KR20100092861A - 광 전기 복합 배선 모듈 및 그 제조 방법 - Google Patents

광 전기 복합 배선 모듈 및 그 제조 방법 Download PDF

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Publication number
KR20100092861A
KR20100092861A KR1020090118963A KR20090118963A KR20100092861A KR 20100092861 A KR20100092861 A KR 20100092861A KR 1020090118963 A KR1020090118963 A KR 1020090118963A KR 20090118963 A KR20090118963 A KR 20090118963A KR 20100092861 A KR20100092861 A KR 20100092861A
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KR
South Korea
Prior art keywords
optical element
circuit board
optical
wiring
semiconductor element
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Ceased
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KR1020090118963A
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English (en)
Korean (ko)
Inventor
나오끼 마쯔시마
노리오 주조
야스노부 마쯔오까
도시끼 스가와라
마도까 미나가와
사오리 하마무라
사또시 가네꼬
쯔또무 고노
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
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Publication of KR20100092861A publication Critical patent/KR20100092861A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
KR1020090118963A 2009-02-13 2009-12-03 광 전기 복합 배선 모듈 및 그 제조 방법 Ceased KR20100092861A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009030637 2009-02-13
JPJP-P-2009-030637 2009-02-13
JPJP-P-2009-233978 2009-10-08
JP2009233978A JP2010211179A (ja) 2009-02-13 2009-10-08 光電気複合配線モジュールおよびその製造方法

Related Child Applications (1)

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KR1020120053251A Division KR101238977B1 (ko) 2009-02-13 2012-05-18 광 전기 복합 배선 모듈 및 그 제조 방법

Publications (1)

Publication Number Publication Date
KR20100092861A true KR20100092861A (ko) 2010-08-23

Family

ID=42559962

Family Applications (2)

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KR1020090118963A Ceased KR20100092861A (ko) 2009-02-13 2009-12-03 광 전기 복합 배선 모듈 및 그 제조 방법
KR1020120053251A Expired - Fee Related KR101238977B1 (ko) 2009-02-13 2012-05-18 광 전기 복합 배선 모듈 및 그 제조 방법

Family Applications After (1)

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KR1020120053251A Expired - Fee Related KR101238977B1 (ko) 2009-02-13 2012-05-18 광 전기 복합 배선 모듈 및 그 제조 방법

Country Status (4)

Country Link
US (1) US8401347B2 (enExample)
JP (1) JP2010211179A (enExample)
KR (2) KR20100092861A (enExample)
CN (1) CN101900859B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012141541A3 (en) * 2011-04-13 2013-03-14 Lg Innotek Co., Ltd. Interposer for optical module, optical module using the same, method for manufacturing the same

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009001930B4 (de) * 2009-03-27 2018-01-04 Robert Bosch Gmbh Sensorbaustein
EP2428828B1 (en) * 2010-09-13 2016-06-29 Tyco Electronics Svenska Holdings AB Miniaturized high speed optical module
EP2643725A1 (en) * 2010-11-25 2013-10-02 Fci Optical circuit board
CN104115043B (zh) * 2011-12-08 2019-09-17 Lg伊诺特有限公司 光学印刷电路板及其制造方法
KR101856229B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
KR101856230B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
WO2013095426A1 (en) * 2011-12-21 2013-06-27 Intel Corporation Fabrication of planar light-wave circuits (plcs) for optical i/o
JP6105254B2 (ja) * 2012-10-29 2017-03-29 新光電気工業株式会社 光導波路積層配線基板、光モジュール及び光導波路積層配線基板の製造方法
JP6136545B2 (ja) * 2013-05-07 2017-05-31 日立金属株式会社 光配線基板、光配線基板の製造方法、及び光モジュール
WO2015029680A1 (ja) * 2013-09-02 2015-03-05 株式会社村田製作所 アイソレータ
JP6287105B2 (ja) * 2013-11-22 2018-03-07 ソニー株式会社 光通信デバイス、受信装置、送信装置及び送受信システム
AT14563U1 (de) * 2014-03-31 2016-01-15 At&S Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit zumindest einer optoelektronischen Komponente
JP6610540B2 (ja) * 2014-05-13 2019-11-27 ソニー株式会社 光電モジュール
CN108627845B (zh) * 2017-03-15 2021-05-28 信泰光学(深圳)有限公司 雷射驱动电路的电路布局结构
JP2018169552A (ja) * 2017-03-30 2018-11-01 京セラ株式会社 光電気配線基板
CN109752804B (zh) * 2017-11-06 2020-11-10 松下知识产权经营株式会社 光模块构造体
JP7176842B2 (ja) * 2017-12-12 2022-11-22 日東電工株式会社 光電気混載基板
US12015384B2 (en) * 2019-08-22 2024-06-18 Artilux, Inc. Photo-current amplification apparatus
US12271044B2 (en) * 2019-12-27 2025-04-08 Nitto Denko Corporation Opto-electric hybrid board
JP7681567B2 (ja) * 2020-03-19 2025-05-22 日東電工株式会社 光電気伝送複合モジュール
JP2021174917A (ja) * 2020-04-28 2021-11-01 日本電信電話株式会社 配線基板およびモジュール
US12085769B2 (en) * 2021-04-23 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit device and method
KR20230082333A (ko) * 2021-12-01 2023-06-08 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 패키지

