JP2010224582A - フォトレジスト組成物 - Google Patents
フォトレジスト組成物 Download PDFInfo
- Publication number
- JP2010224582A JP2010224582A JP2010153102A JP2010153102A JP2010224582A JP 2010224582 A JP2010224582 A JP 2010224582A JP 2010153102 A JP2010153102 A JP 2010153102A JP 2010153102 A JP2010153102 A JP 2010153102A JP 2010224582 A JP2010224582 A JP 2010224582A
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- JP
- Japan
- Prior art keywords
- photoacid labile
- photoacid
- adhesion promoting
- substrate
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims description 35
- 150000001875 compounds Chemical class 0.000 claims abstract description 18
- 230000001737 promoting effect Effects 0.000 claims description 47
- 229920000642 polymer Polymers 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 31
- 239000010410 layer Substances 0.000 claims description 26
- 239000011247 coating layer Substances 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 125000004185 ester group Chemical group 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 238000004377 microelectronic Methods 0.000 claims description 7
- 238000006467 substitution reaction Methods 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 6
- 125000001153 fluoro group Chemical group F* 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 229920001897 terpolymer Polymers 0.000 claims description 3
- 230000000536 complexating effect Effects 0.000 claims 1
- 239000000654 additive Substances 0.000 abstract description 40
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- 101000692259 Homo sapiens Phosphoprotein associated with glycosphingolipid-enriched microdomains 1 Proteins 0.000 description 9
- 102100026066 Phosphoprotein associated with glycosphingolipid-enriched microdomains 1 Human genes 0.000 description 9
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- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
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- 238000009987 spinning Methods 0.000 description 3
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- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical group FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 2
- JGTNAGYHADQMCM-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-M 0.000 description 2
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- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 125000004414 alkyl thio group Chemical group 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 150000001721 carbon Chemical class 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000007810 chemical reaction solvent Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 150000002367 halogens Chemical group 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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- 125000003718 tetrahydrofuranyl group Chemical group 0.000 description 2
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 150000003536 tetrazoles Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 125000004739 (C1-C6) alkylsulfonyl group Chemical group 0.000 description 1
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- DSSYKIVIOFKYAU-XCBNKYQSSA-N (R)-camphor Chemical group C1C[C@@]2(C)C(=O)C[C@@H]1C2(C)C DSSYKIVIOFKYAU-XCBNKYQSSA-N 0.000 description 1
- MNEXVZFQQPKDHC-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-nonadecafluorononane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F MNEXVZFQQPKDHC-UHFFFAOYSA-M 0.000 description 1
- FNQJDLTXOVEEFB-UHFFFAOYSA-N 1,2,3-benzothiadiazole Chemical class C1=CC=C2SN=NC2=C1 FNQJDLTXOVEEFB-UHFFFAOYSA-N 0.000 description 1
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 description 1
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- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
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- 125000006574 non-aromatic ring group Chemical group 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 150000002976 peresters Chemical class 0.000 description 1
