CN105236141B - Substrate transfer approach - Google Patents
Substrate transfer approach Download PDFInfo
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- CN105236141B CN105236141B CN201510657612.2A CN201510657612A CN105236141B CN 105236141 B CN105236141 B CN 105236141B CN 201510657612 A CN201510657612 A CN 201510657612A CN 105236141 B CN105236141 B CN 105236141B
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- piece
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Abstract
The invention provides a kind of substrate transfer approach, by increasing the positional information of substrate (30) in link signal, positional information per plate base (30) is represented with a bit, 1 representative has piece, 0 represents without piece, during so that substrate (30) being sent into downstream board (2), the positional information that downstream board (2) receives the substrate (30) has substrate (30) to obtain on the microscope carrier that takes up (20) on which specific position, and according to this to substrate (30) distribution of material, ensure that the data of downstream board (2) distribution matches with substrate (30), avoid the abnormal problem caused by information mispairing, be conducive to the normal production run of downstream board (2), reduce the loss of factory.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of substrate transfer approach.
Background technology
With the development of Display Technique, the plane such as liquid crystal display (Liquid Crystal Display, LCD) display dress
Put because having the advantages that high image quality, power saving, fuselage is thin and has a wide range of application, and be widely used in mobile phone, TV, individual number
The various consumption electronic products such as word assistant, digital camera, notebook computer, desktop computer, as the master in display device
Stream.
Need to carry out glass substrate biography piece in liquid crystal display manufacturing process, generally utilize mechanical arm moving glass
Substrate, exact position is sent to by glass substrate.Current G6 and following small size liquid crystal display panel, in the back segment into box processing procedure
Passing piece needs once to include 1~4 sheet glass substrate.Fig. 1, Fig. 2 are respectively that mechanical arm once transmits 4 and 2 sheet glass substrates
When glass substrate position view, Fig. 1 show mechanical arm 100 two teeth fork 200 on be placed with four sheet glass substrates 1,
2nd, 3,4, when passing piece, the four sheet glass substrate 1,2,3,4 is transferred to downstream board (not shown) simultaneously;Fig. 2 shows manipulator
Two panels glass substrate 1,2 is placed with respectively on two teeth fork 200 of arm 100, and when passing piece, one of tooth fork 200 is first by it
On two panels glass substrate 1,2 be transferred to downstream board, another tooth fork 200 is by two panels glass substrate 1,2 thereon afterwards
It is transferred to downstream board.
Mechanical arm downstream will send a link signal (Link by board before glass substrate is sent into downstream board
Signal).Whether link signal is only included on mechanical arm in the prior art glass substrate (Glass Exist) and glass base
The information of plate quantity (Glass Count).In the case of having glass substrate on the fully loaded i.e. each station of mechanical arm, piece is passed
It can't go wrong.But in view of have personnel take away or other reasonses cause some stations have time piece in the case of because existing
Do not include the positional information of glass substrate in the link signal (Link Signal) of technology, will make which downstream board can not learn
There is no glass substrate on which station of a little mechanical arms, cause information mispairing for downstream processing procedure, downstream board gives glass base
Plate distribution of material makes a mistake, and influences equipment normal operation.
When downstream board can not obtain the positional information of mechanical arm top glass substrate, downstream board may be caused not have
Data is assigned with to the position distribution of material for having glass substrate, to the position without glass substrate, such glass substrate is not because having
Be allocated data and successive process can not be continued, board alarm need to manually allocate solution, add downstream board downtime, shadow
Ring production capacity;It also can result in the data of downstream board distribution and the size of glass substrate mismatched, such as by 5 cun of data mistake
3 cun of glass substrate is distributed on ground, causes waste of raw materials, there is the fragmentation even risk of device damage.
The content of the invention
It is an object of the invention to provide a kind of substrate transfer approach, the position for sending substrate by downstream board is believed
Breath, makes downstream board result in position of the substrate on mechanical arm, ensure that downstream board passes piece and distribution of material not
Generation is abnormal, is conducive to equipment normally to produce.
