JP2010534937A5 - - Google Patents
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- Publication number
- JP2010534937A5 JP2010534937A5 JP2010518317A JP2010518317A JP2010534937A5 JP 2010534937 A5 JP2010534937 A5 JP 2010534937A5 JP 2010518317 A JP2010518317 A JP 2010518317A JP 2010518317 A JP2010518317 A JP 2010518317A JP 2010534937 A5 JP2010534937 A5 JP 2010534937A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package
- region
- clip
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 36
- 238000004519 manufacturing process Methods 0.000 claims 10
- 239000000463 material Substances 0.000 claims 7
- 238000005530 etching Methods 0.000 claims 3
- 239000012778 molding material Substances 0.000 claims 3
- 238000000926 separation method Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/829,793 US7663211B2 (en) | 2006-05-19 | 2007-07-27 | Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture |
| PCT/US2008/070611 WO2009017999A2 (en) | 2007-07-27 | 2008-07-21 | Dual side cooling integrated power device package and module and methods of manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010534937A JP2010534937A (ja) | 2010-11-11 |
| JP2010534937A5 true JP2010534937A5 (enExample) | 2011-12-15 |
Family
ID=40316927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010518317A Pending JP2010534937A (ja) | 2007-07-27 | 2008-07-21 | 両側冷却集積電力デバイスのパッケージ、モジュール及び製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7663211B2 (enExample) |
| JP (1) | JP2010534937A (enExample) |
| KR (1) | KR101324905B1 (enExample) |
| CN (2) | CN107068641A (enExample) |
| DE (1) | DE112008001657T5 (enExample) |
| MY (1) | MY149499A (enExample) |
| TW (1) | TWI450373B (enExample) |
| WO (1) | WO2009017999A2 (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7663211B2 (en) | 2006-05-19 | 2010-02-16 | Fairchild Semiconductor Corporation | Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture |
| US7800219B2 (en) * | 2008-01-02 | 2010-09-21 | Fairchild Semiconductor Corporation | High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same |
| US8063472B2 (en) * | 2008-01-28 | 2011-11-22 | Fairchild Semiconductor Corporation | Semiconductor package with stacked dice for a buck converter |
| US8193618B2 (en) * | 2008-12-12 | 2012-06-05 | Fairchild Semiconductor Corporation | Semiconductor die package with clip interconnection |
| US7816784B2 (en) * | 2008-12-17 | 2010-10-19 | Fairchild Semiconductor Corporation | Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same |
| US8049312B2 (en) * | 2009-01-12 | 2011-11-01 | Texas Instruments Incorporated | Semiconductor device package and method of assembly thereof |
| US8278756B2 (en) * | 2010-02-24 | 2012-10-02 | Inpaq Technology Co., Ltd. | Single chip semiconductor coating structure and manufacturing method thereof |
| TWI427717B (zh) * | 2010-12-28 | 2014-02-21 | 萬國半導體開曼股份有限公司 | 一種倒裝晶片的封裝方法 |
| US8344464B2 (en) | 2011-05-19 | 2013-01-01 | International Rectifier Corporation | Multi-transistor exposed conductive clip for high power semiconductor packages |
| US9717146B2 (en) | 2012-05-22 | 2017-07-25 | Intersil Americas LLC | Circuit module such as a high-density lead frame array (HDA) power module, and method of making same |
| US8759956B2 (en) | 2012-07-05 | 2014-06-24 | Infineon Technologies Ag | Chip package and method of manufacturing the same |
| US9478484B2 (en) | 2012-10-19 | 2016-10-25 | Infineon Technologies Austria Ag | Semiconductor packages and methods of formation thereof |
| US8963303B2 (en) | 2013-02-22 | 2015-02-24 | Stmicroelectronics S.R.L. | Power electronic device |
| US9070721B2 (en) | 2013-03-15 | 2015-06-30 | Semiconductor Components Industries, Llc | Semiconductor devices and methods of making the same |
| JP6147588B2 (ja) * | 2013-07-01 | 2017-06-14 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US9536800B2 (en) | 2013-12-07 | 2017-01-03 | Fairchild Semiconductor Corporation | Packaged semiconductor devices and methods of manufacturing |
| US9355942B2 (en) | 2014-05-15 | 2016-05-31 | Texas Instruments Incorporated | Gang clips having distributed-function tie bars |
| US9673097B2 (en) | 2015-05-11 | 2017-06-06 | Texas Instruments Incorporated | Integrated clip and lead and method of making a circuit |
| CN106601694B (zh) * | 2015-10-16 | 2020-09-15 | 台达电子工业股份有限公司 | 堆叠结构及其制造方法 |
