TW201015660A - Substrate processing system and substrate processing method - Google Patents
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- 238000012545 processing Methods 0.000 title claims abstract description 76
- 238000003672 processing method Methods 0.000 title claims description 6
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- 230000008054 signal transmission Effects 0.000 abstract 1
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- 230000007246 mechanism Effects 0.000 description 25
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
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- G—PHYSICS
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the transport system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
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- General Engineering & Computer Science (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
201015660 w:基板 五it^若有化學式時’請揭示最能顯示發明特 徵的化學式：201015660 w: Substrate Five it^ If there is a chemical formula ‘Please reveal the chemical formula that best shows the characteristics of the invention:
W r 六、發明說明： 【發明所屬之技術領域】 本發'月疋關於對基板（substrate)施以處理之基板處 ❹理系統及基板處理方法。 【先前技術】 例如在液晶顯示器（HqUid crystal display)或電漿 顯示器（plasma display)等的平面面板顯示器（flat panel disPlay)使用有塗佈有光阻（resist)液的玻璃基板（glass substrate)(以下也稱為塗佈基板）。用以得到該塗佈基板 之基板處理系統除了對玻璃基板塗佈光阻液之塗佈裝置 (例如參照專利文獻1 )，及對塗佈裝置進行玻璃基板的運 J 送之運送裝置外，還具備統括該等裝置之主控制裝置。 - 塗佈裝置及運送裝置的各個與主控制裝置是藉由專用 通信線連接，運送裝置一接收由主控制裝置傳送來的指令 信號，運送裝置就將玻璃基板運送至塗佈裝置。完成玻璃 基板的運送之運送裝置傳送運送完了的信號至主控制裝 置’主控制裝置一接收運送完了的信號，就傳送指令信號 至塗佈裝置。接收指令信號的塗佈裝置開始塗佈光阻液至 3 塗佈完成，則傳送塗佈完 佈完了的信號之主控制裝 的指令信號傳送至運送裝 是等待來自主控制裝置的 使玻璃基板的運送及給予 自動化，謀求塗佈基板的 本國特開2008-205120號 的基板處理系統中，主控 及塗佈裝置，藉由該指令 序（timing)及/或光阻液 ’此情形由於主控制裝置 ’或在主控制裝置與運送 間等的因素，使精密地連 序的控制很困難。因此， 進塗佈裝置後，完成光阻 基板為止的時間縮短也有 目的為提供一種基板處理 理裝置與運送裝置的動作 的時間縮短為可能。 題之本發明的基板處理角 作的動作部之基板處理裝 201015660 玻璃基板的處理，若 主控制裝置。接收塗 佈基板至下一個製程 運送裝置及塗佈裝置 ' 行動作而構成，藉由 Γ·_ 處理（光阻液的塗佈） 縮短。 [專利文獻1 ]曰 ❺ 【發明内容】 如前述，在習知 指令信號至運送裝置 基板的運送開始的時 的時序被控制。但是 間（scan time)的產生 裝置之間需要通信時 ©與塗佈裝置之動作時 統中在將破璃基板搬 '業，進行到搬出塗佈 因此’本發明的 處理方法’使基板處 控制容易，更進一步 用以解決前述課 具有為處理基板而動 了的信號至 置將運送塗 置。如此， 指令信號進 玻璃基板的 製造時間的 公報 制裝置傳送 信號使玻璃 的塗佈開始 中的掃描時 裝置及塗佈 繫運送裝置 在習知的系 液的塗佈作 界限。 系統及基板 時序連繫的 i統，包含： 置；具有為 4 201015660 2送則述基板而對前述基板處理裝置接近背離移動的 ^ 廷裝置，藉由發出指令信號至前述基板處理裝置及 月1J述運i关at SB i , 妒 置的主控制部統括有該基板處理裝置及該運送 .其特徵包含：在前述基板處理裝置與前述運送裝置之 曰進行信號的傳送接收之傳輸路徑（transmissi〇n ，pjth);藉由根據透過前述傳輸路徑在前述基板處理裝置與 二運2裝置之間破傳送的信號，在前述動作部的動作完 則述運送σ[5的移動開始，使該動作部的動作與該運 ® 、°卩的移動並行之控制部。 而且，藉由該基板處理系統執行的基板處理方法是使 為運送基板運送部對基板處理裝置接&背離移動的運 :置，為前述基板的處理而使前述基板處理裝置所具有 作邛動作，其特徵為：藉由根據在前述基板處理裝置與 J述運送裝置之間透過傳輸路徑傳送的信號，在前述動作 的動作元了前使前述運送部的移動開始，使該動作部 動作與該運送部的移動並行。 依照前述基板處理系統及前述基板處理方法，因 二板處理裝置與運送裝置之間的傳輸路徑進行信號的傳送 收，故使基板處理裝置的動作部與運送裝置的運送呷 =作時序連繫的控制變的以。而且，該使其連繫的控制 由根據透過傳輸路徑在基板處理裝£與運送纟置之 送的信號’在動作部的動作完了前使運送部的移動 。，藉由進行使動作部的動作與運送部的移動並行之= 制可使使動作部的動作與運送部的移動時間地重疊，使 201015660 ❹ ❹ 時間縮短為 而且， 不與為進行 目標位置， 干涉的超出 處理裝置具 位置且在前 動作部由該 較佳。 此情形 位置且在超 地超越目標 相對於 其直接到達 器的構成上 在目標位置 時間。 但是， 目標位置， 態，故為進 近基板處理 由前述超出 使動作部到 而且， 可能。 在前述基板處理系統中’前述動作部可移動於 前述基板的遞送而接近來的前述運送部干涉# 及於移動方向超越該目標位置，不與該運送部 位置（overrun position)而被配設，前述基板 有使前述動作部於前述移動方向通過前述目標 述超出位置的跟前使前述動作部減速，使前2 超出位置折回該目標位置而控制的超出控制部 ’因超出控制部使動作部於移動方向通過目標 出位置的跟前使動作部滷诚 I两逯，故動作部可迅速 位置。 此’在不是使動作部移動 砂動至超出位置，而是使 目標位置的情形下，使動祚 之動作邻移動之一般的機 ’因需於在目標位置 ι的跟剛使動作部減速後， 使其停止，故使動作部刭违 F。丨到達目標位置為止需要 依照前述超出控制部，由 由於動作部迅速地超越 以早的時序得到動作邱盘 ，一 开°卩與運送部不干涉的狀 行基板的遞送而能以早从* 干的時序使運送部開始接 裝置，更進一步的時間始站* 吖間縮短為可能。而且，藉 控制部使動作部由超屮作¥ > 出位置折回目標位置，可 達目標位置，可使其準 千谞主下一個動作。 在前述基板處理裝置具古儿 丹有刚述超出控制部的情 6W r VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a substrate processing system and a substrate processing method for treating a substrate. [Prior Art] For example, a flat panel disPlay such as a liquid crystal display or a plasma display uses a glass substrate coated with a resist liquid ( Hereinafter also referred to as a coated substrate). The substrate processing system for obtaining the coated substrate is not limited to a coating device for applying a photoresist to a glass substrate (for example, see Patent Document 1), and a transfer device for transporting a glass substrate to a coating device. There are main control devices that integrate these devices. - Each of the coating device and the transport device is connected to the main control device by a dedicated communication line, and the transport device receives the command signal transmitted from the main control device, and the transport device transports the glass substrate to the coating device. The transport device that completes the transport of the glass substrate conveys the transported signal to the main control device. The main control device transmits a command signal to the coating device as soon as the received signal is received. When the coating device that receives the command signal starts coating the photoresist liquid until the coating is completed, the command signal of the main control device that transmits the coated signal is transmitted to the transport device to wait for the glass substrate from the main control device. In the substrate processing system of the Japanese Patent Application Laid-Open No. 2008-205120, the main control and the coating device are transported and supplied with automation, and the timing and/or photoresist is used as the main control. The 'device' or the factors such as the main control unit and the transport make it difficult to control the precise sequence. Therefore, it is also possible to shorten the time required to complete the operation of the substrate processing device and the transport device after the application of the coating device to shorten the time until the photoresist substrate is completed. The substrate processing apparatus of the operation part of the substrate processing angle of the present invention is 201015660. The processing of the glass substrate is the main control device. The coating substrate is received until the next process transport device and the coating device are operated, and the Γ·_ process (coating of the photoresist) is shortened. [Patent Document 1] 发明 ❺ [Explanation] As described above, the timing at the time of starting the conveyance of the command signal to the transport device substrate is controlled. However, when communication between the generation devices of the scan time is required, the operation of the coating device and the operation of the coating device are performed, and the glass substrate is transferred to the unloading coating. Therefore, the processing method of the present invention controls the substrate. It is easy to further solve the above-mentioned problem of having a signal for moving the substrate to be applied to the transport. In this way, the command signal is transmitted to the glass substrate during the manufacturing time of the glass substrate, and the scanning device and the coating device are applied to the coating of the conventional liquid. The system and the substrate timing connection system include: a device having a substrate for transmitting the substrate to the substrate processing device for 4 201015660 2, and sending a command signal to the substrate processing device and the moon 1J The main control unit of the device includes the substrate processing device and the transport. The feature includes: a transmission path for transmitting and receiving signals between the substrate processing device and the transport device (transmissi〇) n, pjth); by the signal transmitted between the substrate processing apparatus and the second transport 2 device transmitted through the transmission path, when the operation of the operation unit is completed, the movement of the transport σ [5] is started, and the operation unit is started. The control unit is in parallel with the movement of the transport and the movement. Further, the substrate processing method performed by the substrate processing system is such that the substrate processing unit is connected to and away from the substrate processing apparatus, and the substrate processing apparatus is configured to perform the processing of the substrate. According to the signal transmitted through the transmission path between the substrate processing apparatus and the transport apparatus, the movement of the transport unit is started before the operation element of the operation, and the operation unit is operated. The movement of the transport unit is parallel. According to the substrate processing system and the substrate processing method, since the signal is transmitted and received by the transmission path between the two-plate processing apparatus and the transport apparatus, the operation unit of the substrate processing apparatus and the transport unit of the transport apparatus are connected in time series. Control changes. Further, the control of the connection is caused by the movement of the conveyance unit before the operation of the operation unit is completed by the signal 'transmitted by the substrate processing and transporting means according to the transmission path. By performing the operation of the operation unit in parallel with the movement of the transport unit, the movement of the operation unit and the movement of the transport unit can be overlapped, and the 201015660 ❹ time can be shortened and the target position is not performed. The interference exceeds the position of the processing device and the front action portion is preferred. This situation is the location and the time at which the target exceeds the target relative to its direct reach at the target location time. However, the target position, state, is therefore approached to the substrate processing by the aforementioned excess to make the action part to and possibly. In the substrate processing system, the transport unit interference # that is movable by the delivery of the substrate and the movement direction exceeds the target position, and is not disposed with the transport position (overrun position). The substrate has an operation unit that moves the operation unit by decelerating the operation unit by decelerating the operation unit in the movement direction by the target position exceeding the position in the movement direction, and returning the front position 2 to the target position. Since the direction passes through the front of the target out position, the action part is immersed in two directions, so the action part can be quickly positioned. In the case where the moving part is not moved to the position beyond the position, but the target position is made, the general machine that moves the action of the moving piece is required to be decelerated after the action part is just after the target position , so that it stops, so the action part is violated F.丨Before reaching the target position, it is necessary to follow the above-mentioned excess control unit, and the operation unit can quickly overtake the operation timing at an early timing, and the delivery of the line substrate which does not interfere with the transport unit can be performed as early as * The timing allows the transport department to start picking up the device, and further time is required to shorten the station*. Further, the control unit causes the operation unit to be folded back to the target position by the position of the & > and the target position can be reached, so that the next action can be made. In the foregoing substrate processing apparatus, there is a case in which the ancients have just exceeded the control department.
