TWI480969B - Substrate processing system and substrate processing method - Google Patents

Description

Substrate processing system and substrate processing method

The present invention relates to a substrate processing system and a substrate processing method for processing a substrate.

For example, a flat panel display such as a liquid crystal display or a plasma display uses a glass substrate coated with a resist liquid (hereinafter also referred to as a glass substrate). Coating the substrate). The substrate processing system for obtaining the coated substrate includes a coating device for applying a photoresist to a glass substrate (for example, see Patent Document 1), and a transfer device for transporting a glass substrate to the coating device. The main control unit of these devices.

Each of the coating device and the transport device is connected to the main control device by a dedicated communication line, and the transport device receives the command signal transmitted by the main control device, and the transport device transports the glass substrate to the coating device. The transport device that completes the transport of the glass substrate transmits the transported signal to the main control device, and upon receiving the transmitted signal, the main control device transmits a command signal to the coating device. The coating device that receives the command signal starts the process of applying the photoresist liquid to the glass substrate, and if the coating is completed, the coated signal is transmitted to Main control unit. The main control device that receives the coated signal transmits a command signal for transporting the coated substrate to the next process to the transport device. In this way, the transport device and the coating device are configured to wait for a command signal from the main control device to operate, and the glass substrate is transported and the glass substrate is processed (application of the photoresist liquid) to be automated. Shortening of manufacturing time.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-205120

As described above, in the conventional substrate processing system, the main control device transmits a command signal to the transport device and the coating device, and the timing of the start of transport of the glass substrate and/or the coating of the photoresist liquid by the command signal is used. The timing at which the cloth starts is controlled. However, in this case, due to the generation of the scan time in the main control device, or the communication time between the main control device and the transport device and the coating device, the precise connection transport device and the coating are required. Control of the timing of the operation of the device is difficult. Therefore, in the conventional system, after the glass substrate is carried into the coating device, the coating operation of the photoresist liquid is completed, and the time until the application of the coated substrate is shortened is also limited.

Accordingly, an object of the present invention is to provide a substrate processing system and a substrate processing method which are easy to control the timing of the operation of the substrate processing apparatus and the transport apparatus, and further shorten the time.

A substrate processing system according to the present invention for solving the above-described problems includes: a substrate processing apparatus having an operation unit that operates to process a substrate; and a transport that moves the substrate to move away from the substrate processing apparatus The main transport unit that issues a command signal to the substrate processing apparatus and the transport apparatus includes the substrate processing apparatus and the transport apparatus, and the method includes: performing between the substrate processing apparatus and the transport apparatus a transmission path for transmitting and receiving a signal; the movement of the transport unit is started before the operation of the operation unit is completed by a signal transmitted between the substrate processing device and the transport device through the transmission path a control unit that moves the operation of the operation unit in parallel with the movement of the transport unit, wherein the operation unit is movable to a target position that does not interfere with the transport unit that is close to the delivery of the substrate, and that the movement direction exceeds the aforementioned The target position is disposed in an overrun position that does not interfere with the transport unit, and the substrate processing apparatus has the operation unit decelerated by the target position in the moving direction and before the excess position Activating the aforementioned action portion from the aforementioned excess position to the aforementioned target position The control is beyond the control.

In the substrate processing method performed by the substrate processing system, a transport device that moves toward the substrate processing device for transporting the substrate transport unit is used, and the operation unit of the substrate processing device is operated for the processing of the substrate. According to the signal transmitted through the transmission path between the substrate processing apparatus and the transport apparatus, the movement of the transport unit is started before the operation of the operation unit is completed, and the operation of the operation unit and the transport are performed. In parallel, the movement portion is movable to a target position that does not interfere with the transport portion that is close to the delivery of the substrate, and that the movement direction exceeds the target position and does not interfere with the transport portion. The substrate processing apparatus is configured such that the operation unit passes the target position in the moving direction and decelerates the operation unit before the excess position, and the operation unit is folded back from the excess position. The position is controlled beyond the control.