| US9496208B1 (en) * | 2016-02-25 | 2016-11-15 | Texas Instruments Incorporated | Semiconductor device having compliant and crack-arresting interconnect structure |
| DE102016107792B4 (de) | 2016-04-27 | 2022-01-27 | Infineon Technologies Ag | Packung und halbfertiges Produkt mit vertikaler Verbindung zwischen Träger und Klammer sowie Verfahren zum Herstellen einer Packung und einer Charge von Packungen |
| US10189535B1 (en) * | 2016-10-12 | 2019-01-29 | Arnott T&P Holding, Llc | Motorcycle display unit system and method |
| DE102016220553A1 (de) * | 2016-10-20 | 2018-04-26 | Robert Bosch Gmbh | Leistungsmodul |
| KR102213604B1 (ko) | 2017-02-15 | 2021-02-05 | 매그나칩 반도체 유한회사 | 반도체 패키지 장치 |
| US10121742B2 (en) * | 2017-03-15 | 2018-11-06 | Amkor Technology, Inc. | Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure |
| US10727151B2 (en) * | 2017-05-25 | 2020-07-28 | Infineon Technologies Ag | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package |
| KR102153159B1 (ko) | 2017-06-12 | 2020-09-08 | 매그나칩 반도체 유한회사 | 전력 반도체의 멀티칩 패키지 |
| US10319670B2 (en) | 2017-10-20 | 2019-06-11 | Semiconductor Components Industries, Llc | Package including multiple semiconductor devices |
| KR20190071111A (ko) * | 2017-12-14 | 2019-06-24 | 삼성전자주식회사 | 엑스선 검사 장비 및 이를 이용하는 반도체 장치 제조 방법 |
| US10916931B2 (en) * | 2018-01-15 | 2021-02-09 | Infineon Technologies Ag | Temperature sensing and fault detection for paralleled double-side cooled power modules |
| US10553517B2 (en) | 2018-01-18 | 2020-02-04 | Semiconductor Components Industries, Llc | High power module semiconductor package with multiple submodules |
| US10438877B1 (en) | 2018-03-13 | 2019-10-08 | Semiconductor Components Industries, Llc | Multi-chip packages with stabilized die pads |
| CN108646159B (zh) * | 2018-03-14 | 2020-06-16 | 北京工业大学 | 一种微型焊点热电耦合测试方法 |
| US10665525B2 (en) | 2018-05-01 | 2020-05-26 | Semiconductor Components Industries, Llc | Heat transfer for power modules |
| DE102019003027A1 (de) | 2018-05-02 | 2019-11-07 | Semiconductor Components Lndustries Llc | Paketstrukturen für hochleistungsmodule |
| US11075137B2 (en) | 2018-05-02 | 2021-07-27 | Semiconductor Components Industries, Llc | High power module package structures |
| US10991670B2 (en) | 2018-09-28 | 2021-04-27 | Semiconductor Components Industries, Llc | Semiconductor device assemblies including spacer with embedded semiconductor die |
| US10872848B2 (en) | 2018-10-25 | 2020-12-22 | Infineon Technologies Ag | Semiconductor package with leadframe interconnection structure |
| DE102018130147A1 (de) | 2018-11-28 | 2020-05-28 | Infineon Technologies Ag | Halbleitervorrichtung und verfahren zum herstellen einer halbleitervorrichtung |
| IT201800020998A1 (it) | 2018-12-24 | 2020-06-24 | St Microelectronics Srl | Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente |
| US11222832B2 (en) | 2019-02-11 | 2022-01-11 | Semiconductor Components Industries, Llc | Power semiconductor device package |
| US10964628B2 (en) * | 2019-02-21 | 2021-03-30 | Infineon Technologies Ag | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture |
| US11515244B2 (en) | 2019-02-21 | 2022-11-29 | Infineon Technologies Ag | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture |
| DE102020106492A1 (de) * | 2019-04-12 | 2020-10-15 | Infineon Technologies Ag | Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung |
| US11121055B2 (en) * | 2020-01-10 | 2021-09-14 | Semiconductor Components Industries, Llc | Leadframe spacer for double-sided power module |
| DE102020108916B4 (de) * | 2020-03-31 | 2025-05-28 | Infineon Technologies Ag | Package mit Clip und Konnektor über elektronischen Komponenten |
| US12074160B2 (en) | 2020-07-17 | 2024-08-27 | Semiconductor Components Industries, Llc | Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads |
| DE102020214912A1 (de) | 2020-11-27 | 2022-06-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Schaltvorrichtung, elektrischer Energiespeicher, Vorrichtung und Verfahren zum Herstellen einer Schaltvorrichtung |
| CN115249694A (zh) * | 2021-04-26 | 2022-10-28 | 上海凯虹科技电子有限公司 | 一种封装体 |
| EP4270476A1 (en) * | 2022-04-29 | 2023-11-01 | Infineon Technologies Austria AG | Semiconductor package and method for marking a semiconductor package |