201015660 形下，藉由前述控制部在前 位置的動作完了前使前 2折回並 的移動與該運送部的移動並行較佳。 此Jt形由控制部在動作部折回並到 動作完了前使運送部的移動開始，可使使動 位置的動作與基板的遞送用的運送部的移動 其、、'。果，由超出控制部產生的時間縮短的功 到由使動作部的動作與運送部的移動並行的 間縮短的功效。 而且’在前述基板處理裝置具有前述超 ^下’進行速度控制，俾動作部在通過前述 動作°卩達到最大移動速度也可以，惟前述超 速Ί控制’俾前述動作部在達到最大移動速 目標位置較佳。 此情形，動作部可迅速地超越目標位置 時序使運送部開始接近基板處理裝置。 【發明的功效】 依照本發明，藉由使基板處理裝置的動 運送裝置的運送部的移動時間地重疊，使 能’可縮短基板的運送時間，提高基板的生 率）。 【實施方式】 到達前述目棵 ，使該動作部 達目標位置的 作部到達目標 時間地重疊。 效被相乘地加 控制產生的時 出控制部的情 目標位置後該 出控制部進行 度後通過前述 ，能以更早的 作部的動作與 時間縮短為可 i效率（處理效 7 201015660 以下根據圖面說明本發明的實施的形態。 [基板處理系統1的全體構成] 圖1是顯示本發明的基板處理以i的實施的一形態 之概略構成圖。該其， X丞板處理系統1為塗佈藥液或光阻液等 的液狀物（以下稱真舍德你、$ 掷馬定佈液）至基板（玻璃基板）w並可製造 ^ 塗佈基板之裝置，1借, 八備.主控制裝置2、作為基板處理裝置 的塗佈裝置3、作為運送裝置的搬進裝置4及搬出裝置5。 主控制裝置2是由統括塗佈裝置3、搬進裝置*及搬出裝 © 式邏輯控制器（PLC:Programmable LogicIn the case of the 201015660, it is preferable that the movement of the front 2 is performed in parallel with the movement of the transport portion before the operation of the front position by the control unit is completed. The Jt shape is folded back by the control unit at the operation portion, and the movement of the transport portion is started before the operation is completed, and the movement of the movement position and the conveyance portion for the delivery of the substrate can be made. As a result, the work that is shortened by the time that is exceeded by the control unit is shortened by the operation between the operation unit and the movement of the transport unit. Further, 'the substrate processing apparatus has the above-described super-lowering' speed control, and the cymbal operating unit may reach the maximum moving speed by the above-described operation 卩, but the overspeed Ί control '俾 the above-mentioned operating unit reaches the maximum moving speed target position. Preferably. In this case, the operating portion can quickly exceed the target position timing to cause the transport portion to start approaching the substrate processing device. [Effects of the Invention] According to the present invention, by moving the movement of the transport unit of the movable transport apparatus of the substrate processing apparatus, it is possible to shorten the transport time of the substrate and increase the productivity of the substrate. [Embodiment] When the target unit is reached, the operation unit that reaches the target position is superimposed on the target time. When the efficiency of the time-out control unit generated by the control is multiplied, the control unit advances the degree, and the operation and time of the earlier part can be shortened to the efficiency (processing efficiency 7 201015660 or less). [Embodiment of the substrate processing system 1] Fig. 1 is a schematic block diagram showing an embodiment of the substrate processing of the present invention. It is a device for coating a liquid such as a chemical solution or a photoresist (hereinafter referred to as "true Shede, you can throw a horse") to a substrate (glass substrate) and can manufacture a coated substrate, 1 borrowing, eight A main control device 2, a coating device 3 as a substrate processing device, a loading device 4 as a transport device, and a carry-out device 5. The main control device 2 is a general coating device 3, a loading device*, and a loading device. Logic controller (PLC: Programmable Logic
Controller)構成，塗佈裝置3、搬進裝置4及搬出裝置5 可根據來自主控制裝置2的指令信號進行動作。 塗佈裝置3具有：為塗佈塗佈液於基板w上而動作之塗 佈裝置本體10;控制該塗佈裝置本體1〇的動作之塗佈用 控制裝置16。搬進裝置4具有：為由圖外的區域將基板埘 搬進塗佈裝置本體10而對該塗佈裝置本體1〇接近背離移 動之搬進機械手臂（robo1;)20 ;控制該搬進機械手臂2〇的 ©動作之搬進用控制裝置23 ^搬出裝置5具有：為由塗佈裝 置本體10將基板w搬出到圖外的區域而對該塗佈裝置本體 * 10接近背離移動之搬出機械手臂30;控制該搬出機械手臂 30的動作之搬出用控制裝置33 ^搬進機械手臂2〇與搬出 機械手臂30是夾住塗佈裝置本體1〇而被配置。 塗佈用控制裝置16、搬進用控制裝置23及搬出用控 制裝置33與主控制裝置2是透過專用通信線（L卜L2、L3) 各自連接’且在兩者間可通信。而且’在該基板處理系統 8 201015660 1中塗佈用控制裝置16與搬進用控制裝i 23是藉由專 用通信線u連接，並藉由該通信線L4在塗佈用控制裝置 1 6與搬進用控制裝置2 3之間進行信號（後述的各種動作信 號)的傳送接收。而且’塗佈用控制裝置16與搬出用控制 裝置33是藉由專㈣信線L5連接，並藉由該通信線 在塗佈用控制裝置丨6與搬出用控制裝置33之間進行信號 (後述的各種動作信號）的傳送接收。通信線的具體例有 CC-Link(註冊商標）通信用欖線（cable)、Ethernet(乙太網The controller 3 is configured such that the coating device 3, the loading device 4, and the unloading device 5 can operate in accordance with a command signal from the main control device 2. The coating device 3 includes a coating device main body 10 that operates to apply a coating liquid onto the substrate w, and a coating control device 16 that controls the operation of the coating device main body 1. The loading device 4 has a loading robot (robo1;) 20 that moves the substrate 进 into the coating device main body 10 from a region outside the drawing, and moves closer to the coating device body 1; The loading device 5 of the arm 2 is moved out of the machine The arm 30; the carry-out control device 33 that controls the movement of the carry-out robot arm 30. The carry-in robot arm 2 and the carry-out robot arm 30 are placed while sandwiching the coater body 1b. The coating control device 16, the loading control device 23, and the carry-out control device 33 and the main control device 2 are each connected via a dedicated communication line (Lb, L2, L3) and are communicable therebetween. Further, in the substrate processing system 8 201015660 1 , the coating control device 16 and the loading control device i 23 are connected by a dedicated communication line u, and the communication control unit 16 is used by the coating control device 16 Transmission and reception of signals (various operation signals to be described later) are performed between the loading control devices 23. Further, the 'application control device 16 and the carry-out control device 33 are connected by a dedicated (four) signal line L5, and a signal is transmitted between the application control device 丨6 and the carry-out control device 33 by the communication line (described later). The transmission of various motion signals). Specific examples of communication lines include CC-Link (registered trademark) communication cable (cable), Ethernet (Ethernet)
路）（註冊商標）通信用纜線、數位輸入/輸出用纜線。 [塗佈裝置3] 塗佈裝置本體10具有：基台11;配置於基台u的中 央，放置有基板W的平台（st age )12;在水平方向移動於該 平台12上之台架（gantry)13。台架13具有吐出塗佈液的 開縫喷嘴部（slit nozzle part)(未圖示），可移動於正交 於基板W的運送方向（在圖1 台架13移動於被放置在平台 佈液於該基板W。 中為左右方向）之方向。藉由 12頂面的基板W上，塗佈塗 在平台1 2形成有在其頂面開口的複數個吸引孔，在該 等吸弓丨孔連接有吸引泵（未圖示）。若於在平台12的頂面放 置有基板W的狀態下吸引泵動作，則基板^^被吸附於平台 12的頂面。而且’在平台12形成有複數個貫通於上下方 向的銷孔（pin hole)，在該銷孔配設有作為可移動於上下 方向的動作部之銷（頂出銷.lift pin)14。複數根銷14是 以平面視被配置成格子狀。在基台11配設有使複數根銷 9 201015660 14上下運動的銷驅動機構15。銷驅動機構15例如可藉由 電動致動器（electric actuator)構成，其構成可採用以往 已知者。 位於初始位置的銷14是其尖端位於平台12的頂 、 下的高度。若於在平台12上放置有基板w的狀態下， 銷驅動機構1 5同時使複數根銷1 4上升，則舖 ’ 』娜1 4的尖端將 基板W推上去，可使基板w移動到預定的高度， 積田销1 4 基板W在預疋的向度位置被保持（圖1的狀態）。Road) (registered trademark) Communication cable, digital input/output cable. [Coating device 3] The coating device body 10 has a base 11 , a stage 12 in which a substrate W is placed in the center of the base u, and a gantry that moves in the horizontal direction on the platform 12 ( Gantry) 13. The gantry 13 has a slit nozzle part (not shown) for discharging the coating liquid, and is movable in a transport direction orthogonal to the substrate W (the gantry 13 is moved to be placed on the platform cloth in FIG. 1). In the direction of the substrate W, which is the left-right direction). A plurality of suction holes are formed on the top surface of the substrate W by coating on the top surface of the substrate 12, and a suction pump (not shown) is connected to the suction holes. When the suction pump operates in a state where the substrate W is placed on the top surface of the stage 12, the substrate is attracted to the top surface of the stage 12. Further, a plurality of pin holes penetrating in the upper and lower directions are formed in the stage 12, and a pin (lift pin) 14 as an action portion movable in the vertical direction is disposed in the pin hole. The plurality of root pins 14 are arranged in a lattice shape in plan view. A pin drive mechanism 15 that moves the plurality of pins 9 201015660 14 up and down is disposed on the base 11 . The pin drive mechanism 15 can be constituted, for example, by an electric actuator, and its configuration can be known. The pin 14 in the initial position is the height at which the tip end is located at the top and bottom of the platform 12. If the pin drive mechanism 15 simultaneously raises the plurality of pins 14 in a state in which the substrate w is placed on the stage 12, the tip of the tile 1 pushes the substrate W up, and the substrate w can be moved to a predetermined position. The height, the field pin 1 4 The substrate W is held at the pre-turned position (state of Fig. 1).
