JP6588214B2 - 電子部品装置と電子部品装置の製造方法 - Google Patents
電子部品装置と電子部品装置の製造方法 Download PDFInfo
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- JP6588214B2 JP6588214B2 JP2015056214A JP2015056214A JP6588214B2 JP 6588214 B2 JP6588214 B2 JP 6588214B2 JP 2015056214 A JP2015056214 A JP 2015056214A JP 2015056214 A JP2015056214 A JP 2015056214A JP 6588214 B2 JP6588214 B2 JP 6588214B2
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Geometry (AREA)
Description
前記電子部品と前記配線基板との間に充填された封止樹脂とを有し、前記ダミーパッドの最大幅は、前記ダミー配線部の幅よりも大きく設定され、前記ダミーパッド上の前記はんだのボリュームは、前記ダミー配線部上の前記はんだのボリュームよりも大きい電子部品装置が提供される。
図2及び図3は実施形態の配線基板を示す図、図4〜図7は実施形態の電子部品装置を製造する方法を説明するための図、図8は実施形態の電子部品装置を示す図である。
Claims (2)
- 最外配線層に形成される接続パッドと、
前記最外配線層に形成されるダミーパッドと、
前記最外配線層に形成され、前記接続パッドと前記ダミーパッドとを接続するダミー配線部とを
有する配線基板と、
電子部品のバンプが前記接続パッドにフリップチップ接続された前記電子部品と、
前記電子部品のバンプと、前記配線基板の接続パッド、前記ダミー配線部及び前記ダミーパッドに形成されたはんだと、
前記電子部品と前記配線基板との間に充填された封止樹脂とを有し、
前記ダミーパッドの最大幅は、前記ダミー配線部の幅よりも大きく設定され、前記ダミーパッド上の前記はんだのボリュームは、前記ダミー配線部上の前記はんだのボリュームよりも大きいことを特徴とする電子部品装置。 - 最外配線層として、接続パッドと、前記接続パッドに繋がるダミー配線部と、前記ダミー配線部に繋がるダミーパッドとを上面に備えた配線基板を用意する工程と、
前記配線基板の上にはんだ入り樹脂を形成する工程と、
電子部品のバンプを前記はんだ入り樹脂に押し込んで前記配線基板の接続パッドの上に配置すると共に、加熱処理により前記はんだ粒子を前記電子部品のバンプ、前記接続パッド、前記ダミー配線部、及び前記ダミーパッドに凝集させてはんだを形成する工程と
を有し、
前記接続パッド及び前記ダミーパッドの最大幅は、前記ダミー配線部の幅よりも大きく設定され、
前記はんだを形成する工程において、前記接続パッド及び前記電子部品のバンプに凝集するはんだを、前記ダミー配線部を介してダミーパッド側に流動させることで、前記電子部品のバンプに形成されるはんだのボリュームを調整することを特徴とする電子部品装置の製造方法。
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JP2015056214A JP6588214B2 (ja) | 2015-03-19 | 2015-03-19 | 電子部品装置と電子部品装置の製造方法 |
US15/012,017 US9633964B2 (en) | 2015-03-19 | 2016-02-01 | Wiring substrate and electronic component device |
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JP2015056214A JP6588214B2 (ja) | 2015-03-19 | 2015-03-19 | 電子部品装置と電子部品装置の製造方法 |
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JPH01102992A (ja) * | 1987-10-15 | 1989-04-20 | Mitsubishi Electric Corp | リフロー半田付けによる電子部品の実装方法 |
JPH03117864U (ja) * | 1990-03-16 | 1991-12-05 | ||
US5136365A (en) | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
JPH0488038U (ja) * | 1990-12-19 | 1992-07-30 | ||
JPH05121864A (ja) * | 1991-10-25 | 1993-05-18 | Nec Corp | 印刷配線板 |
JP2001085827A (ja) * | 1999-09-14 | 2001-03-30 | Fuji Xerox Co Ltd | プリント配線基板 |
JP2002076594A (ja) * | 2000-09-05 | 2002-03-15 | Hitachi Telecom Technol Ltd | プリント配線板 |
JP2002171051A (ja) * | 2000-12-04 | 2002-06-14 | Hitachi Telecom Technol Ltd | プリント配線板 |
JP4168346B2 (ja) * | 2004-12-07 | 2008-10-22 | 株式会社アドリンクス | 表面実装部品の実装構造 |
JP4887997B2 (ja) * | 2006-09-19 | 2012-02-29 | 日本電気株式会社 | 電子部品の実装方法 |
JP2008171975A (ja) * | 2007-01-11 | 2008-07-24 | Funai Electric Co Ltd | 半導体部品の実装構造及び実装方法 |
WO2009044695A1 (ja) * | 2007-10-05 | 2009-04-09 | Nec Corporation | 電子部品の実装方法等 |
JP5205066B2 (ja) * | 2008-01-18 | 2013-06-05 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5264585B2 (ja) * | 2009-03-24 | 2013-08-14 | パナソニック株式会社 | 電子部品接合方法および電子部品 |
JP5991915B2 (ja) * | 2012-12-27 | 2016-09-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP6215784B2 (ja) * | 2014-06-27 | 2017-10-18 | 京セラ株式会社 | 配線基板 |
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US20160276301A1 (en) | 2016-09-22 |
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