JP2010171402A - 熱硬化型ダイボンドフィルム - Google Patents

熱硬化型ダイボンドフィルム Download PDF

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Publication number
JP2010171402A
JP2010171402A JP2009288001A JP2009288001A JP2010171402A JP 2010171402 A JP2010171402 A JP 2010171402A JP 2009288001 A JP2009288001 A JP 2009288001A JP 2009288001 A JP2009288001 A JP 2009288001A JP 2010171402 A JP2010171402 A JP 2010171402A
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Japan
Prior art keywords
die
film
thermosetting
bonding film
weight
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Pending
Application number
JP2009288001A
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English (en)
Japanese (ja)
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JP2010171402A5 (enExample
Inventor
Miki Hayashi
美希 林
Hisahide Takamoto
尚英 高本
Kenji Onishi
謙司 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2009288001A priority Critical patent/JP2010171402A/ja
Priority to CN200980152612XA priority patent/CN102265388A/zh
Priority to KR20117014623A priority patent/KR20110099116A/ko
Priority to US13/141,765 priority patent/US20120153508A1/en
Priority to PCT/JP2009/071292 priority patent/WO2010074060A1/ja
Priority to TW098144526A priority patent/TWI504715B/zh
Priority to TW103116730A priority patent/TWI538976B/zh
Publication of JP2010171402A publication Critical patent/JP2010171402A/ja
Publication of JP2010171402A5 publication Critical patent/JP2010171402A5/ja
Pending legal-status Critical Current

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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
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    • H10W72/07531—Techniques
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    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2009288001A 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム Pending JP2010171402A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2009288001A JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム
CN200980152612XA CN102265388A (zh) 2008-12-24 2009-12-22 热固型芯片接合薄膜
KR20117014623A KR20110099116A (ko) 2008-12-24 2009-12-22 열경화형 다이 본드 필름
US13/141,765 US20120153508A1 (en) 2008-12-24 2009-12-22 Thermosetting die-bonding film
PCT/JP2009/071292 WO2010074060A1 (ja) 2008-12-24 2009-12-22 熱硬化型ダイボンドフィルム
TW098144526A TWI504715B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜
TW103116730A TWI538976B (zh) 2008-12-24 2009-12-23 熱硬化型黏晶膜

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008328341 2008-12-24
JP2009288001A JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014089485A Division JP5976716B2 (ja) 2008-12-24 2014-04-23 熱硬化型ダイボンドフィルム

Publications (2)

Publication Number Publication Date
JP2010171402A true JP2010171402A (ja) 2010-08-05
JP2010171402A5 JP2010171402A5 (enExample) 2013-09-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009288001A Pending JP2010171402A (ja) 2008-12-24 2009-12-18 熱硬化型ダイボンドフィルム

Country Status (6)

Country Link
US (1) US20120153508A1 (enExample)
JP (1) JP2010171402A (enExample)
KR (1) KR20110099116A (enExample)
CN (1) CN102265388A (enExample)
TW (2) TWI538976B (enExample)
WO (1) WO2010074060A1 (enExample)

Cited By (4)

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TW201439273A (zh) 2014-10-16
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