JP2010171402A - 熱硬化型ダイボンドフィルム - Google Patents

熱硬化型ダイボンドフィルム Download PDF

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JP2010171402A
JP2010171402A JP2009288001A JP2009288001A JP2010171402A JP 2010171402 A JP2010171402 A JP 2010171402A JP 2009288001 A JP2009288001 A JP 2009288001A JP 2009288001 A JP2009288001 A JP 2009288001A JP 2010171402 A JP2010171402 A JP 2010171402A
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Japan
Prior art keywords
die
film
thermosetting
bonding film
weight
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JP2009288001A
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English (en)
Japanese (ja)
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JP2010171402A5 (enExample
Inventor
Miki Hayashi
美希 林
Hisahide Takamoto
尚英 高本
Kenji Onishi
謙司 大西
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Nitto Denko Corp
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Nitto Denko Corp
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Publication date
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Priority to JP2009288001A priority Critical patent/JP2010171402A/ja
Priority to CN200980152612XA priority patent/CN102265388A/zh
Priority to KR20117014623A priority patent/KR20110099116A/ko
Priority to PCT/JP2009/071292 priority patent/WO2010074060A1/ja
Priority to US13/141,765 priority patent/US20120153508A1/en
Priority to TW103116730A priority patent/TWI538976B/zh
Priority to TW098144526A priority patent/TWI504715B/zh
Publication of JP2010171402A publication Critical patent/JP2010171402A/ja
Publication of JP2010171402A5 publication Critical patent/JP2010171402A5/ja
Pending legal-status Critical Current

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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • General Physics & Mathematics (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
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CN200980152612XA CN102265388A (zh) 2008-12-24 2009-12-22 热固型芯片接合薄膜
KR20117014623A KR20110099116A (ko) 2008-12-24 2009-12-22 열경화형 다이 본드 필름
PCT/JP2009/071292 WO2010074060A1 (ja) 2008-12-24 2009-12-22 熱硬化型ダイボンドフィルム
US13/141,765 US20120153508A1 (en) 2008-12-24 2009-12-22 Thermosetting die-bonding film
TW103116730A TWI538976B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜
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JP2010265453A (ja) * 2009-04-17 2010-11-25 Furukawa Electric Co Ltd:The 接着フィルムおよびウエハ加工用テープ
JP2013038214A (ja) * 2011-08-08 2013-02-21 Renesas Electronics Corp 半導体装置の製造方法
JP2021190695A (ja) * 2020-05-26 2021-12-13 日東電工株式会社 ダイボンドフィルム及びダイシングダイボンドフィルム
JP2023088298A (ja) * 2021-12-14 2023-06-26 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド スペーサ用フィルム及びそれを用いたスペーサの形成方法

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JP2012241063A (ja) * 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート
TW201305306A (zh) * 2011-07-25 2013-02-01 日東電工股份有限公司 接著片及其用途
JP5888805B2 (ja) * 2011-09-01 2016-03-22 日東電工株式会社 接着フィルム及びダイシング・ダイボンドフィルム
JP5951207B2 (ja) * 2011-09-14 2016-07-13 リンテック株式会社 ダイシング・ダイボンディングシート
JP6144548B2 (ja) * 2012-08-01 2017-06-07 日東電工株式会社 透明導電性積層フィルム、その製造方法及びタッチパネル
JP6435088B2 (ja) 2013-04-09 2018-12-05 日東電工株式会社 半導体装置の製造に用いられる接着シート、ダイシングテープ一体型接着シート、半導体装置、及び、半導体装置の製造方法
JP2014216488A (ja) * 2013-04-25 2014-11-17 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6322026B2 (ja) * 2014-03-31 2018-05-09 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
WO2017078050A1 (ja) * 2015-11-04 2017-05-11 リンテック株式会社 硬化性樹脂フィルム及び第１保護膜形成用シート
WO2017169896A1 (ja) * 2016-03-30 2017-10-05 三井化学東セロ株式会社 半導体装置の製造方法
WO2017170021A1 (ja) * 2016-03-30 2017-10-05 リンテック株式会社 半導体加工用シート
JP6879690B2 (ja) 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
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