CN101681897B - 双侧冷却集成功率装置封装和模块及其制造方法 - Google Patents

双侧冷却集成功率装置封装和模块及其制造方法 Download PDF

Info

Publication number
CN101681897B
CN101681897B CN200880016686.6A CN200880016686A CN101681897B CN 101681897 B CN101681897 B CN 101681897B CN 200880016686 A CN200880016686 A CN 200880016686A CN 101681897 B CN101681897 B CN 101681897B
Authority
CN
China
Prior art keywords
clip
module
drain
package
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880016686.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN101681897A (zh
Inventor
乔纳森·A·诺奎尔
鲁宾·马德里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fairchild Semiconductor Corp
Original Assignee
Fairchild Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fairchild Semiconductor Corp filed Critical Fairchild Semiconductor Corp
Priority to CN201710166570.1A priority Critical patent/CN107068641A/zh
Publication of CN101681897A publication Critical patent/CN101681897A/zh
Application granted granted Critical
Publication of CN101681897B publication Critical patent/CN101681897B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/881—Bump connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200880016686.6A 2007-07-27 2008-07-21 双侧冷却集成功率装置封装和模块及其制造方法 Expired - Fee Related CN101681897B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710166570.1A CN107068641A (zh) 2007-07-27 2008-07-21 双侧冷却集成功率装置封装和模块及其制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/829,793 2007-07-27
US11/829,793 US7663211B2 (en) 2006-05-19 2007-07-27 Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture
PCT/US2008/070611 WO2009017999A2 (en) 2007-07-27 2008-07-21 Dual side cooling integrated power device package and module and methods of manufacture

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201710166570.1A Division CN107068641A (zh) 2007-07-27 2008-07-21 双侧冷却集成功率装置封装和模块及其制造方法

Publications (2)

Publication Number Publication Date
CN101681897A CN101681897A (zh) 2010-03-24
CN101681897B true CN101681897B (zh) 2017-04-12

Family

ID=40316927

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200880016686.6A Expired - Fee Related CN101681897B (zh) 2007-07-27 2008-07-21 双侧冷却集成功率装置封装和模块及其制造方法
CN201710166570.1A Pending CN107068641A (zh) 2007-07-27 2008-07-21 双侧冷却集成功率装置封装和模块及其制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201710166570.1A Pending CN107068641A (zh) 2007-07-27 2008-07-21 双侧冷却集成功率装置封装和模块及其制造方法

Country Status (8)

