JP2010199492A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP2010199492A
JP2010199492A JP2009045570A JP2009045570A JP2010199492A JP 2010199492 A JP2010199492 A JP 2010199492A JP 2009045570 A JP2009045570 A JP 2009045570A JP 2009045570 A JP2009045570 A JP 2009045570A JP 2010199492 A JP2010199492 A JP 2010199492A
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Prior art keywords
island
lead
wire
semiconductor device
metal
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JP2009045570A
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English (en)
Japanese (ja)
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JP2010199492A5 (enExample
Inventor
Masakazu Watanabe
昌和 渡辺
Takashi Kuramochi
貴 倉持
Masahiro Hatauchi
政弘 畑内
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Sanyo Electric Co Ltd
System Solutions Co Ltd
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Sanyo Electric Co Ltd
Sanyo Semiconductor Co Ltd
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Application filed by Sanyo Electric Co Ltd, Sanyo Semiconductor Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2009045570A priority Critical patent/JP2010199492A/ja
Priority to US13/203,447 priority patent/US8633511B2/en
Priority to PCT/JP2010/053489 priority patent/WO2010098501A1/ja
Priority to CN201080009373.5A priority patent/CN102334186B/zh
Publication of JP2010199492A publication Critical patent/JP2010199492A/ja
Publication of JP2010199492A5 publication Critical patent/JP2010199492A5/ja
Pending legal-status Critical Current

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2009045570A 2009-02-27 2009-02-27 半導体装置およびその製造方法 Pending JP2010199492A (ja)

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US13/203,447 US8633511B2 (en) 2009-02-27 2010-02-25 Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
PCT/JP2010/053489 WO2010098501A1 (ja) 2009-02-27 2010-02-25 半導体装置およびその製造方法
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JP2019054296A (ja) * 2019-01-10 2019-04-04 京セラ株式会社 パワー半導体モジュール
JP2023075744A (ja) * 2021-11-19 2023-05-31 住友電気工業株式会社 半導体装置
JP2024080210A (ja) * 2022-12-02 2024-06-13 三菱電機株式会社 半導体装置

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JP6161251B2 (ja) * 2012-10-17 2017-07-12 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2014064822A1 (ja) * 2012-10-26 2014-05-01 株式会社日立産機システム パワー半導体モジュールおよびこれを搭載した電力変換装置
US10205330B2 (en) 2015-07-27 2019-02-12 Semiconductor Components Industries, Llc Programmable battery protection system and related methods
US10290907B2 (en) 2015-07-27 2019-05-14 Semiconductor Components Industries, Llc Automatically programmable battery protection system and related methods
US10186498B2 (en) 2015-07-27 2019-01-22 Semiconductor Components Industries, Llc Semiconductor leadframes and packages with solder dams and related methods
US9997476B2 (en) 2015-10-30 2018-06-12 Infineon Technologies Ag Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
US10453781B2 (en) * 2016-03-11 2019-10-22 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device

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JPH0350758A (ja) * 1989-07-18 1991-03-05 Toshiba Corp 樹脂封止型半導体装置
US5309322A (en) * 1992-10-13 1994-05-03 Motorola, Inc. Leadframe strip for semiconductor packages and method
JPH06177312A (ja) 1992-12-08 1994-06-24 Fuji Electric Co Ltd 半導体装置およびリードフレーム
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US5739582A (en) * 1995-11-24 1998-04-14 Xerox Corporation Method of packaging a high voltage device array in a multi-chip module
JP3308461B2 (ja) * 1996-11-14 2002-07-29 富士通株式会社 半導体装置及びリードフレーム
JP3474736B2 (ja) * 1997-08-29 2003-12-08 トリニティ工業株式会社 空調装置の温湿度制御装置と温湿度制御方法
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JP2001320009A (ja) 2000-05-10 2001-11-16 Matsushita Electric Ind Co Ltd 半導体装置
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JP2019054296A (ja) * 2019-01-10 2019-04-04 京セラ株式会社 パワー半導体モジュール
JP2023075744A (ja) * 2021-11-19 2023-05-31 住友電気工業株式会社 半導体装置
JP7655201B2 (ja) 2021-11-19 2025-04-02 住友電気工業株式会社 半導体装置
JP2024080210A (ja) * 2022-12-02 2024-06-13 三菱電機株式会社 半導体装置

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