According to the substrate processing system and the substrate processing method described above, since the signals are transmitted and received through the transmission path between the substrate processing device and the transport device, the operation timing of the substrate processing device and the operation timing of the transport portion of the transport device are linked. Control is easy. Further, the control of the connection is performed by the signal transmitted between the substrate processing apparatus and the transport apparatus based on the transmission path, and the movement of the transport unit is started before the operation of the operation unit is completed, and the operation unit is operated. By controlling the movement in parallel with the movement of the transport unit, it is possible to overlap the movement of the operation unit and the movement time of the transport unit, and it is possible to shorten the time.

In this case, since the control unit causes the operation unit to pass the target position in the moving direction and decelerates the operation unit before the position exceeds the position, the operation unit can quickly exceed the target position.

On the other hand, when the operation unit is not moved to the position beyond, but the target unit is directly reached, the configuration of the general machine that moves the operation unit is required to slow down the operation unit before the target position. After that, the target position is stopped, so it takes time to move the operation unit to the target position.

However, according to the above-described excess control unit, since the operation unit quickly exceeds the target position, the operation unit and the transport unit do not interfere with each other at an early timing. Therefore, the transport unit can be started at an early timing in order to deliver the substrate. Near the substrate processing apparatus, further time reduction is possible. Further, the excess control unit causes the operating unit to be folded back to the target position from the over position, so that the operating unit can reach the target position and can be prepared for the next operation.

Further, when the substrate processing apparatus includes the above-described excess control unit, the control unit starts the movement of the transport unit before the operation of the operation unit is folded back and reaches the target position, and the movement of the operation unit is performed. The movement of the transport unit is preferably parallel.

In this case, the movement of the transport unit is started before the operation of the control unit is folded back and reaches the target position, and the movement of the operation unit to the target position can be overlapped with the movement of the transport unit for delivery of the substrate. As a result, the effect of shortening the time that is exceeded by the control unit is multiplied to the effect of shortening the time due to the control in parallel with the movement of the operating unit and the movement of the transport unit.

Further, when the substrate processing apparatus includes the above-described excess control unit, the speed control is performed, and the operation unit may reach the maximum moving speed after passing through the target position, but the excess control unit performs speed control. It is preferable that the action portion passes the aforementioned target position after reaching the maximum moving speed.

In this case, the operating portion can quickly overtake the target position, and the transport portion can be brought closer to the substrate processing device at an earlier timing.

According to the present invention, the time is shortened to be possible by overlapping the operation of the operation unit of the substrate processing apparatus with the movement time of the transport unit of the transport apparatus. Therefore, the transportation time of the substrate can be shortened, and the production efficiency (processing efficiency) of the substrate can be improved.

Hereinafter, embodiments of the present invention will be described based on the drawings.

[Entire Configuration of Substrate Processing System 1]

Fig. 1 is a schematic block diagram showing an embodiment of an embodiment of a substrate processing system 1 of the present invention. The substrate processing system 1 is a device that applies a liquid material (hereinafter referred to as a coating liquid) such as a chemical liquid or a photoresist liquid to a substrate (glass substrate) W, and can manufacture a coated substrate, and includes a main control device 2. The coating device 3 as a substrate processing apparatus, the loading device 4 as a transport device, and the carry-out device 5. The main control device 2 is composed of a programmable logic controller (PLC: Programmable Logic Controller) that integrates the coating device 3, the loading device 4, and the unloading device 5. The coating device 3, the loading device 4, and the loading device 5 can be The command signal from the main control device 2 operates.

The coating device 3 includes a coating device main body 10 that operates to apply a coating liquid onto the substrate W, and a coating control device 16 that controls the operation of the coating device main body 10. The loading device 4 includes a loading robot 20 that moves the substrate W into the coating device body 10 from a region outside the drawing, and moves the coating device body 10 away from the moving device 10; and controls the loading robot 20 The operation of the movement control device 23. The unloading device 5 has a loading/unloading robot 30 that moves the substrate W out of the region outside the drawing by the coating device main body 10, and moves the dispensing device body 10 away from the moving device arm 10; Device 33. Move into the robot arm 20 and move out The robot arm 30 is disposed to sandwich the coating device body 10.