Country Link
US (1) US7663211B2 (enExample)
JP (1) JP2010534937A (enExample)
KR (1) KR101324905B1 (enExample)
CN (2) CN101681897B (enExample)
DE (1) DE112008001657T5 (enExample)
MY (1) MY149499A (enExample)
TW (1) TWI450373B (enExample)
WO (1) WO2009017999A2 (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7663211B2 (en) 2006-05-19 2010-02-16 Fairchild Semiconductor Corporation Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture
US7800219B2 (en) * 2008-01-02 2010-09-21 Fairchild Semiconductor Corporation High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
US8063472B2 (en) * 2008-01-28 2011-11-22 Fairchild Semiconductor Corporation Semiconductor package with stacked dice for a buck converter
US8193618B2 (en) * 2008-12-12 2012-06-05 Fairchild Semiconductor Corporation Semiconductor die package with clip interconnection
US7816784B2 (en) * 2008-12-17 2010-10-19 Fairchild Semiconductor Corporation Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
US8049312B2 (en) * 2009-01-12 2011-11-01 Texas Instruments Incorporated Semiconductor device package and method of assembly thereof
US8278756B2 (en) * 2010-02-24 2012-10-02 Inpaq Technology Co., Ltd. Single chip semiconductor coating structure and manufacturing method thereof
TWI427717B (zh) * 2010-12-28 2014-02-21 萬國半導體開曼股份有限公司 一種倒裝晶片的封裝方法
US8344464B2 (en) 2011-05-19 2013-01-01 International Rectifier Corporation Multi-transistor exposed conductive clip for high power semiconductor packages
US9717146B2 (en) 2012-05-22 2017-07-25 Intersil Americas LLC Circuit module such as a high-density lead frame array (HDA) power module, and method of making same
US8759956B2 (en) 2012-07-05 2014-06-24 Infineon Technologies Ag Chip package and method of manufacturing the same
US9478484B2 (en) 2012-10-19 2016-10-25 Infineon Technologies Austria Ag Semiconductor packages and methods of formation thereof
US8963303B2 (en) 2013-02-22 2015-02-24 Stmicroelectronics S.R.L. Power electronic device
US9070721B2 (en) * 2013-03-15 2015-06-30 Semiconductor Components Industries, Llc Semiconductor devices and methods of making the same
JP6147588B2 (ja) * 2013-07-01 2017-06-14 ルネサスエレクトロニクス株式会社 半導体装置
US9536800B2 (en) 2013-12-07 2017-01-03 Fairchild Semiconductor Corporation Packaged semiconductor devices and methods of manufacturing
US9355942B2 (en) 2014-05-15 2016-05-31 Texas Instruments Incorporated Gang clips having distributed-function tie bars
US9673097B2 (en) 2015-05-11 2017-06-06 Texas Instruments Incorporated Integrated clip and lead and method of making a circuit
CN106601694B (zh) * 2015-10-16 2020-09-15 台达电子工业股份有限公司 堆叠结构及其制造方法
US9496208B1 (en) * 2016-02-25 2016-11-15 Texas Instruments Incorporated Semiconductor device having compliant and crack-arresting interconnect structure
DE102016107792B4 (de) 2016-04-27 2022-01-27 Infineon Technologies Ag Packung und halbfertiges Produkt mit vertikaler Verbindung zwischen Träger und Klammer sowie Verfahren zum Herstellen einer Packung und einer Charge von Packungen
US10189535B1 (en) * 2016-10-12 2019-01-29 Arnott T&P Holding, Llc Motorcycle display unit system and method
DE102016220553A1 (de) * 2016-10-20 2018-04-26 Robert Bosch Gmbh Leistungsmodul
KR102213604B1 (ko) 2017-02-15 2021-02-05 매그나칩 반도체 유한회사 반도체 패키지 장치
US10121742B2 (en) * 2017-03-15 2018-11-06 Amkor Technology, Inc. Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure
US10727151B2 (en) * 2017-05-25 2020-07-28 Infineon Technologies Ag Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
KR102153159B1 (ko) 2017-06-12 2020-09-08 매그나칩 반도체 유한회사 전력 반도체의 멀티칩 패키지
US10319670B2 (en) 2017-10-20 2019-06-11 Semiconductor Components Industries, Llc Package including multiple semiconductor devices
KR20190071111A (ko) * 2017-12-14 2019-06-24 삼성전자주식회사 엑스선 검사 장비 및 이를 이용하는 반도체 장치 제조 방법
US10916931B2 (en) * 2018-01-15 2021-02-09 Infineon Technologies Ag Temperature sensing and fault detection for paralleled double-side cooled power modules
US10553517B2 (en) 2018-01-18 2020-02-04 Semiconductor Components Industries, Llc High power module semiconductor package with multiple submodules
US10438877B1 (en) 2018-03-13 2019-10-08 Semiconductor Components Industries, Llc Multi-chip packages with stabilized die pads
CN108646159B (zh) * 2018-03-14 2020-06-16 北京工业大学 一种微型焊点热电耦合测试方法
US10665525B2 (en) 2018-05-01 2020-05-26 Semiconductor Components Industries, Llc Heat transfer for power modules
DE102019003027A1 (de) 2018-05-02 2019-11-07 Semiconductor Components Lndustries Llc Paketstrukturen für hochleistungsmodule
US11075137B2 (en) 2018-05-02 2021-07-27 Semiconductor Components Industries, Llc High power module package structures
US10991670B2 (en) 2018-09-28 2021-04-27 Semiconductor Components Industries, Llc Semiconductor device assemblies including spacer with embedded semiconductor die
US10872848B2 (en) * 2018-10-25 2020-12-22 Infineon Technologies Ag Semiconductor package with leadframe interconnection structure
DE102018130147A1 (de) 2018-11-28 2020-05-28 Infineon Technologies Ag Halbleitervorrichtung und verfahren zum herstellen einer halbleitervorrichtung
IT201800020998A1 (it) 2018-12-24 2020-06-24 St Microelectronics Srl Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
US11222832B2 (en) 2019-02-11 2022-01-11 Semiconductor Components Industries, Llc Power semiconductor device package
US11515244B2 (en) 2019-02-21 2022-11-29 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
US10964628B2 (en) * 2019-02-21 2021-03-30 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
DE102020106492A1 (de) * 2019-04-12 2020-10-15 Infineon Technologies Ag Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung
US11121055B2 (en) * 2020-01-10 2021-09-14 Semiconductor Components Industries, Llc Leadframe spacer for double-sided power module
DE102020108916B4 (de) * 2020-03-31 2025-05-28 Infineon Technologies Ag Package mit Clip und Konnektor über elektronischen Komponenten
US12074160B2 (en) 2020-07-17 2024-08-27 Semiconductor Components Industries, Llc Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads
DE102020214912A1 (de) 2020-11-27 2022-06-02 Robert Bosch Gesellschaft mit beschränkter Haftung Schaltvorrichtung, elektrischer Energiespeicher, Vorrichtung und Verfahren zum Herstellen einer Schaltvorrichtung
CN115249694A (zh) * 2021-04-26 2022-10-28 上海凯虹科技电子有限公司 一种封装体
JP7241805B2 (ja) * 2021-05-24 2023-03-17 アオイ電子株式会社 半導体装置およびその製造方法
EP4270476A1 (en) * 2022-04-29 2023-11-01 Infineon Technologies Austria AG Semiconductor package and method for marking a semiconductor package
US12538810B2 (en) 2022-09-14 2026-01-27 Infineon Technologies Ag Molded package having an electrically conductive clip with a convex curved surface attached to a semiconductor die

