JP2010171402A - 熱硬化型ダイボンドフィルム - Google Patents

熱硬化型ダイボンドフィルム Download PDF

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Publication number
JP2010171402A
JP2010171402A JP2009288001A JP2009288001A JP2010171402A JP 2010171402 A JP2010171402 A JP 2010171402A JP 2009288001 A JP2009288001 A JP 2009288001A JP 2009288001 A JP2009288001 A JP 2009288001A JP 2010171402 A JP2010171402 A JP 2010171402A
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JP
Japan
Prior art keywords
die
film
thermosetting
bonding film
weight
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Pending
Application number
JP2009288001A
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English (en)
Japanese (ja)
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JP2010171402A5 (enExample
Inventor
Miki Hayashi
美希 林
Hisahide Takamoto
尚英 高本
Kenji Onishi
謙司 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2009288001A priority Critical patent/JP2010171402A/ja
Priority to US13/141,765 priority patent/US20120153508A1/en
Priority to CN200980152612XA priority patent/CN102265388A/zh
Priority to KR20117014623A priority patent/KR20110099116A/ko
Priority to PCT/JP2009/071292 priority patent/WO2010074060A1/ja
Priority to TW098144526A priority patent/TWI504715B/zh
Priority to TW103116730A priority patent/TWI538976B/zh
Publication of JP2010171402A publication Critical patent/JP2010171402A/ja
Publication of JP2010171402A5 publication Critical patent/JP2010171402A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • H10W74/114—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H10W72/013—
    • H10W72/073—
    • H10W72/30—
    • H10W74/016—
    • H10W74/47—
    • H10W74/476—
    • H10W90/00—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07338—
    • H10W72/07352—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/321—
    • H10W72/325—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/884—
    • H10W74/00—
    • H10W90/231—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—
    • H10W99/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2009288001A 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム Pending JP2010171402A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2009288001A JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム
US13/141,765 US20120153508A1 (en) 2008-12-24 2009-12-22 Thermosetting die-bonding film
CN200980152612XA CN102265388A (zh) 2008-12-24 2009-12-22 热固型芯片接合薄膜
KR20117014623A KR20110099116A (ko) 2008-12-24 2009-12-22 열경화형 다이 본드 필름
PCT/JP2009/071292 WO2010074060A1 (ja) 2008-12-24 2009-12-22 熱硬化型ダイボンドフィルム
TW098144526A TWI504715B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜
TW103116730A TWI538976B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008328341 2008-12-24
JP2009288001A JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014089485A Division JP5976716B2 (ja) 2008-12-24 2014-04-23 熱硬化型ダイボンドフィルム

Publications (2)

Publication Number Publication Date
JP2010171402A true JP2010171402A (ja) 2010-08-05
JP2010171402A5 JP2010171402A5 (enExample) 2013-09-12

Family

ID=42287669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009288001A Pending JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム

Country Status (6)

