CN101900859B - 光电复合布线模块及其制造方法 - Google Patents

光电复合布线模块及其制造方法 Download PDF

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Publication number
CN101900859B
CN101900859B CN200910251208.XA CN200910251208A CN101900859B CN 101900859 B CN101900859 B CN 101900859B CN 200910251208 A CN200910251208 A CN 200910251208A CN 101900859 B CN101900859 B CN 101900859B
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CN
China
Prior art keywords
optical element
optical
wiring
module according
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200910251208.XA
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English (en)
Chinese (zh)
Other versions
CN101900859A (zh
Inventor
松岛直树
中条德男
松冈康信
菅原俊树
皆川圆
滨村沙织
金子聪
河野勉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN101900859A publication Critical patent/CN101900859A/zh
Application granted granted Critical
Publication of CN101900859B publication Critical patent/CN101900859B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
CN200910251208.XA 2009-02-13 2009-12-02 光电复合布线模块及其制造方法 Expired - Fee Related CN101900859B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009-030637 2009-02-13
JP2009030637 2009-02-13
JP2009-233978 2009-10-08
JP2009233978A JP2010211179A (ja) 2009-02-13 2009-10-08 光電気複合配線モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
CN101900859A CN101900859A (zh) 2010-12-01
CN101900859B true CN101900859B (zh) 2014-11-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910251208.XA Expired - Fee Related CN101900859B (zh) 2009-02-13 2009-12-02 光电复合布线模块及其制造方法

Country Status (4)

Country Link
US (1) US8401347B2 (enExample)
JP (1) JP2010211179A (enExample)
KR (2) KR20100092861A (enExample)
CN (1) CN101900859B (enExample)

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WO2012069929A1 (en) * 2010-11-25 2012-05-31 Fci Optical circuit board
KR101256000B1 (ko) * 2011-04-13 2013-04-18 엘지이노텍 주식회사 광 모듈용 인터포저 및 이를 이용한 광모듈, 인터포저의 제조방법
KR101856229B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
KR101856230B1 (ko) * 2011-12-09 2018-05-09 엘지이노텍 주식회사 광 인쇄회로기판 및 그의 제조 방법
WO2013085225A1 (en) * 2011-12-08 2013-06-13 Lg Innotek Co., Ltd. Optical printed circuit board and method of manufacturing the same
WO2013095426A1 (en) * 2011-12-21 2013-06-27 Intel Corporation Fabrication of planar light-wave circuits (plcs) for optical i/o
JP6105254B2 (ja) * 2012-10-29 2017-03-29 新光電気工業株式会社 光導波路積層配線基板、光モジュール及び光導波路積層配線基板の製造方法
JP6136545B2 (ja) * 2013-05-07 2017-05-31 日立金属株式会社 光配線基板、光配線基板の製造方法、及び光モジュール
CN105493341A (zh) * 2013-09-02 2016-04-13 株式会社村田制作所 隔离器
JP6287105B2 (ja) * 2013-11-22 2018-03-07 ソニー株式会社 光通信デバイス、受信装置、送信装置及び送受信システム
AT14563U1 (de) * 2014-03-31 2016-01-15 At&S Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit zumindest einer optoelektronischen Komponente
JP6610540B2 (ja) * 2014-05-13 2019-11-27 ソニー株式会社 光電モジュール
CN108627845B (zh) * 2017-03-15 2021-05-28 信泰光学(深圳)有限公司 雷射驱动电路的电路布局结构
JP2018169552A (ja) * 2017-03-30 2018-11-01 京セラ株式会社 光電気配線基板
CN109752804B (zh) * 2017-11-06 2020-11-10 松下知识产权经营株式会社 光模块构造体
JP7176842B2 (ja) * 2017-12-12 2022-11-22 日東電工株式会社 光電気混載基板
TWI851794B (zh) * 2019-08-22 2024-08-11 美商光程研創股份有限公司 光電流放大裝置及光電偵測裝置之操作方法
JP7680205B2 (ja) * 2019-12-27 2025-05-20 日東電工株式会社 光電気混載基板
CN115298589A (zh) * 2020-03-19 2022-11-04 日东电工株式会社 光电传输复合模块
JP2021174917A (ja) * 2020-04-28 2021-11-01 日本電信電話株式会社 配線基板およびモジュール
US12085769B2 (en) * 2021-04-23 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit device and method
KR20230082333A (ko) * 2021-12-01 2023-06-08 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 패키지

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Also Published As

Publication number Publication date
JP2010211179A (ja) 2010-09-24
US20100209041A1 (en) 2010-08-19
KR20100092861A (ko) 2010-08-23
KR20120061788A (ko) 2012-06-13
CN101900859A (zh) 2010-12-01
KR101238977B1 (ko) 2013-03-04
US8401347B2 (en) 2013-03-19

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20141105

Termination date: 20181202