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988007761A1 (en) * 1987-03-27 1988-10-06 Olin Corporation Metal packages having improved thermal dissipation
KR20020039720A (ko) * 2000-11-22 2002-05-30 김덕중 열전달 효율이 높은 전력용 패키지
WO2006012110A2 (en) * 2004-06-24 2006-02-02 Fairchild Semiconductor Corporation Integrated transistor module and method of fabricating same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5796159A (en) * 1995-11-30 1998-08-18 Analog Devices, Inc. Thermally efficient integrated circuit package
JPH09326463A (ja) * 1996-05-09 1997-12-16 Oki Electric Ind Co Ltd 樹脂封止型半導体装置
US6740969B1 (en) * 1999-08-25 2004-05-25 Renesas Technology Corp. Electronic device
JP3639514B2 (ja) * 2000-09-04 2005-04-20 三洋電機株式会社 回路装置の製造方法
JP2002124596A (ja) * 2000-10-18 2002-04-26 Hitachi Ltd 半導体装置およびその製造方法
US7345342B2 (en) 2001-01-30 2008-03-18 Fairchild Semiconductor Corporation Power semiconductor devices and methods of manufacture
US6777800B2 (en) * 2002-09-30 2004-08-17 Fairchild Semiconductor Corporation Semiconductor die package including drain clip
TWI265611B (en) * 2003-03-11 2006-11-01 Siliconware Precision Industries Co Ltd Semiconductor package with heatsink
US6867481B2 (en) * 2003-04-11 2005-03-15 Fairchild Semiconductor Corporation Lead frame structure with aperture or groove for flip chip in a leaded molded package
JP2007066922A (ja) * 2003-11-28 2007-03-15 Renesas Technology Corp 半導体集積回路装置
US6917098B1 (en) * 2003-12-29 2005-07-12 Texas Instruments Incorporated Three-level leadframe for no-lead packages
JP2005217072A (ja) * 2004-01-28 2005-08-11 Renesas Technology Corp 半導体装置
WO2005122249A2 (en) * 2004-06-03 2005-12-22 International Rectifier Corporation Semiconductor device module with flip chip devices on a common lead frame
GB2431013B (en) 2004-07-23 2008-05-21 Electronic Bio Sciences Llc Method and apparatus for sensing a time varying current passing through an ion channel
JP2006073655A (ja) * 2004-08-31 2006-03-16 Toshiba Corp 半導体モジュール
US7298134B2 (en) 2004-10-12 2007-11-20 Elster Electricity, Llc Electrical-energy meter adaptable for optical communication with various external devices
JP4575955B2 (ja) * 2004-11-23 2010-11-04 シリコニックス インコーポレーテッド 半導体パッケージ及びその製造方法
US7394150B2 (en) * 2004-11-23 2008-07-01 Siliconix Incorporated Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
US7503695B2 (en) * 2004-12-01 2009-03-17 Anderson Dale A Device and method for holding open decoy bags
US7256479B2 (en) 2005-01-13 2007-08-14 Fairchild Semiconductor Corporation Method to manufacture a universal footprint for a package with exposed chip
US7476976B2 (en) * 2005-02-23 2009-01-13 Texas Instruments Incorporated Flip chip package with advanced electrical and thermal properties for high current designs
US7285849B2 (en) * 2005-11-18 2007-10-23 Fairchild Semiconductor Corporation Semiconductor die package using leadframe and clip and method of manufacturing
TW200739758A (en) * 2005-12-09 2007-10-16 Fairchild Semiconductor Corporaton Device and method for assembling a top and bottom exposed packaged semiconductor
US7663211B2 (en) 2006-05-19 2010-02-16 Fairchild Semiconductor Corporation Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988007761A1 (en) * 1987-03-27 1988-10-06 Olin Corporation Metal packages having improved thermal dissipation
KR20020039720A (ko) * 2000-11-22 2002-05-30 김덕중 열전달 효율이 높은 전력용 패키지
WO2006012110A2 (en) * 2004-06-24 2006-02-02 Fairchild Semiconductor Corporation Integrated transistor module and method of fabricating same