台架13的移動、台架13中的塗佈液的吐出、 刊用吸 引泵進行之基板W的吸附及銷驅動機構14的動作θ 口 J初TF疋藉由塗 佈用控制裝置1 6控制。 [搬進裝置4及搬出裝置5] 搬進機械手臂20具有：承載接著進行塗佈液的塗佈的 基板W之機械手部（運送部）21;使機械手部21 1 4 1移動於對塗 佈裝置本體10接近背離方向（水平方向）及 ^久上下方向之搬 進驅動機構22，並具有將基板w傳遞至上井如Α 开起來的銷14 〇的頂面之功能。因此’機械手部21可由不靼么加， 了 矜σ % 13干涉 的位置移動至平台12的上方的預定位置，且 及不與配置成格 .子狀已上升的銷14干涉而成梳子形狀。使機械手部2丨移 動的搬進驅動機構22的動作是藉由搬進用护制壯 π授制裴置23控 制。 搬出機械手臂30具有：承載完成塗佈液 !怖的基板 W之機械手部（運送部）31;使機械手部31移私认如 吵動於對塗佈裝 置本體10接近背離方向（水平方向）及上下 r万向之搬出驅 10 201015660 動機構32，並 板W的功能。1 位置移動至平1 狀已上升的銷 ^ 的搬出驅動機；! 、 此外，搬3 動致動器構成 [關於各控 . 塗佈用控i 制裝置33是y 成。在記憶部] 用控制裝置1 6 是當作藉由前 (6a ' 6b ' 6c) 〇 程式執行的功； 動機構1 5的動 ©功能於之後說£ 塗佈用控 ，U(的尖端）的i 能。搬進用控i 部21對平台1 檢測部6c具有 利用前述位置4 驅動機構1 5的 具有由上升且承載基板w的銷14接受該基 3此’機械手部31可由不與台架13干涉的 0 12的上方的預定位置，且不與配置成格子 1 4干涉而成梳子形狀。使機械手部3 1移動 冓32的動作是藉由搬出用控制裝置μ控制。 龟驅動機構22及搬出驅動機構32可藉由電 ’其構成可採用以往已知者。 制裝置] :有CPU及記憶部(RAM和_)的電腦構 有用以執行規定的各功能之程式，塗佈 、搬進用控制裝置23及搬出用控 述程式執行的功能部各自且有位胃1 33 分曰丹有位置檢測部 :且，塗佈用控制裝置16是當作藉由前述 ?，具有控制銷14的升降動作，亦即銷驅 之超出控制部7。針對該超出控制部7的 1 月〇 ，裝置16的位置檢測部6&具有檢測銷 m的功能及檢測台架13的位置的功 ^ 4㈣部6b具有檢測機械手 的位置的功能’搬出用控制震置33的位置 檢測機械手部”讲I ^ 1 31對千台12的位置的功能。 進行的銷“的位置檢測可根據銷 1進仃’例如可藉由銷驅動機構上5所 201015660 具有’與使銷14升降的馬達等連接之編碼器（enc〇der)進 <亍位置H而且’針對其他的位置檢測也可藉由同樣的 構成實現。此外’針對機械手部21、3 i也可以藉由另外配 的卜接觸式的感測器（s e n s 〇 r )(例如圖3的感測器 1 7 a ~ 1 7 d )進行位置檢測。 ^ 此處針對感測器17a〜17d來說明。該等感測器17a〜17d 疋备作聯鎖（lnterl〇ck)而作用。該等感測器ir?a〜17d的檢 /則、”σ果的號被輸入塗佈用控制裝置1 6❶感測器1 h是用 ❹以防止機械手部3!與台架i 3接觸，感測器】Μ是用以防 止機械手邛21與台架13接觸。亦即，藉由機械手部31 矛機械手21不在後述的跟前位置而是位於平台1 2侧， 感測器1 7a、1 7d —成為on的狀態並成為檢測出機械手部 31、21的狀態，塗佈用控制裝置16就使台架13的移動停 止（禁止）。 而且，感測器1 7b是用以防止機械手部3丨與銷丨4上 的基板w接觸’感測器17c是用以防止機械手冑21與銷 © 14上的基板W接觸。據此，可確認機械手部31、21由平 “台12上退避。亦即，藉由機械手部31、2ι位於平台12 ，上’感測器17b、17c-成為〇N的狀態並成為檢測出機械 手部3卜21的狀態，塗佈用控制裝置16就使鎖14的移動 停止（禁止）。 [關於塗佈液之塗佈於基板W的動作] 說明藉由如以上構成的基板處理系統丨進行的塗佈液 之塗佈於基板W的處理。圖2是由上方看基板處理系統1 201015660 及圖5是說明塗佈處理 之概略構成圖。而且，圖3、圖 之說明圖。 (1、塗佈液的塗佈程序）The movement of the gantry 13, the discharge of the coating liquid in the gantry 13, the adsorption of the substrate W by the suction pump, and the operation of the pin drive mechanism 14 are controlled by the coating control device 16. . [Loading device 4 and carrying device 5] The loading robot 20 has a robot hand (transporting portion) 21 that carries the substrate W to which the coating liquid is applied, and moves the robot hand 21 1 4 1 to the pair. The coating apparatus main body 10 has a function of moving the driving mechanism 22 close to the direction (horizontal direction) and the vertical direction, and has a function of transferring the substrate w to the top surface of the pin 14 of the upper well. Therefore, the 'manipulator portion 21 can be moved, the position where the interference of 矜σ % 13 is moved to a predetermined position above the platform 12, and the comb shape is not interfered with the pin 14 which is arranged in a lattice shape and has risen. . The movement of the loading drive mechanism 22 for moving the robot unit 2 is controlled by the loading and holding mechanism 23. The unloading robot arm 30 has a robot hand (transporting portion) 31 that carries the substrate W that has completed the coating liquid, and the robot hand 31 is arbitrarily moved to the direction of the coating device body 10 in the direction of deviation (horizontal direction) ) and the upper and lower r universal direction of the drive 10 201015660 moving mechanism 32, and the function of the board W. 1 The position is moved to the unloading pin of the flat 1 and the drive is driven. In addition, the 3rd actuator is configured. [About each control. The coating control device 33 is y. In the memory section, the control device 16 is used as the work performed by the front (6a ' 6b ' 6c) program; the motion © function of the moving mechanism 15 is later described by the coating control, U (the tip) i can. The loading control unit 21 has the platform 1 detecting unit 6c having the above-mentioned position 4 driving mechanism 15 having the pin 14 having the rising substrate and carrying the substrate w. The 'manipulator 31 can be interfered with the gantry 13 The predetermined position above 0 12 is not formed into a comb shape by being arranged to interfere with the lattice 14 . The operation of moving the manipulator 3 1 to the 冓 32 is controlled by the carry-out control device μ. The turtle drive mechanism 22 and the carry-out drive mechanism 32 can be configured by a conventional one. System: A computer having a CPU and a memory unit (RAM and _) is used to execute a predetermined function, and each of the functional units executed by the application control device 23 and the carry-out control program has a bit. The stomach 1 33 has a position detecting unit: the coating control device 16 is configured to have the control pin 14 ascending and descending, that is, the pin drive is beyond the control unit 7. The position detecting unit 6& having the function of detecting the pin m and the function of detecting the position of the gantry 13 has a function of detecting the position of the manipulator for the operation of the carry-out control. The position detection robot of the shock 33" speaks the function of I ^ 1 31 to the position of the thousand 12 . The position detection of the pin "can be carried out according to the pin 1", for example, by the pin drive mechanism on the 5 201015660 The encoder connected to the motor or the like for raising and lowering the pin 14 enters the <亍 position H and 'other position detection can be realized by the same configuration. Further, the position detection can be performed for the robot parts 21, 3 i by an additionally provided touch sensor (s e n s 〇 r ) (for example, the sensor 1 7 a to 17 d of Fig. 3). ^ This is explained here for the sensors 17a to 17d. The sensors 17a to 17d are configured to be interlocked (lnterl〇ck). The sensors ir?a~17d are inspected and/or, "the number of the σ fruit is input to the coating control device. The sensor 1h is used to prevent the robot 3! from coming into contact with the gantry i3. The sensor is used to prevent the robot hand 21 from coming into contact with the gantry 13. That is, the robot hand 31 is not in the front position described later but on the platform 1 2 side by the robot hand 31, the sensor 1 7a, 1 7d - The state of being on is the state in which the robot parts 31, 21 are detected, and the coating control device 16 stops (disables) the movement of the gantry 13. Further, the sensor 17b is used The manipulator 3 is prevented from coming into contact with the substrate w on the pin 4. The sensor 17c is for preventing the mandrel 21 from coming into contact with the substrate W on the pin © 14. Accordingly, it can be confirmed that the manipulator portions 31, 21 are Flat "Taiwan 12 backed off. In other words, when the robot parts 31 and 2 are located on the stage 12 and the upper 'sensors 17b and 17c' are in the state of 〇N, the state of the robot 3 is detected, and the coating control device 16 makes The movement of the lock 14 is stopped (disabled). [Operation of Application of Coating Liquid to Substrate W] The application of the coating liquid by the substrate processing system 以上 configured as described above to the substrate W will be described. Fig. 2 is a plan view showing a substrate processing system 1 201015660 and Fig. 5 for explaining a coating process. 3 and the explanatory diagrams of the drawings. (1. Coating procedure of coating solution)
在圖2中台架13進行為塗佈塗佈液於基板#而由初始 位置E移動至完成塗佈作業的作業完了位置f，更由作業 完了位置F返回初始位置E之動作。亦即，台架13進行由 初始位置E開始移動，到達作業完了 M 位置E之往復動作。該往復動作是藉由塗佈用控制裝置^ 〇 ❹ 控制。初始位置Ρ θ # A，，k 立 、a疋基口 11的一端部的位置，且即使機械 、入平台12上，機械手部21、31也不與台架 13干涉的位置。+ 相反地，在台架13的移動中若機械手部 21、31進入平厶1ri丨 Q W上，則兩者會碰撞。作業完了位置F 是基台11的另〜 端#的位置。台架13的各位置是藉由塗 佈用控制裝置1 6沾 >，十、你罢〜 b的前述位置檢測部6a (參照圖丨）檢測。 在圖1中g i ^ ^ ^ Aia ^ ^ 主控制裝置2透過通信線L1將當作指令 π制裝署〗fi液的塗佈作業開始的開始信號傳送至塗佈用 :機械丰邱j則前述感測器17a、17d為0FF狀態（未檢測 出機械手部31、？】认业能、、士 β 16的控制，^ 確認’藉由塗佈用控制裝置 π 13進行往復動作於基台11上，在其間塗 佈堂佈液於平合 ,, 吸附於平台12上上 板w°塗佈塗佈液時，基板W被 2透過而:信13進：前述往復動作時，由主控制裝置 及搬出動作的運’Λ作指令信號之容許基板W的搬進 送可能k號預先傳送至搬進用控制裝置 201015660 23及搬出用控制裝 及搬出用控制裳置 location)的機械手 的狀態。 置33 °據此’成為搬進用控制裝置23 33等待使位於退避位置（evacuat i〇n 部21、31開始進出於平台1 2側的信號 ❺ 、 在别述往復動作中主控制裝置2透過通信線L1 :用以使位於退避位置的機械手部21、31進出至後述的跟 刖位置的準備信號傳送至塗佈用控制裝置1 6。成為塗佈用 1裝i 16 由接收前述準備信號發出使機械手部 、1開始進出於跟前位置的信號之狀態。In Fig. 2, the gantry 13 performs an operation of applying the coating liquid to the substrate #, moving from the initial position E to the job completion position f where the coating operation is completed, and returning to the initial position E from the job-finished position F. That is, the gantry 13 is moved from the initial position E to the reciprocating motion of the M position E after the completion of the operation. This reciprocating motion is controlled by the coating control device. The initial position Ρ θ # A,, k is the position of one end of the base port 11, and the mechanical hand 21, 31 does not interfere with the gantry 13 even if it is mechanically or in the platform 12. + Conversely, if the manipulators 21, 31 enter the flat 1ri丨 Q W during the movement of the gantry 13, the two will collide. The position F at the end of the job is the position of the other end # of the base 11. The respective positions of the gantry 13 are detected by the position detecting unit 6a (see Fig. 十) of the coating control device 16. In Fig. 1, gi ^ ^ ^ Aia ^ ^ main control device 2 transmits the start signal of the start of the coating operation as the command π system to the coating through the communication line L1: The sensors 17a and 17d are in the 0FF state (the robot unit 31 is not detected, and the control is performed, and the control of the β 16 is performed.) It is confirmed that the reciprocating operation is performed on the base 11 by the coating control device π 13 . When the coating liquid is applied to the flat plate and is applied to the upper plate of the platform 12 and the coating liquid is applied to the upper surface of the table 12, the substrate W is permeable to the substrate 2: the letter 13 is advanced: when the reciprocating operation is performed, the main control device And the state of the robot that allows the transfer of the substrate W to the carry-out operation signal, which is transmitted to the carry-in control device 201015660 23 and the carry-out control device and the carry-out control device. According to this, the load control device 23 33 waits for the retracted position (the signal ❺ eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva eva 主 主 主 主 主 主 主 主Communication line L1: a preparation signal for allowing the robot parts 21 and 31 located at the retracted position to enter and exit to the Achilles position described later is transmitted to the coating control device 16. The coating 1 is installed to receive the preparation signal. A state is issued in which the robot hand and the 1 start to enter the position of the front position.
