JP2010093125A - 基板処理システムおよび基板処理方法 - Google Patents

基板処理システムおよび基板処理方法 Download PDF

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Publication number
JP2010093125A
JP2010093125A JP2008262962A JP2008262962A JP2010093125A JP 2010093125 A JP2010093125 A JP 2010093125A JP 2008262962 A JP2008262962 A JP 2008262962A JP 2008262962 A JP2008262962 A JP 2008262962A JP 2010093125 A JP2010093125 A JP 2010093125A
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JP
Japan
Prior art keywords
substrate
unit
substrate processing
pin
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008262962A
Other languages
English (en)
Japanese (ja)
Inventor
Motonobu Nakazawa
源伸 中澤
Yugo Fukushima
雄悟 福島
Manabu Kamatani
学 釜谷
Sadahiko Ito
禎彦 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP2008262962A priority Critical patent/JP2010093125A/ja
Priority to TW098125464A priority patent/TWI480969B/zh
Priority to KR1020090080103A priority patent/KR20100040244A/ko
Priority to CN2009101787193A priority patent/CN101718955B/zh
Publication of JP2010093125A publication Critical patent/JP2010093125A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008262962A 2008-10-09 2008-10-09 基板処理システムおよび基板処理方法 Pending JP2010093125A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008262962A JP2010093125A (ja) 2008-10-09 2008-10-09 基板処理システムおよび基板処理方法
TW098125464A TWI480969B (zh) 2008-10-09 2009-07-29 Substrate processing system and substrate processing method
KR1020090080103A KR20100040244A (ko) 2008-10-09 2009-08-27 기판처리시스템 및 기판처리방법
CN2009101787193A CN101718955B (zh) 2008-10-09 2009-09-28 基板处理系统及基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008262962A JP2010093125A (ja) 2008-10-09 2008-10-09 基板処理システムおよび基板処理方法

Publications (1)

Publication Number Publication Date
JP2010093125A true JP2010093125A (ja) 2010-04-22

Family

ID=42216415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008262962A Pending JP2010093125A (ja) 2008-10-09 2008-10-09 基板処理システムおよび基板処理方法

Country Status (4)

Country Link
JP (1) JP2010093125A (zh)
KR (1) KR20100040244A (zh)
CN (1) CN101718955B (zh)
TW (1) TWI480969B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228510A (ja) * 2010-04-21 2011-11-10 Canon Anelva Corp 基板処理装置、及び、基板移載方法
WO2012074170A1 (ko) * 2010-11-30 2012-06-07 주식회사 테라세미콘 플렉시블 디스플레이용 홀더의 기판 적재 방법 및 그 시스템
JP2012216634A (ja) * 2011-03-31 2012-11-08 Tokyo Electron Ltd 基板受け渡し装置、基板受け渡し方法及び基板処理装置
KR101205245B1 (ko) 2012-07-25 2012-12-03 주식회사 테라세미콘 플렉시블 기판 적재 방법
JP2014208354A (ja) * 2013-04-16 2014-11-06 川崎重工業株式会社 アーク溶接装置
JP2018060479A (ja) * 2016-10-07 2018-04-12 本田技研工業株式会社 協調制御方法
CN115881597A (zh) * 2021-08-27 2023-03-31 株式会社斯库林集团 基板处理装置及基板处理方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102072200B1 (ko) * 2011-04-22 2020-01-31 에이에스엠엘 네델란즈 비.브이. 리소그래피 머신들의 클러스터를 위한 네트워크 아키텍처 및 프로토콜
CN105236141B (zh) * 2015-10-13 2017-07-28 武汉华星光电技术有限公司 基板传送方法
JP7186605B2 (ja) * 2018-12-27 2022-12-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7320369B2 (ja) * 2019-04-17 2023-08-03 株式会社アルバック 基板処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121581A (ja) * 1997-10-13 1999-04-30 Kokusai Electric Co Ltd 基板搬送機構
JP2003332191A (ja) * 2002-05-14 2003-11-21 Hitachi Instruments Service Co Ltd 半導体製造装置
JP2006319367A (ja) * 2006-07-21 2006-11-24 Canon Inc 露光装置及びデバイス製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4451076B2 (ja) * 2003-04-16 2010-04-14 東京エレクトロン株式会社 真空処理装置
JP5031186B2 (ja) * 2004-11-01 2012-09-19 東京エレクトロン株式会社 基板処理方法、基板処理システム及び基板処理プログラム
JP4378301B2 (ja) * 2005-02-28 2009-12-02 東京エレクトロン株式会社 基板処理装置及び基板処理方法及び基板処理プログラム
JP4492875B2 (ja) * 2005-06-21 2010-06-30 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP5091413B2 (ja) * 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP4560022B2 (ja) * 2006-09-12 2010-10-13 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121581A (ja) * 1997-10-13 1999-04-30 Kokusai Electric Co Ltd 基板搬送機構
JP2003332191A (ja) * 2002-05-14 2003-11-21 Hitachi Instruments Service Co Ltd 半導体製造装置
JP2006319367A (ja) * 2006-07-21 2006-11-24 Canon Inc 露光装置及びデバイス製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228510A (ja) * 2010-04-21 2011-11-10 Canon Anelva Corp 基板処理装置、及び、基板移載方法
WO2012074170A1 (ko) * 2010-11-30 2012-06-07 주식회사 테라세미콘 플렉시블 디스플레이용 홀더의 기판 적재 방법 및 그 시스템
JP2012216634A (ja) * 2011-03-31 2012-11-08 Tokyo Electron Ltd 基板受け渡し装置、基板受け渡し方法及び基板処理装置
KR101205245B1 (ko) 2012-07-25 2012-12-03 주식회사 테라세미콘 플렉시블 기판 적재 방법
JP2014208354A (ja) * 2013-04-16 2014-11-06 川崎重工業株式会社 アーク溶接装置
JP2018060479A (ja) * 2016-10-07 2018-04-12 本田技研工業株式会社 協調制御方法
CN115881597A (zh) * 2021-08-27 2023-03-31 株式会社斯库林集团 基板处理装置及基板处理方法

Also Published As

Publication number Publication date
TWI480969B (zh) 2015-04-11
CN101718955A (zh) 2010-06-02
KR20100040244A (ko) 2010-04-19
CN101718955B (zh) 2013-01-02
TW201015660A (en) 2010-04-16

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