JP2010199492A5 - - Google Patents

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Publication number
JP2010199492A5
JP2010199492A5 JP2009045570A JP2009045570A JP2010199492A5 JP 2010199492 A5 JP2010199492 A5 JP 2010199492A5 JP 2009045570 A JP2009045570 A JP 2009045570A JP 2009045570 A JP2009045570 A JP 2009045570A JP 2010199492 A5 JP2010199492 A5 JP 2010199492A5
Authority
JP
Japan
Prior art keywords
island
semiconductor device
manufacturing
metal fine
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009045570A
Other languages
English (en)
Japanese (ja)
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JP2010199492A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009045570A priority Critical patent/JP2010199492A/ja
Priority claimed from JP2009045570A external-priority patent/JP2010199492A/ja
Priority to US13/203,447 priority patent/US8633511B2/en
Priority to CN201080009373.5A priority patent/CN102334186B/zh
Priority to PCT/JP2010/053489 priority patent/WO2010098501A1/ja
Publication of JP2010199492A publication Critical patent/JP2010199492A/ja
Publication of JP2010199492A5 publication Critical patent/JP2010199492A5/ja
Pending legal-status Critical Current

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JP2009045570A 2009-02-27 2009-02-27 半導体装置およびその製造方法 Pending JP2010199492A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009045570A JP2010199492A (ja) 2009-02-27 2009-02-27 半導体装置およびその製造方法
US13/203,447 US8633511B2 (en) 2009-02-27 2010-02-25 Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
CN201080009373.5A CN102334186B (zh) 2009-02-27 2010-02-25 半导体装置及其制造方法
PCT/JP2010/053489 WO2010098501A1 (ja) 2009-02-27 2010-02-25 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009045570A JP2010199492A (ja) 2009-02-27 2009-02-27 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2010199492A JP2010199492A (ja) 2010-09-09
JP2010199492A5 true JP2010199492A5 (enExample) 2011-10-20

Family

ID=42665695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009045570A Pending JP2010199492A (ja) 2009-02-27 2009-02-27 半導体装置およびその製造方法

Country Status (4)

Country Link
US (1) US8633511B2 (enExample)
JP (1) JP2010199492A (enExample)
CN (1) CN102334186B (enExample)
WO (1) WO2010098501A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6161251B2 (ja) * 2012-10-17 2017-07-12 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2014064822A1 (ja) * 2012-10-26 2014-05-01 株式会社日立産機システム パワー半導体モジュールおよびこれを搭載した電力変換装置
US10205330B2 (en) 2015-07-27 2019-02-12 Semiconductor Components Industries, Llc Programmable battery protection system and related methods
US10186498B2 (en) 2015-07-27 2019-01-22 Semiconductor Components Industries, Llc Semiconductor leadframes and packages with solder dams and related methods
US10290907B2 (en) 2015-07-27 2019-05-14 Semiconductor Components Industries, Llc Automatically programmable battery protection system and related methods
US9997476B2 (en) 2015-10-30 2018-06-12 Infineon Technologies Ag Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
US10453781B2 (en) * 2016-03-11 2019-10-22 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device
JP2019054296A (ja) * 2019-01-10 2019-04-04 京セラ株式会社 パワー半導体モジュール
JP7655201B2 (ja) 2021-11-19 2025-04-02 住友電気工業株式会社 半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183129A (ja) 1988-01-18 1989-07-20 Fujitsu Ltd 半導体装置
JPH0350758A (ja) * 1989-07-18 1991-03-05 Toshiba Corp 樹脂封止型半導体装置
US5309322A (en) * 1992-10-13 1994-05-03 Motorola, Inc. Leadframe strip for semiconductor packages and method
JPH06177312A (ja) 1992-12-08 1994-06-24 Fuji Electric Co Ltd 半導体装置およびリードフレーム
US5625235A (en) * 1995-06-15 1997-04-29 National Semiconductor Corporation Multichip integrated circuit module with crossed bonding wires
US5739582A (en) * 1995-11-24 1998-04-14 Xerox Corporation Method of packaging a high voltage device array in a multi-chip module
JP3308461B2 (ja) * 1996-11-14 2002-07-29 富士通株式会社 半導体装置及びリードフレーム
JP3474736B2 (ja) * 1997-08-29 2003-12-08 トリニティ工業株式会社 空調装置の温湿度制御装置と温湿度制御方法
KR100335481B1 (ko) 1999-09-13 2002-05-04 김덕중 멀티 칩 패키지 구조의 전력소자
JP2001320009A (ja) 2000-05-10 2001-11-16 Matsushita Electric Ind Co Ltd 半導体装置
TWI236126B (en) * 2002-07-02 2005-07-11 Alpha & Omega Semiconductor Integrated circuit package for semiconductor devices with improved electric resistance and inductance

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