接又刚述準備信號的塗佈用控制裝置1 6以前述 < =中的規定的時序透過通信線u冑當作動作信號 置33垃備化號傳送至搬出用控制裝置33。搬出用控制裝 罝以一接收前述進 旱備彳5唬，就立即使位於待機位置的 機械手部31移動至基台u 表示的位置）。此處，2的二點鍵線 手部31的絲# μ 機械手部31的跟前位置為在該機械 、 對平台12成最短距離的位置 台架13，為最拯折么加 不會干涉 械手部3]^ /於13的位置。位於該跟前位置的機 側）。〖；比台架13的軌跡還外側（與平台12相反 該機械手部3 1 進行。而且，位於跟 架1 3干涉（參照圖 機械手部31與台架 搬出用控制裝置33 的移動是在台架13的前述往復動作中 前位置的機械手部31不與移動中的台 3(a))。亦即，可藉由感測器17a防止 13干涉。具體上，機械手部31是藉由 的位置檢測部 6C而位於跟前位置而被 © ❹ 201015660 驅動控制。假設機械手部31不在跟前位置而是位於平A 12侧的情形’藉由感測器⑺被⑽使台架i3的移 。 據此，可事前避免機械手部31與台架13碰撞。 此。 而且’右機械手部31完成移動至跟前位置，則搬 控制裝置33透過通信線L5將當作動作信號的進 ： 了信號傳送至塗佈用控制裝置16。 花 如此接收别述進入準備信號的搬出用控制裝置 :該進入準…為契機(亦即進入準備信號成為板1 (t n g g e r))，在台架i 3的前述往復動作完了前開始使 待機位置的機械手部31移動至跟前位置，使台架： 復動作與機械手部31的進人準備動作—部分並行。而且住 :往復動作中機械手部31到達跟前位置。如此，藉由使捲 械手部31預先移動至跟前位置，可預先縮短由待機位置^ 平台12上的位置之機械手部31的移動衝程(…師而 且’藉由在台架1 3的往復動作完了前使機械手部3 i 入準備動作開可使塗佈塗佈液於基板w的處理用之‘ 架13的往復動作與接受基板界用之機械手部31的移動二 間地重疊，可縮短接受基板W用的時間。 、 ' 本發明的基板處理系統1可執行的並行動作 :中二為：：構件之間的並行動作:塗佈裝置3所具 句對基板W施以塗佈液的塗佈處理而動作的 部之台举1 q · 作 ^ ’搬出襞置5所具備，為搬出基板w而對塗佑 裝置本體10接近背離移動之搬出機械手臂30(機械手部 31)。藉由香德& 怖用控制裝置16與搬出用控制裝置33透過專 Ο ❹ 201015660 用通信線L5連接，以τ「 ι通k線L5在塗佈用押 與搬出用控制裝置33之：控制裝置16 ^ 1 S ^ ^ Ψ μ ^ . 仗逛仃乜號的傳送接收，使台 架13與搬出機械手臂3〇的動作 -Γ 'f ^ ^ ^ /λ 乍時序精畨地連繫，使執行 刖述並灯動作的控制為可能。 (2、搬出程序） 說明由平台12搬出塗佈有塗佈液的基板W之 序。 在平σ 12上基板W的吸附被解& 16檢測出台架制裝置 a、， 到刖述初始位置E(參照圖2)，則在 確認了感測器1 7a成為off的狀離接 的狀〜、後，開始搬出程序。台 架1 3 一返回到初始位w p 塗佈用控制裝置1 6就控制銷 驅動機構15，如圖3(b) ^ ^ ^ )所不使銷14上升。據此，變成基 板W離開平台12承载於銷14的尖端的狀態。 此處使銷14上升時藉由塗佈用控制裝置16確認有 感測器1 7b成為0FF。假 又'^機械手部31超越跟前位置位於 平台1 2側的情形，藉由感 饮測Is 1 7b破on使銷丨4的上升停 止。亦即，在機械手部31 义 1不在跟别位置而是位於平台1 2 側的狀態下並在使銷i 4驅 細動且使基板W上升的情形下，有 機械手部31與基板w干渉，且w 4。 τ沙，基板W損傷之虞。因此，藉由 確認在使銷1 4上升時感測 ^ ^ ^ a叫器17b成為〇FF，可避免基板w 損傷。 銷14為其尖端可移叙认瓜a 砂動於千台12的上方的上目標位 置，且該上目標位置的更 又上方的上超出位置而被配設，為 了將基板W傳遞至機械手 卞坪31的處理，後述的上超出動作 16 201015660 被進行《此外，上目標位置是機械手部3丨（機械手部2!) 可進入平台12上的位置，是使該基板配置於比該機械手 部31還上面的位置，俾承载於銷14的尖端的基板w不干 涉為基板w的遞送而於水平方向接近到平台12上的機械手 部31。而且，上超出位置為比上目標位置更上方的位置， 即使是銷14的尖端位於上超出位置的狀態，該尖端上的基 板W與機械手部31也不干涉。 刖述[上超出動作]是藉由塗佈用控制裝置16的前述 超出控制部7控制銷驅動機構15而被執行的動作’為如圖 6(銷14尖端的位置的說明圖）所示藉由使初始位置（尖端 為平台12的頂面以下）的銷14上升’使銷14的尖端朝上 方通過上目標位置’且到達上超出位置後使銷i 4下降， 使銷14的尖端由上超出位置折回並使其到達上目標位置 為土的動作。 因塗佈用控制裝s i 6(位置檢測冑…是可取得關於 鎖1 4 (的尖端）的高度位置之資訊，故可檢測銷Η的尖端 _到達上目標位置。因此，若位置檢測部6a在前述上超 ，作中檢測出位於初始位置的銷14的尖端成為上目標位置 ，以上’則塗佈用控制裝置16透過通信線L5(參照圖^將备 作動作信號之使機械手部31由前述跟前位置開始進^ 台12上之進入開始信號傳送至搬出用控制裝置33。 ^進人開始信號的搬出用控制裝置33以該進入開 始信號為契機(亦即進入開始信號成為扳機），在前述超出 動作完了前使機械手部31開始進入平台12上，可使鎖超二 17 201015660 的上超出動作與機械手部31的進入平台12上 分並行（包含第一超出動作的並行動作）。而且 所示，在機械手部31進入平台12上的途中，逢 由上超出位置返回到上目標位置並到達上目 '此，藉由在銷14的上超出動作完了前使機械1 ，入開始’可使為傳遞基板W的處理而使銷14的 目標位置的動作與搬出基板w用的機械手部3ι 地重疊，可縮短遞送並運送基板w用的時間。 0 而且’針對前述上超出動作時的銷14的移 圖7來說明。在初始位置停止的銷丨4到隨著開 度變成規定值（最大移動速度）為止被加速（時玄 規定值變成等速。此外，以高速使銷14升降的 15之機械的構成上，為了使銷14在規定的位 在該使其停止的位置的跟前使其減速。因此， 藉由前述超出控制部7的控制，在銷14的尖端 位置的跟前使銷1 4減速（時刻12〜1； 3 )。如此 Q 的尖端到達上超出位置的跟前使銷1 4減速，故 * 置的銷14的尖端可迅速地超越上目標位置。 - 此外，比較例如以圖7的虛線表示的，在 尖端移動至上超出位置，而是直接到達上目標 下，需使銷減速直到銷的尖端到達上目標位置 位置使其停止（設速度為零）。因此，比較例的 初使銷的尖端到達上目標位置為止的時間若與 則僅慢時間△ t。 的動作一部 ，如圖3(c) $ 1 4的尖端 隱位置。如 •部31的進 尖端到達上 的移動時間 動速度藉由 始上升其速 1 11)，以該 銷驅動機構 置停止，需 在本發明中 到達上超出 ’因在銷14 位於初始位 不是使銷的 位置的情形 ’在上目標 情形，到最 實施例比較 18 201015660 依照實施例，藉由飿，， ， 銷14的矣端提早到達上目標位置， 能以早的時序得到銷14认， ^ 的尖端上的基板w與機械手部31 不干涉的狀I、。因此，* I , 馬基板W的遞送而能以早的時序传 機械手部31開始接近平&， 叮β仗 0 上，可縮短為運送基板 - 需的時間。而且，藉由使鈕， ,, 所 置，可使銷14到達上目抻 外u上目铩位 * _目襟位置（時刻，可使其準備於 接者進订的基板W的遞送鸯^乍 而且，因超出控制部7 ❹The coating control device 16 that has just described the preparation signal transmits the signal to the carry-out control device 33 via the communication line u胄 as the operation signal 33 at a predetermined timing in the above <=. The carry-out control device immediately moves the robot hand portion 31 at the standby position to the position indicated by the base station u as soon as the receiving of the drought preparation device 5 is received. Here, the front position of the wire #μ robot hand 31 of the two-point key hand portion 31 of 2 is the position of the machine at the shortest distance to the platform 12, which is the most sturdy and does not interfere with the machine. Hand 3] ^ / at the position of 13. Located on the side of the front position). The trajectory of the gantry 13 is outside the trajectory (the robot part 3 1 is opposite to the platform 12), and is located in the frame 13 (see the movement of the robot hand 31 and the gantry carry-out control device 33). The robot portion 31 at the front position in the reciprocating motion of the gantry 13 is not in contact with the moving table 3(a)). That is, the interference can be prevented by the sensor 17a. Specifically, the robot portion 31 is borrowed. The position detecting unit 6C is located at the front position and is driven and controlled by © ❹ 201015660. It is assumed that the robot hand 31 is not in the front position but on the side of the flat A 12 'shifts the gantry i3 by the sensor (7) According to this, the robot hand 31 can be prevented from colliding with the gantry 13 in advance. Further, when the right hand unit 31 is moved to the front position, the transport control device 33 transmits the action signal through the communication line L5. The signal is transmitted to the coating control device 16. The receiving control device for receiving the preparation signal is received as follows: the entry is a trigger (that is, the entry preparation signal becomes the board 1 (tngger)), and the gantry i 3 Before the reciprocating action is completed, it starts to wait The robot portion 31 of the position is moved to the front position, so that the gantry: the repetitive motion is in parallel with the advancement of the robot hand 31. In addition, the robot hand 31 reaches the front position during the reciprocating motion. The reeling hand 31 is moved to the front position in advance, and the movement stroke of the robot hand 31 at the position on the standby position ^ platform 12 can be shortened in advance (... and the machine is made "before the reciprocating motion of the gantry 13 is completed When the hand 3 i is ready for the operation, the coating liquid can be overlapped between the reciprocating operation of the holder 13 for the processing of the substrate w and the movement of the robot 31 for receiving the substrate, and the receiving substrate W can be shortened. The time used in the substrate processing system 1 of the present invention: the second operation is: the parallel operation between the members: the coating device 3 applies the coating treatment to the substrate W In addition, the moving part is provided with a moving machine arm 30 (manipulator part 31) which is provided to move out the substrate w and move closer to the coating device body 10. ; horror control device 16 and carry-out control Set 33 through the special ❹ 201015660 connected by the communication line L5, τ " ι 通 k line L5 in the coating use and carry-out control device 33: control device 16 ^ 1 S ^ ^ Ψ μ ^. The transmission and reception of the number makes it possible to precisely control the operation of the gantry 13 and the movement of the robot arm 3Γ-f 'f ^ ^ ^ /λ 乍, and it is possible to perform the control of the illuminating operation. Procedure) The sequence of the substrate W coated with the coating liquid is carried out by the stage 12. The adsorption of the substrate W on the flat σ 12 is detected and the gantry device a is detected, and the initial position E is described (see the figure). 2) Then, after confirming that the sensor 17a is off, the load-out procedure is started. When the carriage 1 3 returns to the initial position w p , the coating control unit 16 controls the pin drive mechanism 15 so as not to raise the pin 14 as shown in Fig. 3 (b). According to this, the state in which the substrate W is carried away from the tip end of the pin 14 is caused. Here, when the pin 14 is raised, it is confirmed by the coating control device 16 that the sensor 17b becomes 0FF. In the case where the robot hand 31 is beyond the front position on the side of the platform 12, the rise of the pin 4 is stopped by the sensation of Is 1 7b. In other words, in the state where the robot 1 is not in the other position but on the side of the platform 1 2 and the pin i 4 is driven to move and the substrate W is raised, there are the robot 31 and the substrate w. Dry, and w 4. τ sand, the damage of the substrate W damage. Therefore, it is possible to avoid damage of the substrate w by confirming that the sensor 17b becomes 〇FF when the pin 14 is raised. The pin 14 is configured such that its tip can be moved to the upper target position above the thousand 12, and the upper target position of the upper target position is over-positioned, in order to transfer the substrate W to the robot The processing of the 卞 31 31 is performed at the upper limit operation 16 201015660 which will be described later. Further, the upper target position is a position at which the robot 3 丨 (manipulator 2!) can enter the stage 12, and the substrate is placed at a higher position. The robot hand 31 is also above the position, and the substrate w carried by the tip end of the pin 14 does not interfere with the delivery of the substrate w and approaches the robot hand 31 on the stage 12 in the horizontal direction. Further, the upper over position is a position higher than the upper target position, and even if the tip end of the pin 14 is in the upper out position, the base plate W on the tip does not interfere with the robot portion 31. The above-mentioned [overrun operation] is an operation "executed by the above-described control unit 16 for controlling the pin drive mechanism 15 beyond the control unit 7" as shown in FIG. 6 (illustration of the position of the tip end of the pin 14). The pin 14 is lowered by raising the pin 14 of the initial position (the tip is below the top surface of the platform 12) so that the tip end of the pin 14 passes upwardly through the upper target position and reaches the upper excess position, so that the tip end of the pin 14 is An action that folds back beyond the position and causes it to reach the upper target position. Since the coating control device si 6 (position detecting 胄 is information on the height