JP2009158978A5 - - Google Patents

Download PDF

Info

Publication number
JP2009158978A5
JP2009158978A5 JP2009096178A JP2009096178A JP2009158978A5 JP 2009158978 A5 JP2009158978 A5 JP 2009158978A5 JP 2009096178 A JP2009096178 A JP 2009096178A JP 2009096178 A JP2009096178 A JP 2009096178A JP 2009158978 A5 JP2009158978 A5 JP 2009158978A5
Authority
JP
Japan
Prior art keywords
sealing body
manufacturing
semiconductor device
leads
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009096178A
Other languages
English (en)
Japanese (ja)
Other versions
JP4566266B2 (ja
JP2009158978A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009096178A priority Critical patent/JP4566266B2/ja
Priority claimed from JP2009096178A external-priority patent/JP4566266B2/ja
Publication of JP2009158978A publication Critical patent/JP2009158978A/ja
Publication of JP2009158978A5 publication Critical patent/JP2009158978A5/ja
Application granted granted Critical
Publication of JP4566266B2 publication Critical patent/JP4566266B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2009096178A 2009-04-10 2009-04-10 半導体装置の製造方法 Expired - Lifetime JP4566266B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009096178A JP4566266B2 (ja) 2009-04-10 2009-04-10 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009096178A JP4566266B2 (ja) 2009-04-10 2009-04-10 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003396996A Division JP2005159103A (ja) 2003-11-27 2003-11-27 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009226011A Division JP4535513B2 (ja) 2009-09-30 2009-09-30 半導体装置

Publications (3)

Publication Number Publication Date
JP2009158978A JP2009158978A (ja) 2009-07-16
JP2009158978A5 true JP2009158978A5 (enExample) 2009-11-19
JP4566266B2 JP4566266B2 (ja) 2010-10-20

Family

ID=40962578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009096178A Expired - Lifetime JP4566266B2 (ja) 2009-04-10 2009-04-10 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4566266B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP6986539B2 (ja) * 2019-11-25 2021-12-22 Ｔｏｗａ株式会社 樹脂成形済リードフレームの製造方法、樹脂成形品の製造方法、及びリードフレーム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220361A (ja) * 1985-03-26 1986-09-30 Matsushita Electric Ind Co Ltd 電子部品の捺印及びフレ−ム切断機
JPH06232195A (ja) * 1993-01-28 1994-08-19 Rohm Co Ltd 半導体装置の製造方法およびリードフレーム
JP3547704B2 (ja) * 2000-06-22 2004-07-28 株式会社三井ハイテック リードフレーム及び半導体装置
JP3660861B2 (ja) * 2000-08-18 2005-06-15 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2003031753A (ja) * 2001-07-19 2003-01-31 Sony Corp 半導体装置及びその製造方法
JP2003158234A (ja) * 2001-11-21 2003-05-30 Hitachi Ltd 半導体装置及びその製造方法
JP3638136B2 (ja) * 2001-12-27 2005-04-13 株式会社三井ハイテック リードフレームおよびこれを用いた半導体装置

Similar Documents

Publication Publication Date Title
JP2013534719A5 (enExample)
WO2009072786A3 (en) Led package and method for fabricating the same
JP2014110333A5 (ja) Ｌｅｄ装置の製造方法
JP2013517624A5 (enExample)
JP2010021374A (ja) 半導体パッケージ
JP2010165777A5 (enExample)
CN201594532U (zh) 定位针在塑封料挤压下可回缩的半导体器件全包封模具
JP2009158978A5 (enExample)
TWI256096B (en) Method for fabricating quad flat non-leaded package
CN201893335U (zh) 一种双芯片集成电路引线框
CN111863765B (zh) 一种dfn或qfn引线框架及其制造方法
CN102756456B (zh) 用于预塑封引线框的模具以及封装结构
JP6034078B2 (ja) プリモールドリードフレームの製造方法、および、半導体装置の製造方法
CN102347305B (zh) 引线框架的阵列结构
CN212659537U (zh) 一种dfn或qfn引线框架
CN202084532U (zh) To92型号封装盒及配套模具
CN101635291B (zh) 一种微型封装引线框架的工艺方法
CN215266214U (zh) 一种防止溢胶的半导体塑封模具
JP2006073600A5 (enExample)
JP2009065201A5 (enExample)
CN213401186U (zh) 一种具有应力释放结构的引线框架及封装料片
JP2006196922A5 (enExample)
JP2010027821A5 (enExample)
JP2009188147A5 (enExample)
JP2010002427A5 (enExample)