To achieve the above object, the invention provides a kind of substrate transfer approach, comprise the following steps:
Step 1, one upstream board of offer and downstream board, the upstream board include a mechanical arm and sensed with slice
Device;The downstream board takes up including one and microscope carrier and taken up sensor;
The mechanical arm includes two forks piece branches be arrangeding in parallel, and the forks piece branch is used to fill in piece delivery process
Carry and supporting substrate;
Step 2, on the mechanical arm carry plurality of substrates after, the mechanical arm is moved to slice sensor and touched
Piece sensor is sent, downstream board sends link signal to upstream board, and the link signal includes what is carried on mechanical arm
The positional information and data information of plurality of substrates;
Step 3, the upstream board and downstream board carry out signal friendship and held, and the downstream board receives the link letter
Number, substrate is transferred to the taking up on microscope carrier of downstream board by the upstream board by mechanical arm afterwards;
Step 4, the downstream board, which are received, triggers the sensor that takes up after substrate, downstream board is according to the substrate received
The data information of substrate is distributed to each plate base by positional information;
Step 5, downstream board carry out process operations to substrate.
Positional information per plate base is represented with a bit:1 representative has piece, and 0 represents without piece.
Optionally, the mechanical arm once transmits 4 plate bases.
The positional information represents mechanical arm full piece, a forks piece branch respectively for 1111,0111,1011,1101,1110
Front end lacks piece, a forks piece branch rear end and lacks piece, the scarce piece in another forks piece branch front end, the scarce piece in another forks piece branch rear end.
The positional information represents a forks piece branch rear end for 1010 and lacks the scarce piece of piece and another forks piece branch rear end.
Optionally, the mechanical arm once transmits 2 plate bases.
The positional information represents the full piece of mechanical arm, a forks piece branch front end for 11,01,10 and lacks piece, a forks piece respectively
Branch rear end lacks piece.
The substrate is liquid crystal display panel.
Beneficial effects of the present invention:The invention provides a kind of substrate transfer approach, by increasing base in link signal
The positional information of plate so that when substrate is sent into downstream board, downstream board receives the positional information of the substrate to obtain
Take up on microscope carrier has substrate on which specific position, and according to this to substrate distribution of material, it is ensured that the data of downstream board distribution with
Substrate matches, and is conducive to the normal production run of downstream board, reduces the loss of factory.
In order to be able to be further understood that the feature and technology contents of the present invention, refer to below in connection with the detailed of the present invention
Illustrate and accompanying drawing, however accompanying drawing only provide with reference to and explanation use, not for being any limitation as to the present invention.
Brief description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the embodiment to the present invention, technical scheme will be made
And other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 is the position view of glass substrate when mechanical arm once transmits 4 sheet glass substrate;
Fig. 2 is the position view of glass substrate when mechanical arm once transmits 2 sheet glass substrate;
Fig. 3 is the flow chart of the substrate transfer approach of the present invention;
Fig. 4 passes upstream board and downstream board before piece and shown when transmitting 3 plate base for the substrate transfer approach of the present invention
It is intended to;
Fig. 5 passes the number of upstream board and downstream board before piece when transmitting 3 plate base for the substrate transfer approach of the present invention
According to schematic diagram;
Fig. 6 passes upstream board and downstream board after piece and shown when transmitting 3 plate base for the substrate transfer approach of the present invention
It is intended to;
Fig. 7 passes the number of upstream board and downstream board after piece when transmitting 3 plate base for the substrate transfer approach of the present invention
According to schematic diagram.
Embodiment
Further to illustrate the technological means and its effect of the invention taken, below in conjunction with being preferable to carry out for the present invention
Example and its accompanying drawing are described in detail.
Referring to Fig. 3, the present invention provides a kind of substrate transfer approach, comprise the following steps:
Step 1, the upstream board 1 of offer one and downstream board 2, the upstream board 1 include a mechanical arm 10 and slice
Sensor 15;The downstream board 2 takes up including one and microscope carrier 20 and taken up sensor 25.
Specifically, the mechanical arm 10 includes two forks piece branches 11 be arrangeding in parallel, the forks piece branch 11 is used for
Loaded and supporting substrate 30 in piece delivery process.
Specifically, the substrate 30 can be liquid crystal display panel.
Step 2, on the mechanical arm 10 carry plurality of substrates 30 after, the mechanical arm 10 be moved to slice sensing
Device 15 simultaneously triggers slice sensor 25, and downstream board 2 sends link signal to upstream board 1, and the link signal includes machinery
The positional information and data information of the plurality of substrates 30 carried on arm 10.
