JP2010225822A5 - - Google Patents

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Publication number
JP2010225822A5
JP2010225822A5 JP2009071065A JP2009071065A JP2010225822A5 JP 2010225822 A5 JP2010225822 A5 JP 2010225822A5 JP 2009071065 A JP2009071065 A JP 2009071065A JP 2009071065 A JP2009071065 A JP 2009071065A JP 2010225822 A5 JP2010225822 A5 JP 2010225822A5
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JP
Japan
Prior art keywords
electrode
component
substrate
dummy
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009071065A
Other languages
English (en)
Japanese (ja)
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JP5264585B2 (ja
JP2010225822A (ja
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Publication date
Application filed filed Critical
Priority to JP2009071065A priority Critical patent/JP5264585B2/ja
Priority claimed from JP2009071065A external-priority patent/JP5264585B2/ja
Priority to US12/728,555 priority patent/US8304338B2/en
Priority to CN201010157060.6A priority patent/CN101848605B/zh
Publication of JP2010225822A publication Critical patent/JP2010225822A/ja
Publication of JP2010225822A5 publication Critical patent/JP2010225822A5/ja
Application granted granted Critical
Publication of JP5264585B2 publication Critical patent/JP5264585B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009071065A 2009-03-24 2009-03-24 電子部品接合方法および電子部品 Expired - Fee Related JP5264585B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009071065A JP5264585B2 (ja) 2009-03-24 2009-03-24 電子部品接合方法および電子部品
US12/728,555 US8304338B2 (en) 2009-03-24 2010-03-22 Method of joining electronic component and the electronic component
CN201010157060.6A CN101848605B (zh) 2009-03-24 2010-03-23 电子元器件接合方法及电子元器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009071065A JP5264585B2 (ja) 2009-03-24 2009-03-24 電子部品接合方法および電子部品

Publications (3)

Publication Number Publication Date
JP2010225822A JP2010225822A (ja) 2010-10-07
JP2010225822A5 true JP2010225822A5 (enExample) 2012-04-26
JP5264585B2 JP5264585B2 (ja) 2013-08-14

Family

ID=42773012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009071065A Expired - Fee Related JP5264585B2 (ja) 2009-03-24 2009-03-24 電子部品接合方法および電子部品

Country Status (3)

Country Link
US (1) US8304338B2 (enExample)
JP (1) JP5264585B2 (enExample)
CN (1) CN101848605B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8138426B2 (en) * 2007-11-05 2012-03-20 Panasonic Corporation Mounting structure
KR101711499B1 (ko) * 2010-10-20 2017-03-13 삼성전자주식회사 반도체 패키지 및 그 제조 방법
DE102012217603A1 (de) * 2012-09-27 2014-03-27 Siemens Aktiengesellschaft Anordnung zur Nukleinsäure-Sequenzierung mittels Tunnelstromanalyse
DE102013214341A1 (de) * 2013-07-23 2015-01-29 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Nanopore zum Sequenzieren eines Biopolymers
JP6344919B2 (ja) * 2014-01-21 2018-06-20 キヤノン株式会社 プリント回路板及び積層型半導体装置
JP6588214B2 (ja) * 2015-03-19 2019-10-09 新光電気工業株式会社 電子部品装置と電子部品装置の製造方法
JP2018056234A (ja) * 2016-09-27 2018-04-05 キヤノン株式会社 プリント回路板、電子機器及びプリント回路板の製造方法
JP2025008730A (ja) * 2023-07-06 2025-01-20 日本特殊陶業株式会社 配線基板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5400950A (en) * 1994-02-22 1995-03-28 Delco Electronics Corporation Method for controlling solder bump height for flip chip integrated circuit devices
JP2002314002A (ja) * 2001-04-18 2002-10-25 Mitsubishi Electric Corp 半導体装置
JP2004104102A (ja) * 2002-08-21 2004-04-02 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2004158733A (ja) 2002-11-08 2004-06-03 Renesas Technology Corp 半導体装置およびその製造方法
TWM243783U (en) * 2003-06-30 2004-09-11 Innolux Display Corp Structure of chip on glass
JP2005310837A (ja) * 2004-04-16 2005-11-04 Elpida Memory Inc 半導体装置及びその製造方法
US7301229B2 (en) * 2004-06-25 2007-11-27 Taiwan Semiconductor Manufacturing Company Electrostatic discharge (ESD) protection for integrated circuit packages
JP4477966B2 (ja) 2004-08-03 2010-06-09 株式会社ルネサステクノロジ 半導体装置の製造方法
JP3955302B2 (ja) 2004-09-15 2007-08-08 松下電器産業株式会社 フリップチップ実装体の製造方法
JP2006245189A (ja) * 2005-03-02 2006-09-14 Matsushita Electric Ind Co Ltd 半導体素子のフリップチップ実装方法及び実装構造体
US7732920B2 (en) * 2005-03-28 2010-06-08 Panasonic Corporation Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
US20070069378A1 (en) * 2005-04-15 2007-03-29 Chang-Yong Park Semiconductor module and method of forming a semiconductor module
US20090085227A1 (en) * 2005-05-17 2009-04-02 Matsushita Electric Industrial Co., Ltd. Flip-chip mounting body and flip-chip mounting method
JP4887997B2 (ja) 2006-09-19 2012-02-29 日本電気株式会社 電子部品の実装方法
JP2008101980A (ja) * 2006-10-18 2008-05-01 Denso Corp 容量式半導体センサ装置
JP2008226946A (ja) * 2007-03-09 2008-09-25 Nec Corp 半導体装置およびその製造方法
KR100924552B1 (ko) * 2007-11-30 2009-11-02 주식회사 하이닉스반도체 반도체 패키지용 기판 및 이를 갖는 반도체 패키지
WO2009116517A1 (ja) * 2008-03-17 2009-09-24 日本電気株式会社 電子装置及びその製造方法

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