position of the tip of the lock 14), it is possible to detect that the tip _ of the pin _ reaches the upper target position. Therefore, if the position detecting portion 6a In the above-described super-high, it is detected that the tip end of the pin 14 at the initial position is the upper target position, and the above-described application control device 16 transmits the communication line L5 (see FIG. The entry start signal from the front position to the front stage 12 is transmitted to the carry-out control unit 33. The carry-in control unit 33 of the incoming start signal is triggered by the entry start signal (that is, the start start signal becomes a trigger). When the robot hand 31 is started to enter the platform 12 before the above-mentioned over-running operation is completed, the upper-out action of the lock super 17 201015660 can be paralleled with the entry platform 12 of the robot hand 31 (including the parallel action of the first over-movement) Moreover, as shown on the way that the robot hand 31 enters the platform 12, it returns to the upper target position from the upper position and reaches the upper position 'this, before the action is completed on the pin 14 The machine 1 can start the process of transferring the substrate W, and the operation of the target position of the pin 14 can be overlapped with the robot hand 3 for carrying out the substrate w, and the time for delivering and transporting the substrate w can be shortened. The pin 7 that has stopped at the initial position is accelerated until the opening degree becomes a predetermined value (maximum moving speed) (the time value becomes constant speed. In the configuration of the machine 15 for raising and lowering the pin 14 at a high speed, in order to decelerate the pin 14 at a predetermined position before the position at which the pin 14 is stopped, the pin 14 is decelerated by the control of the control unit 7 The tip end position of the 14 is decelerated by the pin 1 4 (time 12 to 1; 3). Thus, the tip of the Q reaches the upper end position and the pin 14 4 is decelerated, so that the tip end of the pin 14 can quickly overtake the upper target. Position. - In addition, for example, as indicated by the broken line in Fig. 7, when the tip moves to the upper position, but directly reaches the upper target, the pin needs to be decelerated until the tip of the pin reaches the upper target position to stop (set the speed to Zero). Therefore, the time until the tip of the pin of the comparative example reaches the upper target position is only a slow time Δt. The action is shown in Fig. 3(c) $1 4 at the tip hidden position. The moving speed of the moving tip of the portion 31 reaches the upper moving speed. The speed is increased by 1 11), and the pin driving mechanism is stopped. In the present invention, it is required to reach the upper end because the pin 14 is in the initial position and is not the pin. The situation of the position 'in the upper target situation, to the most embodiment comparison 18 201015660 According to the embodiment, by the 饳, , , the end of the pin 14 reaches the upper target position early, the pin 14 can be obtained at an early timing, the tip of ^ The upper substrate w and the robot hand 31 do not interfere with the shape I. Therefore, * I , the delivery of the horse substrate W can be transmitted at an early timing, and the robot hand 31 starts to approach the flat & 叮β仗 0, which can be shortened to the time required to transport the substrate. Moreover, by placing the button, , and so on, the pin 14 can be reached to the top of the upper target, and the position of the substrate can be made ready for the delivery of the substrate W.乍 Moreover, because it exceeds the control unit ❹
7進行速度控制，俾銷丨4在達到 最大移動速度後通過上曰柄 ^ J 払位置，故銷14的尖端可更迅速 地超越上目標位置，能以尺处迷 更早的時序使機械手部31開始接 近平台12上。而且，超幵1始接7 speed control, the 丨 丨 4 passes the upper shank ^ J 払 position after reaching the maximum moving speed, so the tip of the pin 14 can more quickly exceed the upper target position, and the robot can be made at an earlier timing. The portion 31 begins to approach the platform 12. Moreover, more than 1 starts
控制部7拉長圖7的等速（最大 移動速度）區間（亦即減绥站、± ^ A 14通過上目標位置也可 疋又使銷 超出控制部7具有可針對銷J 4 的上升及下降的速度及加 了蛸以 代迷調整（變更）的功能。 如圖3(d)所示，若嫉μ Λ a 右機械手部31於水平方向朝平 上移動並到達銷U上的基把w & 丁口^ ❹ 的基板W的下方位置，則搬出 裝置33的位置檢測部6cC| 用徑制 bc(參照圖1)檢測出其到達，進行藉 由搬出驅動裝置32使機械手部 ' 用控制裝置33透過通作線M 、二制，並且搬出 ^ ^ ^ ^ 11、 將當作動作信號的銷下降開 始號傳送至塗佈用控制装署】β w 褒置1 6。塗佈用控制裝置1 6 — 接收銷下降開始信號，位於上 ^ Πϋ fi ^ n 7 * 標位置的銷14的下降就開 始C圖6與圖7的時刻t5)。 ^ J tb；亦即，機械手部31的上升班 銷14的下降被並行進行，藉 升與 1 4 ^ ± ^ ^ ^ κ 機械手部31的頂面超越銷 14的A鈿並位移至上側，使 上的基板W被傳遞至機 201015660 械手部31上。藉由與機械手部的上升一起使銷14下 降，可縮小基板W的遞送所需的機械手部31的上升距離。 而且’位於跟則位置的機械手部31開始移動後到接受基板 W之間’搬出用控制裝置33透過通信線l5將當作動作信 '號的進入動作中信號傳送至塗佈用控制裝置16。 ^ 而且’在圖6與圖7中在時刻t5位於上目標位置的銷 14開始下降後，在時刻t6開始減速，然後基板w的遞送 實際被進行。亦即，基板W的遞送被進行時，令銷14的下 ❹降速度為低速。此乃是為了減弱基板w之遞送時的給予該 基板w的碰撞。而且’若完成遞送（時亥"7)，則使下降的 銷14加速切換下降速度成高速，超越下目標位置（時刻 t8)並使其減速，使其到達下超出位置（時刻切），然後使 銷14的移動方向翻卜斗 朝上升反轉，使其到達下目標位置（時刻 t 1 0 ) ° lit ’错由 由小 田在使穴端位於上目標位置的銷14下降， 使銷 14的尖端细·甘、又 朝下方使其通過下目標位置且到達下超出 位置後’使銷14上井，逸 上开進仃使銷14的尖端由下超出位置 ©折回並使其到達下目於^ 目祿位置為止的下超出動作。針對下目 •標位置及下超出位置於之後說明。 - 在搬出機械手臂30的；14 煮川的機械手部3 配設有檢測基板w 的有無之感測器（夫阁千、，你 ’、 出用控制裝置33可檢測機械 手。P 31上的基板ψ的有無。 銷14上的基板w 一被傳 ™ QO 吁廷至機械手部31，搬出用控 制裝置33就透過通作線[5脾a & 踝 將當作動作信號的基板接香穿 了 k號傳送至塗佈用辦制奘番】^ 神用控制裝置16。搬出用控制裝置33可 201015660 透過以前述感測器檢挪出基板 出前述基板接受完了信鏡。 、機械手部31上，輪 而且，若返回圖以 國3(b)說明的話，塗佑The control unit 7 lengthens the constant velocity (maximum moving speed) interval of FIG. 7 (that is, the deceleration station, ±^A 14 passes the upper target position, and the pin exceeds the control unit 7 to have a rise for the pin J 4 and The speed of the descent and the function of adjusting (changing) are added. As shown in Fig. 3(d), if 嫉μ Λ a the right manipulator 31 moves horizontally in the horizontal direction and reaches the base on the pin U. When the position of the lower surface of the substrate W of the w & 口 port ❹ is detected, the position detecting unit 6cC| of the unloading device 33 detects the arrival by the diameter bc (see Fig. 1), and the robot unit is moved by the unloading drive unit 32. The control device 33 passes through the line M and the system, and carries out the ^^^^11, and transmits the pin lowering start number as the operation signal to the coating control unit] β w 11 6 . With the control device 16 6 - receiving the pin down start signal, the drop of the pin 14 at the upper position of the upper ^ Πϋ fi ^ n 7 * starts C and Fig. 6 and time t5) of Fig. 7. ^ J tb; that is, the lowering of the ascending shift pin 14 of the robot hand 31 is performed in parallel, and the top surface of the robot hand 31 is overtaken by the A 钿 of the pin 14 and displaced to the upper side. The upper substrate W is transferred to the machine 201015660. By lowering the pin 14 together with the rise of the robot portion, the rising distance of the robot hand 31 required for the delivery of the substrate W can be reduced. Further, the 'movement unit 31 located at the following position starts to move between the receiving substrate W' and the carry-out control device 33 transmits an in-operation operation signal as the operation signal 'number to the coating control device 16 via the communication line 15. . ^ Further, after the pin 14 located at the upper target position at time t5 starts to descend in Figs. 6 and 7, the deceleration starts at time t6, and then the delivery of the substrate w is actually performed. That is, when the delivery of the substrate W is performed, the lowering speed of the pin 14 is made low. This is to weaken the collision given to the substrate w when the substrate w is delivered. Moreover, 'If the delivery is completed (Shi Hai " 7), the lowered pin 14 is accelerated to switch the descending speed to a high speed, and the lower target position (time t8) is exceeded and decelerated to reach the lower excess position (time cut). Then, the direction of movement of the pin 14 is reversed to the lower target position (time t 1 0 ) ° lit 'the error is lowered by the pin 14 of the field at the upper target position by the Oda, so that the tip of the pin 14 Thin, Gan, and then pass down to the lower target position and reach the lower position. After the pin 14 is up, the tip of the pin 14 is folded back from the lower position © and the lower end of the pin is reached. The lower position is beyond the position of the position. For the lower target position and the lower position, the explanation will be given later. - When the robot arm 30 is moved out; 14 The robot hand 3 of the boiled water is equipped with a sensor for detecting the presence or absence of the substrate w (Fukuk, you', the control device 33 can detect the robot. On P 31 The substrate w on the pin 14 is transferred to the robot hand 31 as soon as the substrate w is transferred, and the carry-out control device 33 passes through the common line [5 spleen a & 踝 will be used as the substrate for the action signal The scent is conveyed to the coating device to be applied to the coating device. The god control device 16 can be used to remove the substrate from the sensor by the sensor to receive the mirror. On the 31st, the round and, if the return figure is explained in the country 3(b), Tuyou
在銷"的前述上超出動作 ：用控制裝置U 號之使位於退避位置的* 通“良U將當作動作信 動至平台12的跟手臂2°的機械手部21移 制裝置23。據此，搬：入準備“傳送至搬進用控 機械手部2i移動至平，]裝置23使位於待機位置的 ❹ 待機位置至平Ml::2置的 =二，，預先使由 短。 置之機械手部21的移動衝程縮 前述搬進機械丰卷〇Λ ψ ^ ! 2 ^ 的機械手部21的[跟前位置；J是 卞Q 1 2的跟前的位置 J疋 [跟前仿番Ιλα冰山 此點與5又基台U的跟前的位置為 L跟別位置]的搬出機械 如箭、+. 亍質30的機械手部31不同。亦即 需Λ 30的機械手。ρ 31的[跟前位置]In the above-mentioned "excessive action" of the pin ": the U-way "good U" at the retracted position by the control device U is to be actuated as a movement to the robot hand 21 of the platform 12 by 2°. According to this, the loading/removing preparation "transfer to the loading control robot 2i is moved to the flat position", and the device 23 sets the 待机 standby position at the standby position to the level M1::2 = 2, which is shortened in advance. The movement stroke of the robot hand 21 is reduced to the front position of the manipulator portion 21 of the robot 丰 ! ^ ! 2 ^; J is the position of the front of the 卞Q 1 2 J 疋 [Following the imitation Panyu λα This point of the iceberg is different from the position of the arm of the 5 and the base U, which is the position of the L and the other position. That is, the robot that needs 30. ρ 31 [front position]