Specifically, in the case where mechanical arm 10 once transmits 4 plate bases 30, the positional information per plate base 30 uses one
Individual bit is represented:1 indicates piece, and 0 indicates no piece, and the positional information of four substrates 30 is represented with four bits.Such as 1111,
0111st, 1011,1101,1110 represent that the full piece of mechanical arm 10, the front end of a forks piece branch 11 lack after piece, a forks piece branch 11 respectively
End lacks piece, another front end of forks piece branch 11 and lacks piece, the scarce piece in another rear end of forks piece branch 11.As shown in figure 4, being passed for mechanical arm 10
Schematic diagram when sending 3 plate base 30 before piece is passed, lacks the feelings of piece shown in Fig. 4 for the front end of a forks piece branch 11 of mechanical arm 10
Condition, as shown in figure 5, the positional information of the substrate 30 included in the link signal that now upstream board 1 is sent is 1101;Downstream machine
In the serial data of platform 2 can received bit be 1 represent downstream board 2 be ready for receive substrate 30.
The situation of two panels or the vacancy of three plate base 30 also this method can be used to represent, such as 1010 represent a forks piece branch 11
Rear end lacks piece and another rear end of forks piece branch 11 lacks piece.
Particularly, without the 0000 i.e. situation of four vacancies, because the situation of four vacancies of mechanical arm 10 pair can be direct
Skip and take out piece link.
Specifically, when the microscope carrier 20 that takes up of downstream board 2 once can only at most receive two plate bases 30, in mechanical arm
In the case that 10 once transmit 2 plate bases 30, the same positional information per plate base 30 is represented with a bit:1 indicates
Piece, 0 indicates no piece, and the positional information of two plate bases 30 is represented with 2 bits.Such as 11,01,10, the full piece of expression, one pitch respectively
The front end of piece branch 11 lacks piece, the rear end of a forks piece branch 11 and lacks piece.Particularly, without the 00 i.e. situation of two panels vacancy, because mechanical
Arm 10 can directly be skipped to the situation of two panels vacancy and take out piece link.
Step 3, the upstream board 1 carry out signal friendship with downstream board 2 and held, and the downstream board 2 receives the link
Signal, afterwards the upstream board 1 substrate 30 is transferred to by the taking up on microscope carrier 20 of downstream board 2 by mechanical arm 10.
As shown in fig. 7, handing over the schematic diagram data after holding for upstream board 1 and the signal of downstream board 2, it is illustrated in figure 6
Swim board 1 downstream board 2 pass piece after the completion of schematic diagram.
Step 4, the downstream board 2 receive triggering after substrate 30 and take up sensor 25, and downstream board 2 is according to receiving
The data information of substrate 30 is distributed to each plate base 30 by the positional information of substrate 30.
Specifically, downstream board 2 is obtained after the positional information of substrate 30, positional information mapping (Mapping) can be arrived
The relevant position taken up on microscope carrier 20.After biography piece terminates, itself software of downstream board 2 has the above-mentioned position letter of logical process
Breath, is stored in the LTM of the programmable logic controller (PLC) (Programmable Logic Controller, PLC) of downstream board 20
It is such as internal to pass piece, work data displacement available for other logic functions of downstream board 2 in Area (data logical area)
Functions such as (Job Data Shift).
Step 5, downstream board 2 carry out process operations to substrate 30.
In summary, the invention provides a kind of substrate transfer approach, by increasing the position of substrate in link signal
Information so that when substrate is sent into downstream board, downstream board receives the positional information of the substrate to obtain the microscope carrier that takes up
There is substrate on which upper specific position, and according to this to substrate distribution of material, it is ensured that the data and substrate phase of downstream board distribution
Match somebody with somebody, be conducive to the normal production run of downstream board, reduce the loss of factory.
It is described above, for the person of ordinary skill of the art, can be with technique according to the invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to the claims in the present invention
Protection domain.
