JP2010027821A5 - - Google Patents

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Publication number
JP2010027821A5
JP2010027821A5 JP2008186701A JP2008186701A JP2010027821A5 JP 2010027821 A5 JP2010027821 A5 JP 2010027821A5 JP 2008186701 A JP2008186701 A JP 2008186701A JP 2008186701 A JP2008186701 A JP 2008186701A JP 2010027821 A5 JP2010027821 A5 JP 2010027821A5
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JP
Japan
Prior art keywords
main surface
glass plate
plate material
semiconductor chip
semiconductor device
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Application number
JP2008186701A
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English (en)
Japanese (ja)
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JP2010027821A (ja
JP5214356B2 (ja
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Priority to JP2008186701A priority Critical patent/JP5214356B2/ja
Priority claimed from JP2008186701A external-priority patent/JP5214356B2/ja
Publication of JP2010027821A publication Critical patent/JP2010027821A/ja
Publication of JP2010027821A5 publication Critical patent/JP2010027821A5/ja
Application granted granted Critical
Publication of JP5214356B2 publication Critical patent/JP5214356B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008186701A 2008-07-18 2008-07-18 半導体装置の製造方法 Expired - Fee Related JP5214356B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008186701A JP5214356B2 (ja) 2008-07-18 2008-07-18 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008186701A JP5214356B2 (ja) 2008-07-18 2008-07-18 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010027821A JP2010027821A (ja) 2010-02-04
JP2010027821A5 true JP2010027821A5 (enExample) 2011-08-11
JP5214356B2 JP5214356B2 (ja) 2013-06-19

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ID=41733370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008186701A Expired - Fee Related JP5214356B2 (ja) 2008-07-18 2008-07-18 半導体装置の製造方法

Country Status (1)

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JP (1) JP5214356B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101847614B (zh) * 2010-03-11 2012-10-17 苏州固锝电子股份有限公司 一种qfn/dfn无基岛芯片封装结构
JP6032052B2 (ja) * 2013-02-19 2016-11-24 株式会社デンソー 電子装置の製造方法
KR20150090705A (ko) * 2014-01-29 2015-08-06 삼성전기주식회사 센서 패키지 및 그 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001148447A (ja) * 1999-11-22 2001-05-29 Nec Corp 樹脂封止型半導体装置及びその製造方法
JP2004165191A (ja) * 2002-11-08 2004-06-10 Oki Electric Ind Co Ltd 半導体装置、半導体装置の製造方法及びカメラシステム
JP2006190879A (ja) * 2005-01-07 2006-07-20 Matsushita Electric Ind Co Ltd 固体撮像装置
JP5095113B2 (ja) * 2005-03-25 2012-12-12 富士フイルム株式会社 固体撮像装置の製造方法、及び固体撮像装置
NL1028904C2 (nl) * 2005-04-29 2006-10-31 Fico Bv Pers met plaatvormige gesteldelen, en werkwijze voor het bedrijven van een dergelijke platenpers.
JP2007242692A (ja) * 2006-03-06 2007-09-20 Matsushita Electric Ind Co Ltd 光学装置および光学装置の製造方法

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