眾在塗佈動作後的台架 J U與機赫丰邱μ沾 移動至初始位置Ε時避免台架 手°卩31的接觸，故被設定於 ©徑還外的位置。<曰是，- 口东13的移動路 “ 疋因搬進機械手臂20的機械手部21 、始：：13完成移動至初始位置E(參照圖2)後，在位於初 即# a E的狀態下移動，故不被台架13的移動影響。因此， 是在台架13的移動路徑上也在平台12的跟前的位置 近的位置）设定有機械手部21的[跟前位置]。 機械手部21的跟前位置中，機械手部21與基板 6b '步。具體上，藉由搬進用控制裝置23的位置檢測部 使機械手部21由退避位置位於跟前位置而被驅動控 21 201015660 制。假設比跟前位置還靠平台j 2側的情形，透過感測器 17c被0N使銷1 4的動作被鎖緊。據此，可事前避免機械 手部21與基板W碰撞。 而且’如圖4(e)所示，藉由機械爭部31接受基板W， ^塗佈用控制裝置1 6接收前述基板接受信號，且檢測銷1 4 .的尖端到達下目標位置（圖6與圖7的時刻^8)，透過通信 線L5將當作動作信號之使讓機械手部31由平台12上退避 至前述待機位置側的動作開始的退避開始信號（退避開始 魯的扳機）傳送至搬出用控制裝置33。接收前述退避開始信 號的搬出用控制襄置33是藉由搬出驅動機構32使機械手 部31退避（參照圖4 ( f ))。 、與别述退避開始信號的傳送一起，塗佈用控制裝置丄6 透過通信線L4將當作動作信號之使機械手部21由平台u 的跟刖位置開始進入平台i 2上的動作之進入開始信號 入開始的板機）傳逆5^ 得送至搬進用控制装置23。接收前述 開始信號的搬進用柝也丨姑思〇 〇 # 八 巾控制裝置23藉由搬進驅動機構22佶名 ◎載下一個基板W的棬姑主加01 文承 刃機械手部21進出於平台12上（參昭固 據此’機械手部 進出 的動 制裴 鱿傳 置並 τ 4 31的退避動作與使機械手部2 於平台1 2上，將τ , 卜—個基板W搬進塗佈裝置本體1〇 作被並行進行。 到機械手部3 1 # r-w* ^ 1返回待機位置為止之間，搬出用 i 33透過通作始； ^ L5將當作動作信號的退避動作中 送至塗佈用控制奘要1p 裝置16。機械手部31 —超越跟前 22 201015660 退避至待機位"、、 夏、圓4(g))，搬出用控制裝置33就透過通 心線L 5將當作> f動作彳S唬的退避完了信號傳送至塗佈用控 制裝置16。而且，士 * ^ 成1為主控制裝置2可進行發出容許搬出 機械手臂30的叙 動作開始的指令信號的控制之狀態。而且， 右搬出用控制裝署咕丄 衣直d 3藉由前述感測器（未圖示）檢測出在 義 機械手部31上在力| | ^ 仔在基板W，則透過通信線L5將基板在籍 k 师用控制裝置16，且透過通信線L3將基板 I籍仏號傳送至主控制裝置2，主控制裝置2更新塗佈塗 ©佈液的基板$的P0S資料（data)。而且，由平台12搬出的 基板W前5,丨τ , < 下一個製程之利用乾燥裝置（VCD)進行的乾 燥製程。 (3、搬進程序） 說明將塗佈塗佈液的下一個基板W搬進平台12的搬進 程序。 在則述下超出動作中，若銷1 4的尖端最初到達下目才 ❹ f (圖6與圖7的時刻18)並成為該下目標位置以下，| 如則述’塗佈用控制裝置1 6傳送使機械手部31由平台1 上退避至Ά 4dfc «σ 付機位置側的動作開始的退避開始信號，並且？ 用控制裝置1 6透過通信線L4 (參照圖1)將當作動作信^ 之使機械手部21由跟前位置開始進入平台12上的進入丨 始信 2- 丹运至搬進用控制裝置23。搬進用控制裝置23· 、t_ % - 月1J【進入開始信號，如圖4 ( f )所示就使位於跟前位 的機械手·§β 9 1 # 4 义丁 #21移動至平台12上。 月’〗〔下目標位置如圖4(f)所示是承載基板w的機械 23 201015660 W Μ tW入平。12上的位置是在機械手部31上的基板 】/卜的/在銷14的尖端，俾藉由機械手部21搬進平台 下目標位置更下方…ί 置。而且，在比 -出位置，棬：y·» 則述下超出位置，即使是該下超 如前诚，手部31上的基板？與銷14的尖端也不干涉。 進入開始信：:契進機入(二始信號的搬進用控制裝置23以該 現為契機（亦即進入聞 述下超出動作* 了前成為扳機），在前 始。據此： 械手部21之進入…2上開 為了搬進基板W的處理，可使 作與機械手冑21之進入平台12上 \14的下超出動 第二超出動你 乍部分並行（包含 第超出動作之並行動作）。而且 台12上的、全山 长機械手部21進入平 a上的途中，銷14的尖端由下 位置並到達下目椤位署。士从 出位置返回到下目標 控制裝置16的ψ ，下超出動作是藉由塗佈用 裝置Π的則述超出控制部 行。 巧％動機構15而執 如此，藉由在銷14的下超出動 21的進入開始，可使為基板^ 二了前使機械手部 尖端到達下目標位置的動作，與傳遞下―處理而使銷14的 的處理用的機械手部21的移動時間地一個基板W至銷14 基板W所需的時間。而且， _叠’可縮短為運送 出位置的跟前（時刻t8〜t9)減速，銷 使銷14在下超 越下目標位置。因此，能以早的時的尖端可迅速地超 基板W與銷14的尖端不干涉的狀態^^機械手部21上的 械手部21開始接近平台12上， 此以早的時序使機 ''紐運送基板ft用的時 201015660 間。 而且’如圖4(g)所示若機械手部2i敕 並到達銷1 4的尖端的上方位置，則搬 動於水平方向 卿逆用控制奘罟9 q *未 過通信線L4將當作動作信號的銷上 透 佈用控制裝置16。此時’藉由感測器號傳送至塗 .台12上不存在機械手部31被確認：成為附’在平 與基板w的干涉被防止。而且，藉方即，機械手部^ 的塗佈用控制裝置16使銷升開始信號 ❹ 手部21的頂面並位移至上側， ：：：：機械 偯诚5鉑Hu, A 丁0丨“上的基板被 傳遞至銷14上（參照圖4(h))。此外，在 S4 , ,Λ ,, 社'^銷14的上升中 藉由超出控制部7進行與前述上超 (出動作相同的動作。 塗佈用控制裝置16若在該上超 的艄υ认，丨、 石你》上超出動作中檢測出上升 、 的尖端成為上目標位置以上，則透ϋ ϋ π & 使機械手部21由平台12上退避至退避位 置側的退避開私> ρ Μ π , 琥傳送至搬進用控制裝置23。 避開始信號的撫、4 ^ 進用控制裝置2 3以該退避開始信號為契 機（亦即退避開私彳士 上、 ' 。4就成為扳機）’在前述上超出動作完了 則使機械手部2〗★ τ ^丨之由平台1 2上退避開始。據此，可使銷 超出動作與機械手部21之由平台12上退避的動作 一部分並行（包冬笛_ ^ 3第二超出動作之並行動作）。而且，如圖 5 ( i )所示在機赫 手4 21由平台12上退避的途中，銷Η 的_尖端由上超屮& 0:1位置返回到上目標位置並到達上目標位 置。 "、 如此，藉士 + v 在鎖14的上超出動作完了前使機械手部 25 201015660 21的退避開始，可使為搬進基板w的處理而使銷"的尖 端到達上目標位置的動作，與搬入基板w後的機械手部η 的移動時間地重疊，可縮短基板w的運送所需的時間。而 且，在/述上超出動作中藉由使銷14的尖端在上超出位置 的跟前減速，使銷14的尖端可迅速地超越上目標位置，处 以早的時序使機械手部21由平台12上退避，可縮短運： 基板W用的時間。 、 、而且，到機械手部21移動至平台12上，將基板|傳 β遞至銷14之間，搬進用控制裝置23透過通信線u將當作 動作仏號之進入動作中信號傳送至塗佈用控制裝置^ 6。而 若機械手邛21上的基板w被傳遞至銷14，則搬進用 控制裝置23透過通信線u將當作動作信號之基板遞送完 了信號傳送至塗佈用控制裝置16。 而且，如圖5(j)所示搬進用控制裝置23使機械手部 2ι退避至待機位置側。到機械手部21返回到待機位置L ]搬進用控制裝置23透過通信線L4將當作動作信號之 ©，避動作中仏號傳送至塗佈用控制裝置16。若成為機械手 邵21超越跟前位置並退避至待機位置的狀態，則搬進用控 制裝置23透過通信線[4將當作動作信號之退避完了信號 傳送至塗佈用控制裝置16。 塗佈用控制裝置16 —接收前述退避完了信號，如圖 (k)所不，就使承載基板w的銷丨4下降，當作已將基板双 承載於平台12上的狀態。此時，藉由感測器i 7c為〇FF 被確遇’機械手部21與基板w的干涉被避免。而且，使基 201015660 板w吸附於平a 19 行機械手部2Γ—到達1前述塗佈製…且，成為可進 . j達待機位置，主控制裝置2就發出容 搬進機械手臂？今許 依照如 \ 開始的指令信號之控制的狀態。 上構成的基板處理系統1，因塗 -搬出裝置5可不读1神褒置3與 : 不透過主控制裝置2而直接藉 ，通信，塗佈裝置3與搬.隹姑、、 3田通仏線L5 直接藉由通信線"通、4可不透過主控制裝置2而 ^ ’ 通彳5，故精密地連繫塗佈裝置3與搬出 裝置5的動作時库 兴搬出 搬進裝置4的動及精密地連繫塗佈裝置3與 〇 的動作時序之控制變的容易。 二，藉由搬出用控制裝置33及搬進用控制裝置23 Γ在=…過通信線L5、“傳送的動作信= 4( 〇架13)到達目標位置（作業完了位動 作完了前使機械手部的移動開始，可使使銷 ）之動 到達目標位置(作業完了位置)之動作與基板w的遞二13) 機械手部的移動時間地重疊。因此，可縮短到搬進基“ 液於該…、搬出基板w為止的程序所需的時 Q間，可k尚基板w的生產效率（處理效率）。 “ …月別的實施形態的基板處理系統51所執行的並行 。動作。如圖8所示’該基板處理系統51為基板處理裝置且 備··乾燥裝置⑽）4〇、搬進裝置4及搬出裝置5。乾❹ 置40是使藉由前述塗佈裝置3塗佈有塗佈液的基板丄 塗佈膜乾燥。乾燥裝置4。具備:(相當於前述塗佈用控制裝 置16之）乾燥用控制裝置45、乾燥機械手臂46，乾燥 手臂46除了具備與前述塗佈裝置3同樣的基台41及升 201015660 I二？，還具備由上面覆蓋基台41上的基板W之蓋42, 與U42升降之蓋驅動機構43。搬進裝置4及搬 置5與在圖1的形態被使用者相同。 藉由乾燥機械手f 46乾燥基板”，如目8(a)所示， :蓋42在基台41上位於最下位置，藉由蓋42與基台 ，頂面形成有密閉狀態的乾燥用空間v。 、 位於基…頂面以下的位置。’且’銷“的上端 ο 若完成基板W的乾燥處理，則蓋 上方的上升位置(目標位置)。在該上升：動至基台“的 搬進機械手t 20的機械手部21及 ，即使成為 I:合 上的狀態，蓋42與機械手•"卜31 也不會干涉。相反地，到蓋4 部2卜31進入平”2上目二上升位置為止若機械手 由乾燥用控制裝二所且Γ 。蓋42的位置可藉 形態說明的一樣）檢測。 在刖述實施 ❹The gantry J U and the machine Hefeng Qiu μ smear after the coating operation are moved to the initial position 避免 to avoid the contact of the gantry hand 卩 31, so it is set at a position other than the © path. <曰是, - The movement path of the mouth 13 "Because the robot hand 21 of the robot arm 20 is moved to the initial position E (see Fig. 2), the movement is at the beginning of the time. In the state of being moved, it is not affected by the movement of the gantry 13. Therefore, the [front position] of the robot hand 21 is set in the position of the movement of the gantry 13 at a position close to the front of the platform 12. In the front position of the robot hand 21, the robot hand 21 and the substrate 6b are stepped. Specifically, the position detecting unit of the loading control device 23 causes the robot hand 21 to be driven by the retracted position at the front position. 21 201015660. It is assumed that the action of the pin 14 is locked by the sensor 17c by the 0N on the side of the platform j 2 from the front position. Accordingly, the robot 21 can be prevented from colliding with the substrate W in advance. As shown in Fig. 4(e), the substrate W is received by the mechanical contiguous portion 31, and the coating control device 16 receives the substrate receiving signal, and detects that the tip of the pin 14 reaches the lower target position (Fig. 6 and At time (8) of Fig. 7, the manipulator 31 is made flat by the communication line L5 as an action signal. The retraction start signal (the trigger for the retraction start) that has been retracted to the standby position side of the stage 12 is transmitted to the carry-out control device 33. The carry-out control unit 33 that receives the retraction start signal is carried out by the carry-out drive mechanism 32. The robot unit 31 is retracted (see FIG. 4(f)). Together with the transmission of the back-off start signal, the coating control unit 6 transmits the robot unit 21 as an operation signal via the communication line L4. When the A/A position of u starts to enter the start of the operation of the start signal on the platform i 2, the transfer 5^ is sent to the carry-in control device 23. The move for receiving the start signal is also used for the move. 〇〇# The eight-segment control device 23 is moved into the drive mechanism 22, and the 基板 主 主 01 01 文 文 文 文 文 文 文 文 文 文 文 文 文 文 文 文 文 文 文 文 ' ' ' ' ' ' ' ' ' ' ' ' The moving-in and out-out movement of the unit is performed and the retracting operation of the τ 4 31 is performed, and the robot unit 2 is placed on the stage 1 2, and the τ and the substrate W are carried into the coating apparatus main body 1 in parallel. Robot 3 1 # rw* ^ 1 returns to standby Between the two, the carry-out operation starts with the i 33; ^ L5 is sent to the coating control main 1p device 16 as the retracting operation of the operation signal. The robot unit 31 — goes beyond the front 22 201015660 and retreats to the standby position. ", summer, and round 4 (g)), the carry-out control device 33 transmits the retraction completion signal as the >f action 彳S唬 to the coating control device 16 through the center line L 5 . It is assumed that the main control unit 2 can perform control for issuing a command signal for permitting the start of the movement of the robot arm 30. Moreover, the right-handling control device is directly detected by the aforementioned sensor (not shown) on the mechanical hand 31, and the force is transmitted through the communication line L5. The substrate is transferred to the main control device 2 via the communication line L3, and the main control device 2 updates the P0S data of the substrate $ on which the coating liquid is applied. Further, the substrate W carried out by the stage 12 is subjected to a drying process of 5, 丨τ, < the next process using a drying device (VCD). (3. Loading procedure) A loading procedure for loading the next substrate W to which the coating liquid is applied into the stage 12 will be described. In the above-described excess operation, if the tip end of the pin 14 reaches the lower end ❹ f (the time 18 in Fig. 6 and Fig. 7) and becomes below the lower target position, the coating control device 1 is described. 