-12-24 | 2009-11-25 | シスメックス株式会社 | 複合因子血液凝固能測定試薬 |
DE10017336C2 (de) | 2000-04-07 | 2002-05-16 | Vishay Semiconductor Gmbh | verfahren zur Herstellung von strahlungsemittierenden Halbleiter-Wafern |
CN1156030C (zh) | 2001-02-27 | 2004-06-30 | 连威磊晶科技股份有限公司 | 具有高透光率的发光二极管元件 |
ATE551731T1 (de) | 2001-04-23 | 2012-04-15 | Panasonic Corp | Lichtemittierende einrichtung mit einem leuchtdioden-chip |
US7714345B2 (en) * | 2003-04-30 | 2010-05-11 | Cree, Inc. | Light-emitting devices having coplanar electrical contacts adjacent to a substrate surface opposite an active region and methods of forming the same |
TWI220578B (en) | 2003-09-16 | 2004-08-21 | Opto Tech Corp | Light-emitting device capable of increasing light-emitting active region |
-
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03177080A (ja) * | 1989-12-05 | 1991-08-01 | Nkk Corp | 発光ダイオードアレー |
JP2001339100A (ja) * | 2000-05-30 | 2001-12-07 | Shin Etsu Handotai Co Ltd | 発光素子及びその製造方法 |
JP2002064112A (ja) * | 2000-08-22 | 2002-02-28 | Sanyu Rec Co Ltd | 光電子部品の製造方法 |
US20020117681A1 (en) * | 2001-02-23 | 2002-08-29 | Weeks T. Warren | Gallium nitride material devices and methods including backside vias |
WO2003044872A1 (en) * | 2001-11-19 | 2003-05-30 | Sanyo Electric Co., Ltd. | Compound semiconductor light emitting device and its manufacturing method |
Also Published As
Publication number | Publication date |
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EP1716597B1 (de) | 2018-04-04 |
KR101332771B1 (ko) | 2013-11-25 |
TWI317180B (en) | 2009-11-11 |
TW200729557A (en) | 2007-08-01 |
KR20070004737A (ko) | 2007-01-09 |
JP5355536B2 (ja) | 2013-11-27 |
US8835937B2 (en) | 2014-09-16 |
EP1716597A1 (de) | 2006-11-02 |
DE102005007601A1 (de) | 2005-09-08 |
JP5305594B2 (ja) | 2013-10-02 |
DE102005007601B4 (de) | 2023-03-23 |
KR20120085318A (ko) | 2012-07-31 |
TWI347022B (en) | 2011-08-11 |
CN1922733A (zh) | 2007-02-28 |
CN101685823A (zh) | 2010-03-31 |
CN101685823B (zh) | 2012-04-18 |
KR101228428B1 (ko) | 2013-01-31 |
TW200536151A (en) | 2005-11-01 |
WO2005081319A1 (de) | 2005-09-01 |
US20090065800A1 (en) | 2009-03-12 |
JP2007523483A (ja) | 2007-08-16 |
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