JP2010211179A - 光電気複合配線モジュールおよびその製造方法 - Google Patents

光電気複合配線モジュールおよびその製造方法 Download PDF

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Publication number
JP2010211179A
JP2010211179A JP2009233978A JP2009233978A JP2010211179A JP 2010211179 A JP2010211179 A JP 2010211179A JP 2009233978 A JP2009233978 A JP 2009233978A JP 2009233978 A JP2009233978 A JP 2009233978A JP 2010211179 A JP2010211179 A JP 2010211179A
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JP
Japan
Prior art keywords
optical element
optical
circuit board
wiring
wiring module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009233978A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010211179A5 (enExample
Inventor
Naoki Matsushima
直樹 松嶋
Tokuo Nakajo
徳男 中條
Yasunobu Matsuoka
康信 松岡
Toshiki Sugawara
俊樹 菅原
Madoka Minagawa
円 皆川
Saori Hamamura
沙織 濱村
Satoshi Kaneko
聡 金子
Tsutomu Kono
勉 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2009233978A priority Critical patent/JP2010211179A/ja
Priority to US12/623,686 priority patent/US8401347B2/en
Priority to CN200910251208.XA priority patent/CN101900859B/zh
Priority to KR1020090118963A priority patent/KR20100092861A/ko
Publication of JP2010211179A publication Critical patent/JP2010211179A/ja
Publication of JP2010211179A5 publication Critical patent/JP2010211179A5/ja
Priority to KR1020120053251A priority patent/KR101238977B1/ko
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
JP2009233978A 2009-02-13 2009-10-08 光電気複合配線モジュールおよびその製造方法 Pending JP2010211179A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009233978A JP2010211179A (ja) 2009-02-13 2009-10-08 光電気複合配線モジュールおよびその製造方法
US12/623,686 US8401347B2 (en) 2009-02-13 2009-11-23 Photoelectric composite wiring module and method for manufacturing the same
CN200910251208.XA CN101900859B (zh) 2009-02-13 2009-12-02 光电复合布线模块及其制造方法
KR1020090118963A KR20100092861A (ko) 2009-02-13 2009-12-03 광 전기 복합 배선 모듈 및 그 제조 방법
KR1020120053251A KR101238977B1 (ko) 2009-02-13 2012-05-18 광 전기 복합 배선 모듈 및 그 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009030637 2009-02-13
JP2009233978A JP2010211179A (ja) 2009-02-13 2009-10-08 光電気複合配線モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2010211179A true JP2010211179A (ja) 2010-09-24
JP2010211179A5 JP2010211179A5 (enExample) 2012-02-09

Family

ID=42559962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009233978A Pending JP2010211179A (ja) 2009-02-13 2009-10-08 光電気複合配線モジュールおよびその製造方法

Country Status (4)

Country Link
US (1) US8401347B2 (enExample)
JP (1) JP2010211179A (enExample)
KR (2) KR20100092861A (enExample)
CN (1) CN101900859B (enExample)

Cited By (7)

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JP2014089262A (ja) * 2012-10-29 2014-05-15 Shinko Electric Ind Co Ltd 光導波路、光モジュール及び光導波路の製造方法
KR101856229B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
KR101856230B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
WO2018180785A1 (ja) * 2017-03-30 2018-10-04 京セラ株式会社 光電気配線基板
WO2019117035A1 (ja) * 2017-12-12 2019-06-20 日東電工株式会社 光電気混載基板
JP2021107919A (ja) * 2019-12-27 2021-07-29 日東電工株式会社 光電気混載基板
JP2021174917A (ja) * 2020-04-28 2021-11-01 日本電信電話株式会社 配線基板およびモジュール