6Transfers the retraction start signal for the robot hand 31 to be retracted from the platform 1 to Ά 4dfc «σ machine position side, and ? The control device 16 transmits the incoming start signal 2 to the loading control device 23 by the communication line L4 (refer to FIG. 1), which causes the robot hand 21 to enter the platform 12 from the front position. . Moving control device 23·, t_% - month 1J [Entering the start signal, as shown in Fig. 4 (f), moving the robot in the front position §β 9 1 # 4 义丁#21 to the platform 12 . Month's [the lower target position is shown in Fig. 4(f) is the machine 23 carrying the substrate w. 201015660 W Μ tW is leveled. The position on the 12 is the substrate on the robot portion 31. / at the tip end of the pin 14, and the robot hand 21 is moved into the platform. The lower position of the target position is lower. Moreover, at the ratio-out position, 棬:y·» is described as being out of position, even if the lower one is as good as before, the substrate on the hand 31? It does not interfere with the tip end of the pin 14. Entering the start letter:: Entering the machine (the second start signal of the loading control device 23 takes the current opportunity (that is, it becomes the trigger before going through the action*), at the beginning. According to this: The access of the portion 21 is opened in order to move into the substrate W, so that it can be paralleled with the lower end of the entry of the manipulator 21 onto the platform 12 by the second overrun (including the parallel operation). And the whole mountain long manipulator 21 on the table 12 enters the middle of the flat a, the tip end of the pin 14 is from the lower position and reaches the lower target position. The return from the out position to the lower target control device 16 ψ The lower movement is performed by the coating device, and the control unit is further described. The oscillating mechanism 15 is configured to be the substrate 2 by the entry of the movement 14 beyond the pin 14 . The time required for the tip end of the robot to reach the lower target position and the time required for the movement of the robot hand 21 for processing the pin 14 from one substrate W to the pin 14 substrate W. , _Stack' can be shortened to the front of the shipping position (time t8) ~ t9) Deceleration, the pin causes the pin 14 to move beyond the lower target position. Therefore, the tip of the early stage can quickly superimpose the state of the substrate W and the tip of the pin 14 ^^ the hand on the robot hand 21 21 starts to approach the platform 12, which makes the machine ''new transport substrate ft for 201015660 at an early timing. And 'as shown in Fig. 4(g), if the robot 2i敕 reaches the tip of the pin 14 In the upper position, it is moved to the horizontal direction reverse control 奘罟9 q * The communication line L4 will be used as the action signal for the pin-through control device 16. At this time, 'the sensor number is transmitted to the coating. It is confirmed that the robot hand 31 is not present on the table 12: the interference between the flat plate and the substrate w is prevented. Further, the coating control device 16 of the manipulator portion causes the pin to start the signal. The top surface of the portion 21 is displaced to the upper side, :::: mechanical 偯 5 5 Platinum Hu, A 丨 0 丨 "the upper substrate is transferred to the pin 14 (refer to Figure 4 (h)). In addition, at S4, Λ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In the above-mentioned super-recognition, 丨, 石你", the tip that detects the rise in the action exceeds the upper target position, then the robot hand 21 is retracted from the platform 12 to the retracted position by ϋ π & The side avoidance opening and closing ρ Μ π is transmitted to the loading control device 23. The avoidance start signal and the 4^ access control device 2 3 take the back-off start signal as an opportunity (ie, retreat Gentleman, '.4 becomes a trigger.' 'When the above action is exceeded, the manipulator 2 is finished. ★ τ ^丨 is started by the platform 1 2 retreat. According to this, the pin exceeding operation can be partially paralleled with the movement of the robot unit 21 by the platform 12 (the parallel movement of the second out of action). Further, as shown in Fig. 5(i), on the way back from the platform 12, the _tip of the pin 返回 is returned to the upper target position by the upper super 屮 & 0:1 position and reaches the upper target position. " In this way, the withdrawal of the robot hand 25 201015660 21 is started before the movement of the lock 14 is completed, and the tip of the pin " can be reached to the upper target position for the process of loading the substrate w The operation overlaps with the movement time of the robot portion η after the substrate w is carried in, and the time required for the conveyance of the substrate w can be shortened. Moreover, the tip end of the pin 14 can quickly overtake the upper target position by causing the tip end of the pin 14 to decelerate in front of the over-exceed position during the over-exertion action, causing the robot hand 21 to be on the platform 12 at an early timing. Retreat can shorten the time required for the substrate: W. And, when the robot hand 21 moves to the platform 12, the substrate|transfer β is transferred between the pins 14, and the loading control device 23 transmits the signal into the operation as the motion nickname through the communication line u. Coating control device ^ 6. On the other hand, when the substrate w on the mandrel 21 is transferred to the pin 14, the carry-in control device 23 transmits a signal indicating that the substrate is an operation signal to the coating control device 16 via the communication line u. Further, as shown in Fig. 5(j), the loading control device 23 retracts the robot hand 2ι to the standby position side. When the robot unit 21 returns to the standby position L, the loading control device 23 transmits the © as the operation signal via the communication line L4, and transfers the nickname to the coating control device 16. When the robot 21 is in a state of being overtaken to the standby position and is retracted to the standby position, the loading control device 23 transmits a signal indicating that the operation signal is retracted to the coating control device 16 via the communication line [4]. The coating control device 16 receives the aforementioned retraction signal, and as shown in (k), the pin 4 of the carrier substrate w is lowered to be in a state in which the substrate is double loaded on the stage 12. At this time, the interference of the robot hand 21 and the substrate w is avoided by the sensor i 7c being 〇FF. Further, the base 201015660 plate w is adsorbed to the flat a 19 row robot hand 2 to reach the above-mentioned coating system... and it becomes possible to enter the standby position, and the main control device 2 is discharged into the robot arm. This is the state of control according to the command signal starting with \. In the substrate processing system 1 configured as described above, the coating-unloading device 5 can not directly read the sacred device 3 and: directly borrows, communicates with the main control device 2, and the coating device 3 and the mobile device are moved. The line L5 can be passed through the communication line "Tong, 4 without passing through the main control unit 2, so that the movement of the loading and unloading unit 4 is precisely connected when the application device 3 and the unloading device 5 are operated. It is easy to control the timing of the operation of the precision coating device 3 and the crucible. Second, by the carry-out control device 33 and the carry-in control device 23, the communication line L5 and the "transmission operation signal = 4 (the truss 13) reach the target position (the robot is placed before the operation is completed). When the movement of the part is started, the movement of the pin) to the target position (the position where the work is completed) can be overlapped with the movement time of the robot hand by the movement of the substrate w. Therefore, the movement can be shortened to the liquid. In the case of the time Q required to carry out the process until the substrate w is carried out, the production efficiency (processing efficiency) of the substrate w can be made. "Parallel operation performed by the substrate processing system 51 of the embodiment of the month. As shown in Fig. 8, the substrate processing system 51 is a substrate processing apparatus, and the drying device (10)) 4, the loading device 4, and the loading and unloading In the apparatus 5, the dry coating 40 is used to dry the substrate coating film coated with the coating liquid by the coating device 3. The drying device 4 is provided with: (corresponding to the coating control device 16) for drying The control device 45, the drying robot arm 46, and the drying arm 46 include a base 41 and a riser 201015660I similar to the above-described coating device 3, and a cover 42 for covering the substrate W on the base 41, and U42. The lid drive mechanism 43 is raised and lowered. The loading device 4 and the loading unit 5 are the same as those of the user in Fig. 1. The substrate is dried by the drying robot f 46, as shown in item 8 (a): the cover 42 is The base 41 is located at the lowest position, and the lid 42 and the base are formed with a drying space v in a sealed state on the top surface. , located at the top of the base... below the top. The upper end of the 'and 'pin' ο the raised position (target position) above the cover when the drying process of the substrate W is completed. The rise: the robot hand 21 that moves to the base "moves into the robot t 20 and Even if it is in the state of I: closed, the cover 42 and the robot • " Bu 31 will not interfere. On the contrary, when the cover 4 is inserted into the flat 2" position, the robot is controlled by the drying control device 2 and the position of the cover 42 can be detected by the description. ❹