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693736B1 (en) * 1992-09-10 2004-02-17 Fujitsu Limited Optical circuit system and components of same
JP2004233991A (ja) 1997-10-01 2004-08-19 Hitachi Chem Co Ltd 光情報処理装置
JP3531609B2 (ja) * 1997-10-01 2004-05-31 日立化成工業株式会社 光情報処理装置
JP2001183556A (ja) 1999-12-27 2001-07-06 Toppan Printing Co Ltd マルチチップモジュール基板及びマルチチップモジュール
JP3750649B2 (ja) * 2001-12-25 2006-03-01 住友電気工業株式会社 光通信装置
JP3882738B2 (ja) * 2002-10-24 2007-02-21 ソニー株式会社 複合チップモジュール及びその製造方法、並びに複合チップユニット及びその製造方法
JP2004163722A (ja) * 2002-11-14 2004-06-10 Fujitsu Ltd 部品内蔵基板
JP2004177521A (ja) 2002-11-25 2004-06-24 Fujitsu Ltd 光電気複合回路基板
JP3897688B2 (ja) * 2002-12-11 2007-03-28 キヤノン株式会社 光電融合配線基板
JP3913175B2 (ja) * 2003-01-06 2007-05-09 キヤノン株式会社 光回路装置における情報伝達方法
JP3927913B2 (ja) * 2003-03-05 2007-06-13 キヤノン株式会社 光電気混載装置、及びその駆動方法
JP4845333B2 (ja) 2003-04-11 2011-12-28 株式会社リコー 光電変換素子パッケージ、その作製方法及び光コネクタ
US6985645B2 (en) * 2003-09-24 2006-01-10 International Business Machines Corporation Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines
WO2005052666A1 (ja) * 2003-11-27 2005-06-09 Ibiden Co., Ltd. Ｉｃチップ実装用基板、マザーボード用基板、光通信用デバイス、ｉｃチップ実装用基板の製造方法、および、マザーボード用基板の製造方法
US7271461B2 (en) * 2004-02-27 2007-09-18 Banpil Photonics Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
US7092603B2 (en) * 2004-03-03 2006-08-15 Fujitsu Limited Optical bridge for chip-to-board interconnection and methods of fabrication
CN100437185C (zh) 2004-09-02 2008-11-26 日本电气株式会社 光电复合组件
JP2006133763A (ja) 2004-10-07 2006-05-25 Nec Corp Ｌｓｉパッケージの光電気配線板への実装構造、実装方法、情報処理装置、光インタフェース、光電気配線板
JP2007183522A (ja) * 2005-01-19 2007-07-19 Bridgestone Corp 光デバイスおよびその製造方法
JP4810958B2 (ja) * 2005-02-28 2011-11-09 ソニー株式会社 ハイブリット回路装置
WO2006095676A1 (ja) * 2005-03-07 2006-09-14 Rohm Co., Ltd. 光通信モジュールおよびその製造方法
JP4533283B2 (ja) * 2005-08-29 2010-09-01 新光電気工業株式会社 半導体装置の製造方法
TWI309549B (en) * 2005-08-29 2009-05-01 Via Tech Inc Printed circuit board with improved thermal dissipating structure and electronic device with the same
US7778501B2 (en) * 2007-04-03 2010-08-17 Hewlett-Packard Development Company, L.P. Integrated circuits having photonic interconnect layers and methods for fabricating same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012141541A3 (en) * 2011-04-13 2013-03-14 Lg Innotek Co., Ltd. Interposer for optical module, optical module using the same, method for manufacturing the same
KR101256000B1 (ko) * 2011-04-13 2013-04-18 엘지이노텍 주식회사 광 모듈용 인터포저 및 이를 이용한 광모듈, 인터포저의 제조방법
US9025913B2 (en) 2011-04-13 2015-05-05 Lg Innotek Co., Ltd. Interposer for optical module, optical module using the same, method for manufacturing the same

Also Published As

Publication number Publication date
CN101900859A (zh) 2010-12-01
US20100209041A1 (en) 2010-08-19
CN101900859B (zh) 2014-11-05
KR101238977B1 (ko) 2013-03-04
US8401347B2 (en) 2013-03-19
JP2010211179A (ja) 2010-09-24
KR20120061788A (ko) 2012-06-13

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