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| US4961106A (en) * | 1987-03-27 | 1990-10-02 | Olin Corporation | Metal packages having improved thermal dissipation |
| US5796159A (en) | 1995-11-30 | 1998-08-18 | Analog Devices, Inc. | Thermally efficient integrated circuit package |
| JPH09326463A (ja) * | 1996-05-09 | 1997-12-16 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置 |
| US6740969B1 (en) * | 1999-08-25 | 2004-05-25 | Renesas Technology Corp. | Electronic device |
| JP3639514B2 (ja) * | 2000-09-04 | 2005-04-20 | 三洋電機株式会社 | 回路装置の製造方法 |
| JP2002124596A (ja) * | 2000-10-18 | 2002-04-26 | Hitachi Ltd | 半導体装置およびその製造方法 |
| KR100421033B1 (ko) * | 2000-11-22 | 2004-03-04 | 페어차일드코리아반도체 주식회사 | 열전달 효율이 높은 전력용 패키지 |
| US7345342B2 (en) | 2001-01-30 | 2008-03-18 | Fairchild Semiconductor Corporation | Power semiconductor devices and methods of manufacture |
| US6777800B2 (en) * | 2002-09-30 | 2004-08-17 | Fairchild Semiconductor Corporation | Semiconductor die package including drain clip |
| TWI265611B (en) | 2003-03-11 | 2006-11-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with heatsink |
| US6867481B2 (en) * | 2003-04-11 | 2005-03-15 | Fairchild Semiconductor Corporation | Lead frame structure with aperture or groove for flip chip in a leaded molded package |
| JP2007066922A (ja) * | 2003-11-28 | 2007-03-15 | Renesas Technology Corp | 半導体集積回路装置 |
| US6917098B1 (en) | 2003-12-29 | 2005-07-12 | Texas Instruments Incorporated | Three-level leadframe for no-lead packages |
| JP2005217072A (ja) * | 2004-01-28 | 2005-08-11 | Renesas Technology Corp | 半導体装置 |
| US7301235B2 (en) | 2004-06-03 | 2007-11-27 | International Rectifier Corporation | Semiconductor device module with flip chip devices on a common lead frame |
| US7501702B2 (en) | 2004-06-24 | 2009-03-10 | Fairchild Semiconductor Corporation | Integrated transistor module and method of fabricating same |
| GB2431013B (en) | 2004-07-23 | 2008-05-21 | Electronic Bio Sciences Llc | Method and apparatus for sensing a time varying current passing through an ion channel |
| JP2006073655A (ja) * | 2004-08-31 | 2006-03-16 | Toshiba Corp | 半導体モジュール |
| US7298134B2 (en) | 2004-10-12 | 2007-11-20 | Elster Electricity, Llc | Electrical-energy meter adaptable for optical communication with various external devices |
| DE112005002899B4 (de) * | 2004-11-23 | 2016-11-17 | Siliconix Inc. | Halbleiterbauelement mit einem Chip, der zwischen einer becherförmigen Leiterplatte und einer Leiterplatte mit Mesas und Tälern angeordnet ist, und Verfahren zur dessen Herstellung |
| US7394150B2 (en) * | 2004-11-23 | 2008-07-01 | Siliconix Incorporated | Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys |
| US7503695B2 (en) * | 2004-12-01 | 2009-03-17 | Anderson Dale A | Device and method for holding open decoy bags |
| US7256479B2 (en) | 2005-01-13 | 2007-08-14 | Fairchild Semiconductor Corporation | Method to manufacture a universal footprint for a package with exposed chip |
| US7476976B2 (en) | 2005-02-23 | 2009-01-13 | Texas Instruments Incorporated | Flip chip package with advanced electrical and thermal properties for high current designs |
| US7285849B2 (en) | 2005-11-18 | 2007-10-23 | Fairchild Semiconductor Corporation | Semiconductor die package using leadframe and clip and method of manufacturing |
| US20070132073A1 (en) * | 2005-12-09 | 2007-06-14 | Tiong Toong T | Device and method for assembling a top and bottom exposed packaged semiconductor |
| US7663211B2 (en) | 2006-05-19 | 2010-02-16 | Fairchild Semiconductor Corporation | Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture |
-
2007
- 2007-07-27 US US11/829,793 patent/US7663211B2/en active Active
-
2008
- 2008-07-15 TW TW097126810A patent/TWI450373B/zh active
- 2008-07-21 KR KR1020097027384A patent/KR101324905B1/ko active Active
- 2008-07-21 CN CN201710166570.1A patent/CN107068641A/zh active Pending
- 2008-07-21 JP JP2010518317A patent/JP2010534937A/ja active Pending
- 2008-07-21 DE DE112008001657T patent/DE112008001657T5/de not_active Withdrawn
- 2008-07-21 CN CN200880016686.6A patent/CN101681897B/zh not_active Expired - Fee Related
- 2008-07-21 MY MYPI20095511A patent/MY149499A/en unknown
- 2008-07-21 WO PCT/US2008/070611 patent/WO2009017999A2/en not_active Ceased
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