該實施形態中的並行動作如 作:當作為施以使基板w乾燥的處理而進行== 作部之前述蓋t前述搬出裝置5所具備，為下運動:基的動 而對基台41接近背離移動之機械手部31。心基板W 棬，2:實現該並行動作’與前述的實施形態(圖1) -，U控制裝置45與搬出用控制裝置33藉由專用诵 信線“連接。而且，藉由以該通信線L5在乾 置45與搬出用控制裝…間進行信號的制； 蓋42與㈣機械手臂㈣動作時序連繫的控制為可能 201015660 說明藉由如此構成的基板處理系統51進行的基板w 的乾燥處理。藉由塗佈裝置塗佈有塗佈液的基板w藉由搬 進裝置4搬進乾燥機械手臂46的基台“上，蓋42下降 最下位置，在前述乾燥用空間v内使基板乾燥（參 • 8U))。基板W的乾燥一結束，就使蓋42移動至基二 ，的上方的上升位置（目標位置），並且為將基板W傳遞至搬 出機械手臂30而使銷44 I· 41·并I Α 肖44上升並舉起該基板W。蓋42的！· 升動作時，主控制裳詈9 、S 1 置2透過通h線將使機械手部3 1淮φ ❹ 於乾燥機械手臂46的跟前位置（以圖8的二點鏈 = 位置）用的準備信號傳送至乾燥㈣制裝置45。 接收準備信號的乾、鹿田μ # J乾燥用控制裝置45在蓋42的 作中，透過通信線L5將也从紅工开動 田作動作信號之使位於退避位 機械手部31進出至乾燥地 置的 笵厍機械手臂46的跟前位置的進 備信號傳送至搬出用控击丨 準 用控制裝置33。接收進入準備 出用控制裝置33以該推χ谁μ 现的搬 違入準備信號為契機（亦即進 信號成為扳機），在蓋疋八早備 ❹ 42的前述上升動作完了前使位於牲 機位置的機械手部31 ρ弓於待 巧始朝前述跟前位置移動。此外， 於刖述跟前位置的機械手 位 硕予部31不與上升中的蓋42 據此，可使蓋42的上斗紅仏 ^卞少。 升動作與搬出機械手臂3〇的準 入動作一部分並行。町平備進 Ββ ± _ 稽由使位於待機位置的機械手部3】 開始朝跟前位置移動， 于Idl 預先縮短由待機位置到基A 4】 上的位置之機械手部31& 』悉口41 的移動衝程。而且，藉由在蓋 的上升動作完了前使搬出^ 在盍42 出機械手臂3 0的進入開始，可使莖 4 2的上升動作與接受某了使盖 坂W的處理用的機械手部 201015660 動時間地重疊’可縮短運送基板w用的時間。 而且’乾燥用控制裝置45若檢測出蓋42到達 升位置，則透過通信線L5將當作動作信號之使機 31由前述跟前位置開始進入基台41上的進入開始 - 送至搬出用控制裝置33，搬出用控制裝置33以該 - 始信號為契機’使機械手部31開始進入基台41 8(c))。而且，與前述形態一樣，機械手部31接^ 上的基板W’可搬出該基板w» φ 此外，本發明的基板處理系統1不限於圖示的 在本發明的範圍内為其他的形態者也可以。在前述 態中雖然是以在裝置間傳送接收信號的傳輸路徑當 線（纜線）來說明，惟該傳輸路徑藉由無線構成也可 且’主控制裝置2與塗佈用控制裝置16不是不同體 收納於共同的框體内的裝置也可以。 【圖式簡單說明】 Q 圖1是顯示本發明的基板處理系統的實施的一 ‘ 概略構成圖。 ' 圖2是由上方看基板處理系統之概略構成圖。 圖3是藉由本發明的基板處理系統進行的塗佈 說明圖。 圖4是藉由本發明的基板處理系統進行的塗佈 說明圖。 圖5是藉由本發明的基板處理系統進行的塗佈 前述上 械手部 信號傳 進入開 上（圖 t銷 44 形態， 實施形 作通信 以。而 而是被 形態之 處理之 處理之 處理之 30 201015660 說明圖。 圖6是銷尖端的位置之說明圖。 圖7是銷的移動速度之說明圖。 圖8是別的實施形態的基板處理系統所執行的並行動 作之說明圖。 【主要元件符號說明】 1 :基板處理系統The parallel operation in the embodiment is performed by the above-described carry-out device 5 that performs the process of drying the substrate w, and the lower cover is moved to the base 41 for the movement of the base. Deviated from the moving robot 31. The core substrate W 棬, 2: realizes the parallel operation' and the above-described embodiment (FIG. 1) - the U control device 45 and the carry-out control device 33 are "connected by a dedicated communication line. Moreover, by using the communication line L5 performs signal processing between the dry unit 45 and the carry-out control device. The control of the cover 42 and the (four) robot arm (four) operation timing is possible. 201015660 Describes the drying process of the substrate w by the substrate processing system 51 thus constructed. The substrate w coated with the coating liquid by the coating device is carried into the base of the drying robot arm 46 by the loading device 4, and the lid 42 is lowered to the lowest position, and the substrate is dried in the drying space v. (Part 8U)). When the drying of the substrate W is completed, the lid 42 is moved to the upper rising position (target position) of the base 2, and the transfer of the substrate W to the carry-out robot arm 30 causes the pin 44 I· 41· and I Α 44 44 The substrate W is raised and raised. Cover 42! · During the lifting operation, the main control 詈 9 and S 1 set 2 will pass the h-line to make the robot 3 淮 φ 跟 in front of the drying robot arm 46 (in the two-point chain of Figure 8 = position) The preparation signal is transmitted to the drying (four) device 45. In the process of the cover 42, the dry and the Lutian μ #J drying control device 45 receives the preparation signal, and also moves the field operation signal from the red worker through the communication line L5 to move the retracted robot unit 31 to the dry place. The feed signal of the front position of the arm mechanism arm 46 is transmitted to the carry-out control target control device 33. Receiving the entry preparation control device 33, taking the opportunity to push the pre-entry preparation signal (i.e., the input signal becomes a trigger), and placing the opportunity in the livestock machine before the above-mentioned rising operation of the cover eight early preparations 42 is completed. The robotic part 31 of the position moves to the aforementioned front position. Further, the robot position in the preceding position is not in contact with the rising cover 42 as described above, so that the upper bucket of the cover 42 can be reduced. The lifting action is in parallel with the parting operation of moving the robot arm 3〇.町 平 ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 The movement stroke. Further, by the start of the movement of the cover arm 3 before the lifting operation of the cover is completed, the lifting operation of the stem 4 2 and the robot for receiving the treatment of the cover W can be performed 201015660. The time overlap can be shortened to shorten the time required to transport the substrate w. Further, when the drying control device 45 detects that the cover 42 has reached the lift position, the starter 31 that has entered the base 41 from the preceding position by the communication line L5 is sent to the carry-out control device. 33. The carry-out control device 33 causes the robot hand 31 to start entering the base 41 8 (c) based on the start signal. Further, as in the above-described embodiment, the substrate W' on the robot portion 31 can be carried out of the substrate w»φ. Further, the substrate processing system 1 of the present invention is not limited to the other embodiments within the scope of the present invention. Also. In the foregoing state, although the transmission path for transmitting the received signal between the devices is described as a line (cable), the transmission path may be configured by wireless or the main control device 2 and the coating control device 16 are not different. The device may be housed in a common casing. BRIEF DESCRIPTION OF THE DRAWINGS Q Fig. 1 is a schematic view showing a configuration of a substrate processing system of the present invention. Fig. 2 is a schematic block diagram of the substrate processing system as seen from above. Fig. 3 is a coating explanatory view of the substrate processing system of the present invention. Fig. 4 is a coating explanatory view of the substrate processing system of the present invention. Fig. 5 is a view showing the process of applying the processing of the above-mentioned upper hand signal to the opening by the substrate processing system of the present invention (the form of the pin 44 is carried out, and the processing is performed by the processing of the form. Fig. 6 is an explanatory view of the position of the pin tip. Fig. 7 is an explanatory view of the moving speed of the pin. Fig. 8 is an explanatory view of the parallel operation performed by the substrate processing system of the other embodiment. Description] 1 : Substrate processing system
2 ··主控制裝置（主控制部） 3··塗佈裝置（基板處理裝置） 4:搬進裝置（第一傳送裝置） 5:搬出裝置（第二傳送裝置） 6 a、6 b、6 c :位置檢測部 7 :超出控制部 1 0 :塗佈裝置本體 11:基台 12 :平台 1 3 :台架（動作部） 1 4 :銷（動作部） 1 5 :銷驅動機構 1 6 :塗佈用控制裝置 1 7 a ~ 1 7 d :感測器 20 :搬進機械手臂 21、31:機械手部（運送部） 3 1 201015660 22:搬進驅動機構 23:搬進用控制裝置 3 0 :搬出機械手臂 3 2 :搬出驅動機構 - 3 3 :搬出用控制裝置 \ 40 :乾燥裝置（基板處理裝置） 41 :基台 42:蓋（動作部） ^ 4 3 :蓋驅動機構 ❹ 4 4 :銷 45:乾燥用控制裝置 46:乾燥機械手臂 E :初始位置 F :作業完了位置 L卜L5 :專用通信線（傳輸路徑） W:基板2 ··Main control unit (main control unit) 3··Application unit (substrate processing unit) 4: Carrying unit (first conveyor) 5: Carry-out unit (second conveyor) 6 a, 6 b, 6 c : position detecting unit 7 : beyond control unit 10 : coating device body 11 : base 12 : platform 1 3 : gantry (operating portion) 1 4 : pin (operating portion) 1 5 : pin driving mechanism 1 6 : Coating control device 1 7 a ~ 1 7 d : Sensor 20 : Handling robot 21 , 31 : Robot (transport) 3 1 201015660 22: Loading drive mechanism 23 : Loading control device 3 0 : Carrying out the robot arm 3 2 : Carrying out the drive mechanism - 3 3 : Carrying out the control device \ 40 : Drying device (substrate processing device) 41 : Base 42 : Cover (operating part) ^ 4 3 : Cover drive mechanism ❹ 4 4 : Pin 45: Drying control device 46: Drying robot arm E: Initial position F: Position at work L L L5: Dedicated communication line (transmission path) W: Substrate
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| JP2008262962A JP2010093125A (en) | 2008-10-09 | 2008-10-09 | Substrate processing system and substrate processing method |
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| JP5551501B2 (en) * | 2010-04-21 | 2014-07-16 | キヤノンアネルバ株式会社 | Substrate processing apparatus and substrate transfer method |
| KR20120059218A (en) * | 2010-11-30 | 2012-06-08 | 주식회사 테라세미콘 | METHOD FOR LOADING A SUBSTRATE IN For Flexible Display HOLDER And SYSTEM FOR THE SAME |
| JP5609744B2 (en) * | 2011-03-31 | 2014-10-22 | 東京エレクトロン株式会社 | Substrate delivery apparatus, substrate delivery method, and substrate processing apparatus |
| KR102072200B1 (en) | 2011-04-22 | 2020-01-31 | 에이에스엠엘 네델란즈 비.브이. | Network architecture and protocol for cluster of lithography machines |
| KR101205245B1 (en) | 2012-07-25 | 2012-12-03 | 주식회사 테라세미콘 | Method for loading flexible substrate |
| JP6543014B2 (en) * | 2013-04-16 | 2019-07-10 | 川崎重工業株式会社 | Arc welding equipment |
| CN105236141B (en) * | 2015-10-13 | 2017-07-28 | 武汉华星光电技术有限公司 | Substrate transfer approach |
| JP6411426B2 (en) * | 2016-10-07 | 2018-10-24 | 本田技研工業株式会社 | Cooperative control method |
| JP7186605B2 (en) * | 2018-12-27 | 2022-12-09 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| JP7320369B2 (en) * | 2019-04-17 | 2023-08-03 | 株式会社アルバック | Substrate processing equipment |
| JP7289881B2 (en) * | 2021-08-27 | 2023-06-12 | 株式会社Ｓｃｒｅｅｎホールディングス | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
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| JPH11121581A (en) * | 1997-10-13 | 1999-04-30 | Kokusai Electric Co Ltd | Substrate-transfer mechanism |
| JP2003332191A (en) * | 2002-05-14 | 2003-11-21 | Hitachi Instruments Service Co Ltd | Semiconductor manufacturing device |
| JP4451076B2 (en) * | 2003-04-16 | 2010-04-14 | 東京エレクトロン株式会社 | Vacuum processing equipment |
| JP5031186B2 (en) * | 2004-11-01 | 2012-09-19 | 東京エレクトロン株式会社 | Substrate processing method, substrate processing system, and substrate processing program |
| JP4378301B2 (en) * | 2005-02-28 | 2009-12-02 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, and substrate processing program |
| JP4492875B2 (en) * | 2005-06-21 | 2010-06-30 | 東京エレクトロン株式会社 | Substrate processing system and substrate processing method |
| JP5091413B2 (en) * | 2006-03-08 | 2012-12-05 | 東京エレクトロン株式会社 | Substrate processing apparatus and method for controlling substrate processing apparatus |
| JP4442904B2 (en) * | 2006-07-21 | 2010-03-31 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
| JP4560022B2 (en) * | 2006-09-12 | 2010-10-13 | 東京エレクトロン株式会社 | Coating, developing device, coating and developing device control method, and storage medium |
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| JP2010093125A (en) | 2010-04-22 |
| TWI480969B (en) | 2015-04-11 |
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