Also Published As

Publication number Publication date
WO2009017999A3 (en) 2009-04-02
JP2010534937A (ja) 2010-11-11
MY149499A (en) 2013-09-13
CN107068641A (zh) 2017-08-18
US20080023807A1 (en) 2008-01-31
TWI450373B (zh) 2014-08-21
KR101324905B1 (ko) 2013-11-04
CN101681897A (zh) 2010-03-24
WO2009017999A2 (en) 2009-02-05
US7663211B2 (en) 2010-02-16
DE112008001657T5 (de) 2010-06-10
TW200913201A (en) 2009-03-16
KR20100039293A (ko) 2010-04-15

Similar Documents

Publication Publication Date Title
CN101681897B (zh) 双侧冷却集成功率装置封装和模块及其制造方法
US7838340B2 (en) Pre-molded clip structure
US7777315B2 (en) Dual side cooling integrated power device module and methods of manufacture
CN100362656C (zh) 包含漏极夹的半导体管芯封装及其制造方法
CN101577237B (zh) 包括第一和第二支座的半导体装置和方法
JP6509885B2 (ja) 半導体チップの端子を有するｄｃ−ｄｃコンバータ
JP2009534869A (ja) マルチプルダイおよび共通ノード構造を含む半導体ダイパッケージ
US20090127677A1 (en) Multi-Terminal Package Assembly For Semiconductor Devices
EP3474322B1 (en) Semiconductor device and method of manufacture
TWI452662B (zh) 雙邊冷卻整合電源裝置封裝與模組及製造方法
KR20220007878A (ko) 양면 냉각을 갖는 전자 디바이스
CN113496977A (zh) 共源共栅半导体装置和制造方法
CN112635411A (zh) 具有顶侧或底侧冷却的半导体封装
US8198134B2 (en) Dual side cooling integrated power device module and methods of manufacture
CN111244061A (zh) 氮化镓设备的封装结构
US20230245942A1 (en) Semiconductor device package with integral heat slug
HK1118378A1 (en) Semiconductor package structure having multiple heat dissipation paths and method of manufacture
HK1118378B (en) Semiconductor package structure having multiple heat dissipation paths and method of manufacture

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170412

Termination date: 20210721