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DE102009001930B4 (de) * 2009-03-27 2018-01-04 Robert Bosch Gmbh Sensorbaustein
EP2428828B1 (en) * 2010-09-13 2016-06-29 Tyco Electronics Svenska Holdings AB Miniaturized high speed optical module
WO2012069929A1 (en) * 2010-11-25 2012-05-31 Fci Optical circuit board
KR101256000B1 (ko) * 2011-04-13 2013-04-18 엘지이노텍 주식회사 광 모듈용 인터포저 및 이를 이용한 광모듈, 인터포저의 제조방법
WO2013085225A1 (en) * 2011-12-08 2013-06-13 Lg Innotek Co., Ltd. Optical printed circuit board and method of manufacturing the same
WO2013095426A1 (en) * 2011-12-21 2013-06-27 Intel Corporation Fabrication of planar light-wave circuits (plcs) for optical i/o
JP6136545B2 (ja) * 2013-05-07 2017-05-31 日立金属株式会社 光配線基板、光配線基板の製造方法、及び光モジュール
CN105493341A (zh) * 2013-09-02 2016-04-13 株式会社村田制作所 隔离器
JP6287105B2 (ja) * 2013-11-22 2018-03-07 ソニー株式会社 光通信デバイス、受信装置、送信装置及び送受信システム
AT14563U1 (de) * 2014-03-31 2016-01-15 At&S Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit zumindest einer optoelektronischen Komponente
JP6610540B2 (ja) * 2014-05-13 2019-11-27 ソニー株式会社 光電モジュール
CN108627845B (zh) * 2017-03-15 2021-05-28 信泰光学(深圳)有限公司 雷射驱动电路的电路布局结构
CN109752804B (zh) * 2017-11-06 2020-11-10 松下知识产权经营株式会社 光模块构造体
TWI851794B (zh) * 2019-08-22 2024-08-11 美商光程研創股份有限公司 光電流放大裝置及光電偵測裝置之操作方法
CN115298589A (zh) * 2020-03-19 2022-11-04 日东电工株式会社 光电传输复合模块
US12085769B2 (en) * 2021-04-23 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit device and method
KR20230082333A (ko) * 2021-12-01 2023-06-08 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 패키지

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WO1999017142A1 (fr) * 1997-10-01 1999-04-08 Hitachi Chemical Company, Ltd. Processeur optique d'informations
JP2004163722A (ja) * 2002-11-14 2004-06-10 Fujitsu Ltd 部品内蔵基板
JP2004274155A (ja) * 2003-03-05 2004-09-30 Canon Inc 光接続装置、及びこれを含む光電気混載装置
JP2006270037A (ja) * 2005-02-28 2006-10-05 Sony Corp ハイブリットモジュール及びその製造方法並びにハイブリット回路装置
JP2007183522A (ja) * 2005-01-19 2007-07-19 Bridgestone Corp 光デバイスおよびその製造方法

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WO1999017142A1 (fr) * 1997-10-01 1999-04-08 Hitachi Chemical Company, Ltd. Processeur optique d'informations
JP2004163722A (ja) * 2002-11-14 2004-06-10 Fujitsu Ltd 部品内蔵基板
JP2004274155A (ja) * 2003-03-05 2004-09-30 Canon Inc 光接続装置、及びこれを含む光電気混載装置
JP2007183522A (ja) * 2005-01-19 2007-07-19 Bridgestone Corp 光デバイスおよびその製造方法
JP2006270037A (ja) * 2005-02-28 2006-10-05 Sony Corp ハイブリットモジュール及びその製造方法並びにハイブリット回路装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101856229B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
KR101856230B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
JP2014089262A (ja) * 2012-10-29 2014-05-15 Shinko Electric Ind Co Ltd 光導波路、光モジュール及び光導波路の製造方法
WO2018180785A1 (ja) * 2017-03-30 2018-10-04 京セラ株式会社 光電気配線基板
WO2019117035A1 (ja) * 2017-12-12 2019-06-20 日東電工株式会社 光電気混載基板
JP2019105718A (ja) * 2017-12-12 2019-06-27 日東電工株式会社 光電気混載基板
JP7176842B2 (ja) 2017-12-12 2022-11-22 日東電工株式会社 光電気混載基板
JP2021107919A (ja) * 2019-12-27 2021-07-29 日東電工株式会社 光電気混載基板
JP7680205B2 (ja) 2019-12-27 2025-05-20 日東電工株式会社 光電気混載基板
JP2021174917A (ja) * 2020-04-28 2021-11-01 日本電信電話株式会社 配線基板およびモジュール

Also Published As

Publication number Publication date
US20100209041A1 (en) 2010-08-19
KR20100092861A (ko) 2010-08-23
KR20120061788A (ko) 2012-06-13
CN101900859A (zh) 2010-12-01
KR101238977B1 (ko) 2013-03-04
CN101900859B (zh) 2014-11-05
US8401347B2 (en) 2013-03-19

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