The coating control device 16, the loading control device 23, and the carry-out control device 33 are connected to the main control device 2 via dedicated communication lines (L1, L2, and L3), and are communicable therebetween. Further, in the substrate processing system 1, the coating control device 16 and the loading control device 23 are connected by the dedicated communication line L4, and the communication control unit 16 and the loading control device 16 are used for loading. Transmission and reception of signals (various operation signals to be described later) are performed between the control devices 23. Further, the application control device 16 and the carry-out control device 33 are connected by the dedicated communication line L5, and a signal is transmitted between the application control device 16 and the carry-out control device 33 via the communication line L5 (described later). Transmission and reception of various motion signals). Specific examples of the communication line include a CC-Link (registered trademark) communication cable (cable), an Ethernet (registered trademark) communication cable, and a digital input/output cable.

[Coating device 3]

The coating apparatus main body 10 has a base 11 , a stage 12 in which a substrate W is placed in the center of the base 11 , and a gantry 13 that is horizontally moved on the stage 12 . The gantry 13 has a slit nozzle part (not shown) that discharges the coating liquid, and is movable in a direction orthogonal to the transport direction of the substrate W (the horizontal direction in FIG. 1). The coating liquid is applied to the substrate W by being placed on the substrate W placed on the top surface of the stage 12 by the stage 13.

A plurality of suction holes are formed in the top surface of the platform 12, and a suction pump (not shown) is connected to the suction holes. If the suction pump operates in a state where the substrate W is placed on the top surface of the stage 12, the substrate W is adsorbed to the stage. The top surface of 12. Further, a plurality of pin holes penetrating in the vertical direction are formed in the stage 12, and a pin (lift pin) 14 as an operation portion movable in the vertical direction is disposed in the pin hole. The plurality of root pins 14 are arranged in a lattice shape in plan view. A pin drive mechanism 15 for moving the plurality of pins 14 up and down is disposed on the base 11. The pin drive mechanism 15 can be constituted by, for example, an electric actuator, and its configuration can be known in the art.

The pin 14 in the initial position is the height at which the tip end is below the top surface of the platform 12. If the plurality of pins 14 are simultaneously raised by the pin driving mechanism 15 in a state where the substrate W is placed on the stage 12, the tip end of the pin 14 pushes up the substrate W, and the substrate W can be moved to a predetermined height. The substrate W is held by the pin 14 at a predetermined height position (state of Fig. 1).

The movement of the gantry 13, the discharge of the coating liquid in the gantry 13, the adsorption of the substrate W by the suction pump, and the operation of the pin driving mechanism 14 are controlled by the coating control device 16.

[Loading device 4 and carrying device 5]

The loading robot 20 has a robot hand (transporting portion) 21 that carries the substrate W to which the coating liquid is applied, and moves the robot hand 21 to face the coating device body 10 in the direction of deviation (horizontal direction) and The drive mechanism 22 is moved in the vertical direction, and has a function of transmitting the substrate W to the top surface of the raised pin 14. Therefore, the robot portion 21 can be moved to a predetermined position above the stage 12 by a position that does not interfere with the stage 13, and does not interfere with the pin 14 that has been arranged in a lattice shape to form a comb shape. The movement of the loading drive mechanism 22 that moves the robot hand 21 is controlled by the loading control device 23 system.

The unloading robot arm 30 has a robot hand (transporting portion) 31 that carries the coated substrate W that has been coated with the coating liquid, and moves the robot hand portion 31 in a direction away from the coating device body 10 (horizontal direction) and in the up and down direction. The drive mechanism 32 is carried out and has a function of receiving the substrate W by the pin 14 that rises and carries the substrate W. Therefore, the robot portion 31 can be moved to a predetermined position above the stage 12 by a position that does not interfere with the stage 13, and does not interfere with the pin 14 that has been arranged in a lattice shape to form a comb shape. The operation of the carry-out drive mechanism 32 that moves the robot hand 31 is controlled by the carry-out control device 33.

Further, the carry-in drive mechanism 22 and the carry-out drive mechanism 32 may be constituted by an electric actuator, and the configuration thereof may be conventionally known.

[About each control device]

The coating control device 16, the loading control device 23, and the carry-out control device 33 are constituted by a computer having a CPU and a storage unit (RAM and ROM). The program for controlling the functions to perform the predetermined functions is stored in the memory unit, and the application control device 16, the carry-in control device 23, and the carry-out control device 33 are each provided with a position detecting unit as a functional unit that is executed by the program. 6a, 6b, 6c). Further, the coating control device 16 is a functional portion that is executed by the above-described program, and has a lifting operation of the control pin 14, that is, the operation of the pin driving mechanism 15 is beyond the control portion 7. The function of the excess control unit 7 will be described later.