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- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
【解決手段】本発明のフォトレジストは、フォト酸レイビル基を有する樹脂、1以上のフォト酸発生化合物、および接着促進添加化合物を含む。本発明のフォトレジストは、SiONおよび他の無機表面層に対して著しい接着性を示すことができる。
【選択図】なし
Description
が挙げられる。
Yは水素、酸素とZ基を結合する化学結合、(−CH2−)p基(式中、pは1または2である)、−CH2O−基、またはCHRO−基(式中、RはC1−16アルキル、好ましくはC1−4アルキルである)である;
Zはアルキル、好ましくは1〜約20個の炭素原子を有するアルキルであり、トリ(C1−6)アルキルメチル;テトラヒドロピラニル;またはテトラヒドロフラニルを包含する;
好ましくはXは−OCH2−であり;好ましくはYは結合または、−CH2O−であり;好ましくはZはt−ブチル、メチル、テトラヒドロピラニルまたはテトラヒドロフラニルである)
の基を含むことができる。
特定の成分を後記の量において混合することにより、フォトレジスト1、2および3を調製した。テトラフルオロエチレン(TFE)(31モル%モノマー装填)、ヘキサフルオロ−イソ−プロパノールで置換されたノルボルネン(46モル%モノマー装填)、およびt−ブチルアクリレート(24モル%モノマー装填)の重合によりフォト酸レイビルポリマーを調製した。
以下に記載の成分を以下に記載の量において混合することにより以下のフォトレジスト4および5を調製した。テトラフルオロエチレン(TFE)(31モル%モノマー装填)、ヘキサフルオロ−イソ−プロパノールで置換されたノルボルネン(46モル%モノマー装填)、およびテトラブチルアクリレート(24モル%モノマー装填)の重合によりフォト酸レイビルポリマーを調製した。
Claims (8)
- 酸窒化シリコン層、
該酸窒化シリコン層上のフォトレジスト組成物コーティング層
を含むマイクロエレクトロニックデバイス基体であって、該フォトレジスト組成物が、フォト酸レイビルポリマーと、フォト酸発生化合物と、1以上のエポキシ部分を含む接着促進成分とを含むマイクロエレクトロニックデバイス基体。 - 接着促進成分が、該フォトレジスト組成物のリソグラフィー加工中に酸窒化シリコン層と反応するかまたは錯体形成できる請求項1記載の基体。
- 接着促進成分がフォト酸レイビル部位を含まない請求項1記載の基体。
- フォト酸レイビルポリマーがフッ素置換を有する請求項1記載の基体。
- フォト酸レイビルポリマーがアクリレート繰り返し単位を含む請求項1記載の基体。
- フォト酸レイビルポリマーが、フォト酸レイビルエステル基を含む請求項1記載の基体。
- 酸窒化シリコン層、
該酸窒化シリコン層上のフォトレジスト組成物コーティング層
を含むマイクロエレクトロニックデバイス基体であって、該フォトレジスト組成物が、(i)フォト酸レイビルエステル基を含むフォト酸レイビルポリマーと、(ii)フォト酸発生化合物と、(iii)1以上のエポキシ部分を含む接着促進成分とを含むマイクロエレクトロニックデバイス基体。 - フォト酸レイビルポリマーが、ターポリマーである請求項7記載の基体。
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US36112302P | 2002-03-01 | 2002-03-01 |
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JP (2) | JP2004038140A (ja) |
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TW (1) | TW200401164A (ja) |
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EP0537524A1 (en) * | 1991-10-17 | 1993-04-21 | Shipley Company Inc. | Radiation sensitive compositions and methods |
US6740464B2 (en) * | 2000-01-14 | 2004-05-25 | Fuji Photo Film Co., Ltd. | Lithographic printing plate precursor |
TW200401164A (en) | 2002-03-01 | 2004-01-16 | Shipley Co Llc | Photoresist compositions |
TW200403522A (en) * | 2002-03-01 | 2004-03-01 | Shipley Co Llc | Photoresist compositions |
JP2004004703A (ja) * | 2002-04-03 | 2004-01-08 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
US8012670B2 (en) | 2002-04-11 | 2011-09-06 | Rohm And Haas Electronic Materials Llc | Photoresist systems |
KR100576477B1 (ko) * | 2003-10-06 | 2006-05-10 | 주식회사 하이닉스반도체 | 포토레지스트 세정액 조성물 및 이를 이용한 패턴 형성방법 |
JP2011186432A (ja) * | 2009-12-15 | 2011-09-22 | Rohm & Haas Electronic Materials Llc | フォトレジストおよびその使用方法 |
JP5964615B2 (ja) * | 2011-03-28 | 2016-08-03 | 住友化学株式会社 | ポジ型レジスト組成物 |
US8728714B2 (en) * | 2011-11-17 | 2014-05-20 | Micron Technology, Inc. | Methods for adhering materials, for enhancing adhesion between materials, and for patterning materials, and related semiconductor device structures |
CN104460232B (zh) * | 2013-09-24 | 2019-11-15 | 住友化学株式会社 | 光致抗蚀剂组合物 |
JP6237551B2 (ja) * | 2014-09-18 | 2017-11-29 | 信越化学工業株式会社 | レジスト組成物及びパターン形成方法 |
KR102239212B1 (ko) * | 2018-12-14 | 2021-04-12 | 주식회사 엘지화학 | 포토폴리머 조성물 |
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JP2003122007A (ja) * | 2001-10-09 | 2003-04-25 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
JP2003241386A (ja) * | 2001-12-13 | 2003-08-27 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
JP2003195505A (ja) * | 2001-12-27 | 2003-07-09 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
Also Published As
Publication number | Publication date |
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EP1341041A2 (en) | 2003-09-03 |
JP2004038140A (ja) | 2004-02-05 |
TW200401164A (en) | 2004-01-16 |
US7220486B2 (en) | 2007-05-22 |
JP4616931B2 (ja) | 2011-01-19 |
US20030219603A1 (en) | 2003-11-27 |
KR100998068B1 (ko) | 2010-12-03 |
EP1341041A3 (en) | 2003-12-17 |
KR20040002448A (ko) | 2004-01-07 |
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