JP2010534937A - 両側冷却集積電力デバイスのパッケージ、モジュール及び製造方法 - Google Patents

両側冷却集積電力デバイスのパッケージ、モジュール及び製造方法 Download PDF

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JP2010534937A
JP2010534937A JP2010518317A JP2010518317A JP2010534937A JP 2010534937 A JP2010534937 A JP 2010534937A JP 2010518317 A JP2010518317 A JP 2010518317A JP 2010518317 A JP2010518317 A JP 2010518317A JP 2010534937 A JP2010534937 A JP 2010534937A
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clip
drain
power device
integrated power
lead frame
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JP2010534937A5 (enExample
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ジョナサン エー． ノキル
ルベン ピー． マドリード
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フェアチャイルド・セミコンダクター・コーポレーション
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
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    • H01L2924/181—Encapsulation
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    • H01L2924/30107—Inductance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2010518317A 2007-07-27 2008-07-21 両側冷却集積電力デバイスのパッケージ、モジュール及び製造方法 Pending JP2010534937A (ja)

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DE112008001657T5 (de) 2010-06-10
KR101324905B1 (ko) 2013-11-04
KR20100039293A (ko) 2010-04-15
US20080023807A1 (en) 2008-01-31
US7663211B2 (en) 2010-02-16
WO2009017999A3 (en) 2009-04-02
TWI450373B (zh) 2014-08-21
WO2009017999A2 (en) 2009-02-05
CN101681897A (zh) 2010-03-24
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CN107068641A (zh) 2017-08-18
TW200913201A (en) 2009-03-16

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