The position detecting unit 6a of the coating control device 16 has a function of detecting the height position of the (tip of) the pin 14 and a function of detecting the position of the gantry 13. The position detecting unit 6b of the loading control device 23 has a detecting robot The function of the position of the platform 12 with respect to the position of the platform 12, the position detecting unit 6c of the carry-out control device 33 has a function of detecting the position of the robot hand 31 with respect to the platform 12. The position detection of the pin 14 by the position detecting unit 6a can be performed in accordance with the amount of movement of the pin driving mechanism 15, and can be, for example, an encoder that is connected to a motor or the like that raises and lowers the pin 14 by the pin driving mechanism 15. Perform position detection. Moreover, other position detection can also be realized by the same configuration. Further, the robot hand 21, 31 may be position-detected by a separately provided non-contact type sensor (for example, the sensors 17a to 17d of FIG. 3).

This will be described with respect to the sensors 17a to 17d. The sensors 17a-17d function as interlocks. Signals of the detection results of the sensors 17a to 17d are input to the coating control device 16. The sensor 17a is for preventing the robot hand 31 from coming into contact with the gantry 13, and the sensor 17d is for preventing the robot hand 21 from coming into contact with the gantry 13. In other words, the robot hand 31 and the robot hand 21 are located on the side of the platform 12 instead of the front position, which will be described later, and the sensors 17a and 17d are turned ON, and the state of the robot parts 31 and 21 is detected. The coating control device 16 stops (disables) the movement of the gantry 13.

Further, the sensor 17b is for preventing the robot hand 31 from coming into contact with the substrate W on the pin 14, and the sensor 17c is for preventing the robot hand 21 from coming into contact with the substrate W on the pin 14. Accordingly, it can be confirmed that the robot portions 31 and 21 are retracted from the platform 12. In other words, when the robot portions 31 and 21 are positioned on the stage 12, the sensors 17b and 17c are turned ON and the state of the robot portions 31 and 21 is detected, and the coating control device 16 causes the pin 14 to be turned. Move Stop (prohibited).

[Operation of Application of Coating Liquid to Substrate W]

The treatment of applying the coating liquid by the substrate processing system 1 configured as above to the substrate W will be described. FIG. 2 is a schematic configuration view of the substrate processing system 1 as seen from above. 3, 4, and 5 are explanatory views for explaining the coating process.

(1. Coating procedure of coating solution)

In FIG. 2, the gantry 13 performs an operation of applying the coating liquid to the substrate W, moving from the initial position E to the work-finished position F at which the coating operation is completed, and returning to the initial position E from the work-completed position F. That is, the gantry 13 performs a reciprocating motion that starts from the initial position E and returns to the initial position E after reaching the work position F. This reciprocating motion is controlled by the coating control device 16. The initial position E is the position of one end portion of the base 11, and even if the robot portions 21, 31 enter the platform 12, the robot portions 21, 31 do not interfere with the gantry 13. Conversely, if the robot hands 21, 31 enter the platform 12 during the movement of the gantry 13, the two will collide. The position F at the end of the work is the position of the other end of the base 11. Each position of the gantry 13 is detected by the position detecting unit 6a (see FIG. 1) of the coating control device 16.

In FIG. 1, when the main control device 2 transmits a start signal for starting the coating operation of the coating liquid as a command signal to the coating control device 16 via the communication line L1, the sensors 17a and 17d are The OFF state (the state in which the grippers 31 and 21 are not detected) is confirmed, and the gantry 13 reciprocates on the base 11 by the control of the coating control device 16, and the coating liquid is applied to the platform therebetween. Substrate W on 12. When the coating liquid is applied, the substrate W is Adsorbed on the platform 12.

When the gantry 13 performs the above-described reciprocating operation, the main control device 2 transmits the transport possibility signal of the loading and unloading operation of the permissible substrate W as the command signal to the carry-in control device in advance via the communication lines L2 and L3. 23 and the carry-out control device 33. As a result, the loading control device 23 and the carry-out control device 33 wait for the robot hand 21, 31 located at the evacuation position to start entering the signal on the platform 12 side.

