JP2010260924A - 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 - Google Patents
接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 Download PDFInfo
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- JP2010260924A JP2010260924A JP2009111505A JP2009111505A JP2010260924A JP 2010260924 A JP2010260924 A JP 2010260924A JP 2009111505 A JP2009111505 A JP 2009111505A JP 2009111505 A JP2009111505 A JP 2009111505A JP 2010260924 A JP2010260924 A JP 2010260924A
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- epoxy
- resin
- resin composition
- adhesive
- adhesive resin
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Classifications
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- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/066—Copolymers with monomers not covered by C08L33/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Adhesive Tapes (AREA)
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009111505A JP2010260924A (ja) | 2009-04-30 | 2009-04-30 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
| US13/318,300 US20120043118A1 (en) | 2009-04-30 | 2010-03-26 | Adhesive resin composition, and laminate and flexible printed wiring board using the same |
| PCT/JP2010/055312 WO2010125879A1 (ja) | 2009-04-30 | 2010-03-26 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
| CN201080018788.9A CN102414287B (zh) | 2009-04-30 | 2010-03-26 | 胶粘性树脂组合物及使用其的层压体和柔性印刷线路板 |
| KR1020117022067A KR20120026473A (ko) | 2009-04-30 | 2010-03-26 | 접착성 수지 조성물, 그리고 이것을 이용한 적층체 및 플렉서블 인쇄 배선판 |
| TW099113405A TW201043676A (en) | 2009-04-30 | 2010-04-28 | Adhesive resin composition, layered product using the same, and flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009111505A JP2010260924A (ja) | 2009-04-30 | 2009-04-30 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010260924A true JP2010260924A (ja) | 2010-11-18 |
| JP2010260924A5 JP2010260924A5 (enExample) | 2012-04-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009111505A Pending JP2010260924A (ja) | 2009-04-30 | 2009-04-30 | 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120043118A1 (enExample) |
| JP (1) | JP2010260924A (enExample) |
| KR (1) | KR20120026473A (enExample) |
| CN (1) | CN102414287B (enExample) |
| TW (1) | TW201043676A (enExample) |
| WO (1) | WO2010125879A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013133041A1 (ja) * | 2012-03-08 | 2013-09-12 | 東亞合成株式会社 | ハロゲンフリー難燃性接着剤組成物 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2770023B1 (en) * | 2013-02-26 | 2016-08-31 | LG Chem, Ltd. | Non-halogen flame retardant styrene resin composition |
| DE102019209754A1 (de) * | 2019-07-03 | 2021-01-07 | Tesa Se | Thermisch härtender Klebstoff und daraus hergestelltes Klebeband |
| KR102658294B1 (ko) * | 2019-09-09 | 2024-04-16 | 주식회사 두산 | 밀봉 시트 및 이를 포함하는 반도체 장치 |
| CN112795168B (zh) * | 2020-12-11 | 2022-08-19 | 金发科技股份有限公司 | 一种聚苯醚树脂组合物及其制备方法和应用 |
| CN115851203A (zh) * | 2022-12-22 | 2023-03-28 | 烟台德邦科技股份有限公司 | 一种用于低表面能材料粘接的环氧胶粘剂 |
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| JP2003176470A (ja) * | 2001-12-12 | 2003-06-24 | Tokai Rubber Ind Ltd | フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板 |
| JP2008308686A (ja) * | 2007-05-17 | 2008-12-25 | Fujikura Ltd | エポキシ系接着剤、カバーレイ、プリプレグ、金属張積層板、プリント配線基板 |
| JP2009041019A (ja) * | 2003-01-07 | 2009-02-26 | Sekisui Chem Co Ltd | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
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| DE3224689C1 (de) * | 1982-07-02 | 1984-01-26 | Th. Goldschmidt Ag, 4300 Essen | Verfahren zum Flexibilisieren von Epoxidharzen |
| US4868244A (en) * | 1988-12-27 | 1989-09-19 | General Electric Company | Low-gloss carbonate polymer blends |
| DE69215147T2 (de) * | 1991-06-12 | 1997-03-06 | Tonen Corp | Thermoplastische Harzzusammensetzung |
| JPH0641506A (ja) * | 1992-07-24 | 1994-02-15 | Nippon Oil & Fats Co Ltd | エネルギ―線硬化型接着剤 |
| JP3603426B2 (ja) * | 1995-11-21 | 2004-12-22 | 日立化成工業株式会社 | 回路用接続部材 |
| CN1105749C (zh) * | 1997-08-19 | 2003-04-16 | 美国3M公司 | 导电环氧树脂组合物及其应用 |
| JP4238124B2 (ja) * | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
| JP3685791B2 (ja) * | 2003-08-08 | 2005-08-24 | 日東電工株式会社 | 鋼板用貼着シート |
| JP2008258429A (ja) * | 2007-04-05 | 2008-10-23 | Sekisui Chem Co Ltd | 絶縁フィルム、電子部品装置の製造方法及び電子部品装置 |
| CN102876277B (zh) * | 2007-10-05 | 2014-12-10 | 日立化成株式会社 | 粘接剂组合物和使用该组合物的电路连接膜，以及电路部件的连接方法和电路连接体 |
| JP2009132879A (ja) * | 2007-11-02 | 2009-06-18 | Toray Ind Inc | 接着剤組成物およびそれを用いたカバーレイフィルム |
| CN101747854B (zh) * | 2008-12-04 | 2012-11-21 | 比亚迪股份有限公司 | 胶粘剂组合物以及覆盖膜和柔性线路板 |
-
2009
- 2009-04-30 JP JP2009111505A patent/JP2010260924A/ja active Pending
-
2010
- 2010-03-26 CN CN201080018788.9A patent/CN102414287B/zh active Active
- 2010-03-26 US US13/318,300 patent/US20120043118A1/en not_active Abandoned
- 2010-03-26 KR KR1020117022067A patent/KR20120026473A/ko not_active Withdrawn
- 2010-03-26 WO PCT/JP2010/055312 patent/WO2010125879A1/ja not_active Ceased
- 2010-04-28 TW TW099113405A patent/TW201043676A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003176470A (ja) * | 2001-12-12 | 2003-06-24 | Tokai Rubber Ind Ltd | フレキシブル印刷配線板用難燃性接着剤組成物およびそれを用いたフレキシブル印刷配線板 |
| JP2009041019A (ja) * | 2003-01-07 | 2009-02-26 | Sekisui Chem Co Ltd | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
| JP2008308686A (ja) * | 2007-05-17 | 2008-12-25 | Fujikura Ltd | エポキシ系接着剤、カバーレイ、プリプレグ、金属張積層板、プリント配線基板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013133041A1 (ja) * | 2012-03-08 | 2013-09-12 | 東亞合成株式会社 | ハロゲンフリー難燃性接着剤組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102414287A (zh) | 2012-04-11 |
| WO2010125879A1 (ja) | 2010-11-04 |
| US20120043118A1 (en) | 2012-02-23 |
| TW201043676A (en) | 2010-12-16 |
| KR20120026473A (ko) | 2012-03-19 |
| CN102414287B (zh) | 2014-07-30 |
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