Country Link
US (1) US20120153508A1 (enExample)
JP (1) JP2010171402A (enExample)
KR (1) KR20110099116A (enExample)
CN (1) CN102265388A (enExample)
TW (2) TWI538976B (enExample)
WO (1) WO2010074060A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010265453A (ja) * 2009-04-17 2010-11-25 Furukawa Electric Co Ltd:The 接着フィルムおよびウエハ加工用テープ
JP2013038214A (ja) * 2011-08-08 2013-02-21 Renesas Electronics Corp 半導体装置の製造方法
JP2021190695A (ja) * 2020-05-26 2021-12-13 日東電工株式会社 ダイボンドフィルム及びダイシングダイボンドフィルム
JP2023088298A (ja) * 2021-12-14 2023-06-26 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド スペーサ用フィルム及びそれを用いたスペーサの形成方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012241063A (ja) * 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート
TW201305306A (zh) * 2011-07-25 2013-02-01 日東電工股份有限公司 接著片及其用途
JP5888805B2 (ja) * 2011-09-01 2016-03-22 日東電工株式会社 接着フィルム及びダイシング・ダイボンドフィルム
JP5951207B2 (ja) * 2011-09-14 2016-07-13 リンテック株式会社 ダイシング・ダイボンディングシート
JP6144548B2 (ja) * 2012-08-01 2017-06-07 日東電工株式会社 透明導電性積層フィルム、その製造方法及びタッチパネル
JP6435088B2 (ja) 2013-04-09 2018-12-05 日東電工株式会社 半導体装置の製造に用いられる接着シート、ダイシングテープ一体型接着シート、半導体装置、及び、半導体装置の製造方法
JP2014216488A (ja) * 2013-04-25 2014-11-17 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP6068386B2 (ja) * 2014-03-31 2017-01-25 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6322026B2 (ja) * 2014-03-31 2018-05-09 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
EP3355341A4 (en) 2015-11-04 2019-05-01 LINTEC Corporation HARDENABLE RESIN FOIL AND FIRST PROTECTIVE FOIL WRAP
CN109005665B (zh) * 2016-03-30 2020-12-25 琳得科株式会社 半导体加工用片
JP6204639B1 (ja) * 2016-03-30 2017-09-27 三井化学東セロ株式会社 半導体装置の製造方法
JP6879690B2 (ja) * 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
TWI723211B (zh) * 2016-09-23 2021-04-01 日商住友電木股份有限公司 熱硬化性樹脂組成物、樹脂密封基板及電子裝置
WO2018137224A1 (zh) * 2017-01-25 2018-08-02 深圳市汇顶科技股份有限公司 晶片封装结构及封装方法
JP6889398B2 (ja) * 2017-07-20 2021-06-18 昭和電工マテリアルズ株式会社 放熱性ダイボンディングフィルム及びダイシングダイボンディングフィルム
JP7033004B2 (ja) * 2018-05-24 2022-03-09 日東電工株式会社 ダイシングダイボンドフィルムおよび半導体装置製造方法
CN114600225A (zh) * 2019-10-28 2022-06-07 昭和电工材料株式会社 膜状黏合剂及其分断性评价方法、切割晶粒接合一体型膜及其制造方法以及半导体装置
CN115260963B (zh) * 2022-09-27 2022-12-27 武汉市三选科技有限公司 低模量垂直堆叠封装用薄膜黏晶胶、其制备方法及应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322853A (ja) * 2004-05-11 2005-11-17 Lintec Corp 接着剤層付き半導体チップの製造方法
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
JP2007002173A (ja) * 2005-06-27 2007-01-11 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2008081734A (ja) * 2006-08-31 2008-04-10 Hitachi Chem Co Ltd 接着シート、一体型シート、半導体装置、及び半導体装置の製造方法
JP2008258429A (ja) * 2007-04-05 2008-10-23 Sekisui Chem Co Ltd 絶縁フィルム、電子部品装置の製造方法及び電子部品装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006088180A1 (ja) * 2005-02-21 2006-08-24 Nitto Denko Corporation 半導体装置の製造方法
JP2006303472A (ja) * 2005-03-23 2006-11-02 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP4620028B2 (ja) * 2006-10-19 2011-01-26 日東電工株式会社 基板加工用粘着シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322853A (ja) * 2004-05-11 2005-11-17 Lintec Corp 接着剤層付き半導体チップの製造方法
JP2006261657A (ja) * 2005-02-21 2006-09-28 Nitto Denko Corp 半導体装置の製造方法
JP2007002173A (ja) * 2005-06-27 2007-01-11 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2008081734A (ja) * 2006-08-31 2008-04-10 Hitachi Chem Co Ltd 接着シート、一体型シート、半導体装置、及び半導体装置の製造方法
JP2008258429A (ja) * 2007-04-05 2008-10-23 Sekisui Chem Co Ltd 絶縁フィルム、電子部品装置の製造方法及び電子部品装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010265453A (ja) * 2009-04-17 2010-11-25 Furukawa Electric Co Ltd:The 接着フィルムおよびウエハ加工用テープ
JP2013038214A (ja) * 2011-08-08 2013-02-21 Renesas Electronics Corp 半導体装置の製造方法
JP2021190695A (ja) * 2020-05-26 2021-12-13 日東電工株式会社 ダイボンドフィルム及びダイシングダイボンドフィルム
JP7689440B2 (ja) 2020-05-26 2025-06-06 日東電工株式会社 ダイボンドフィルム及びダイシングダイボンドフィルム
JP2023088298A (ja) * 2021-12-14 2023-06-26 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド スペーサ用フィルム及びそれを用いたスペーサの形成方法

Also Published As

Publication number Publication date
CN102265388A (zh) 2011-11-30
WO2010074060A1 (ja) 2010-07-01
US20120153508A1 (en) 2012-06-21
TW201439273A (zh) 2014-10-16
TWI538976B (zh) 2016-06-21
TWI504715B (zh) 2015-10-21
TW201033319A (en) 2010-09-16
KR20110099116A (ko) 2011-09-06

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