CN102265388A - 热固型芯片接合薄膜 - Google Patents

热固型芯片接合薄膜 Download PDF

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Publication number
CN102265388A
CN102265388A CN200980152612XA CN200980152612A CN102265388A CN 102265388 A CN102265388 A CN 102265388A CN 200980152612X A CN200980152612X A CN 200980152612XA CN 200980152612 A CN200980152612 A CN 200980152612A CN 102265388 A CN102265388 A CN 102265388A
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China
Prior art keywords
die
bonding film
bonding
weight
film
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CN200980152612XA
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English (en)
Chinese (zh)
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林美希
高本尚英
大西谦司
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of CN102265388A publication Critical patent/CN102265388A/zh
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CN104946150A (zh) * 2014-03-31 2015-09-30 日东电工株式会社 芯片接合膜、带有切割片的芯片接合膜、半导体装置及半导体装置的制造方法
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JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
JP6213757B2 (ja) 2015-11-04 2017-10-18 リンテック株式会社 硬化性樹脂フィルム及び第１保護膜形成用シート
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JP6204639B1 (ja) * 2016-03-30 2017-09-27 三井化学東セロ株式会社 半導体装置の製造方法
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