Claims (8)
1. a kind of substrate transfer approach, it is characterised in that comprise the following steps:
Step 1, provide a upstream board (1) and downstream board (2), the upstream board (1) include a mechanical arm (10) with
Slice sensor (15);The downstream board (2) takes up including one and microscope carrier (20) and taken up sensor (25);
The mechanical arm (10) includes two forks piece branches (11) be arrangeding in parallel, and the forks piece branch (11) is used to pass piece
During load and supporting substrate (30);
Step 2, carry after plurality of substrates (30) on the mechanical arm (10), the mechanical arm (10) is moved to slice biography
Sensor (15) simultaneously triggers slice sensor, and downstream board (2) sends link signal, the link signal bag to upstream board (1)
Include the positional information and data information of the plurality of substrates (30) carried on mechanical arm (10);
Step 3, the upstream board (1) carry out signal friendship with downstream board (2) and held, and the downstream board (2) receives the chain
Connect signal and the positional information received is mapped to the relevant position taken up on microscope carrier (20), afterwards the upstream
The plurality of substrates (30) is transferred to the microscope carrier that takes up of the downstream board (2) by mechanical arm (10) by board (1)
(20) on;
Step 4, the downstream board (2) receive the plurality of substrates (30) and trigger take up sensor (25), the downstream machine afterwards
Platform (2) believes the data of the correspondence plurality of substrates (30) according to the positional information of the plurality of substrates (30) received
Breath distributes to each plate base (30);
Step 5, the downstream board (2) carry out process operations to the plurality of substrates (30).
2. substrate transfer approach as claimed in claim 1, it is characterised in that the positional information per plate base (30) is compared with one
Special position is represented:1 representative has piece, and 0 represents without piece.
3. substrate transfer approach as claimed in claim 2, it is characterised in that the mechanical arm (10) once transmits 4 chip bases
Plate (30).
4. substrate transfer approach as claimed in claim 3, it is characterised in that positional information 1111,0111,1011,1101,
1110 represent respectively the full piece of mechanical arm (10), forks piece branch (11) front end lack piece, forks piece branch (11) rear end lack piece, it is another
One forks piece branch (11) front end lacks piece, another forks piece branch (11) rear end and lacks piece.
5. substrate transfer approach as claimed in claim 3, it is characterised in that positional information 1010 represents a forks piece branch
(11) rear end lacks piece and another forks piece branch (11) rear end lacks piece.
6. substrate transfer approach as claimed in claim 2, it is characterised in that the mechanical arm (10) once transmits 2 chip bases
Plate (30).
7. substrate transfer approach as claimed in claim 6, it is characterised in that positional information 11,01,10 represents manipulator respectively
The full piece of arm (10), forks piece branch (11) front end lack piece, forks piece branch (11) rear end and lack piece.
8. substrate transfer approach as claimed in claim 1, it is characterised in that the substrate (30) is liquid crystal display panel.
Priority Applications (1)
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CN201510657612.2A CN105236141B (en) | 2015-10-13 | 2015-10-13 | Substrate transfer approach |
Applications Claiming Priority (1)
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CN201510657612.2A CN105236141B (en) | 2015-10-13 | 2015-10-13 | Substrate transfer approach |
Publications (2)
Publication Number | Publication Date |
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CN105236141A CN105236141A (en) | 2016-01-13 |
CN105236141B true CN105236141B (en) | 2017-07-28 |
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CN201510657612.2A Active CN105236141B (en) | 2015-10-13 | 2015-10-13 | Substrate transfer approach |
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CN114114973B (en) * | 2020-09-01 | 2024-01-23 | 京东方科技集团股份有限公司 | Display panel double-piece production control method and related equipment |
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CA2421121A1 (en) * | 2003-03-13 | 2004-09-13 | Roger Mercure | Device and method for valuing and optimizing cutout panels |
JP2010093125A (en) * | 2008-10-09 | 2010-04-22 | Toray Eng Co Ltd | Substrate processing system and substrate processing method |
CN201608196U (en) * | 2010-01-29 | 2010-10-13 | 理想能源设备(上海)有限公司 | Carrying equipment for carrying out detection on glass substrate |
KR20140147959A (en) * | 2013-06-20 | 2014-12-31 | 현대중공업 주식회사 | Apparatus and method for teaching of wafer transfer robot |
CN103434842B (en) * | 2013-09-04 | 2015-08-19 | 深圳市华星光电技术有限公司 | Mechanical arm fork and mechanical arm |
CN104425304B (en) * | 2013-09-09 | 2018-05-25 | 北京北方华创微电子装备有限公司 | Wafer position detecting device |
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