In the reciprocating operation, the main control device 2 transmits a preparation signal for moving the robot parts 21 and 31 located at the retracted position to a position to be described later to the coating control device 16 via the communication line L1. The coating control device 16 can emit a signal for causing the robot hands 21, 31 to start moving in the preceding position by receiving the aforementioned preparation signal.

Then, the coating control device 16 that has received the preparation signal transmits an entry preparation signal as an operation signal to the carry-out control device 33 via the communication line L5 at a predetermined timing in the reciprocating operation. Upon receiving the entry preparation signal, the carry-out control device 33 immediately moves the robot hand 31 located at the standby position to the front position of the base 11 (the position indicated by the two-dot chain line of FIG. 2). Here, the front position of the robot hand 31 is a position that is the shortest distance to the platform 12 on the track of the robot hand 31, and does not interfere with the gantry 13 and is the position closest to the gantry 13. The robot portion 31 located at the front position is present outside the trajectory of the gantry 13 (on the side opposite to the platform 12).

The movement of the robot hand 31 is in the aforementioned reciprocating motion of the gantry 13. get on. Further, the robot portion 31 located at the front position does not interfere with the moving gantry 13 (refer to Fig. 3 (a)). That is, the robot hand 31 can be prevented from interfering with the gantry 13 by the sensor 17a. Specifically, the robot unit 31 is driven and controlled by being positioned at the front position by the position detecting unit 6c of the carry-out control device 33. Assuming that the robot hand 31 is not at the front position but on the side of the platform 12, the movement of the gantry 13 is stopped by the sensor 17a being turned ON. According to this, the robot hand 31 can be prevented from colliding with the gantry 13 in advance.

When the robot hand 31 finishes moving to the front position, the carry-out control device 33 transmits a signal for completion of the entry as an operation signal to the coating control device 16 via the communication line L5.

In this manner, the carry-out control device 33 that receives the entry preparation signal triggers the entry preparation signal (that is, the entry preparation signal becomes a trigger), and starts the machine at the standby position before the reciprocation of the gantry 13 is completed. The hand 31 is moved to the front position, and the reciprocating motion of the gantry 13 is partially parallel to the preparation preparation operation of the robot hand 31. Moreover, the robot hand 31 reaches the preceding position during the reciprocating motion. As described above, by moving the robot hand 31 to the front position in advance, the stroke of the robot hand 31 from the standby position to the position on the stage 12 can be shortened in advance. Further, by starting the preparation preparation operation of the robot hand 31 before the reciprocation of the gantry 13 is completed, the reciprocating operation of the tying 13 for processing the coating liquid on the substrate W and the receiving substrate W can be used. The movement time of the robot hand 31 overlaps, and the time required to receive the substrate W can be shortened.

As described above, one of the parallel operations executable by the substrate processing system 1 of the present invention is a parallel operation between the following components: The gantry 13 is an operation unit that operates as a coating process for applying a coating liquid to the substrate W. The unloading device 5 is provided to carry out the substrate W and move the robot close to the coating device body 10 30 (manipulator part 31). The application control device 16 and the carry-out control device 33 are connected via the dedicated communication line L5, and the signal is directly transmitted and received between the application control device 16 and the carry-out control device 33 via the communication line L5. The frame 13 is closely connected to the operation timing of the carry-out robot arm 30, and it is possible to perform the control of the parallel operation described above.

(2, move out the program)

The unloading procedure of the substrate W coated with the coating liquid by the platform 12 will be described.

When the coating control device 16 detects that the gantry 13 has returned to the initial position E (see FIG. 2), the coating control unit 16 detects that the sensor 17a is turned off, and then starts to move out. program. Upon return of the gantry 13 to the initial position E, the coating control device 16 controls the pin drive mechanism 15 to raise the pin 14 as shown in Fig. 3(b). According to this, the state in which the substrate W is carried away from the tip end of the pin 14 is caused.

Here, when the pin 14 is raised, the coating control device 16 confirms that the sensor 17b is turned off. Assuming that the robot hand 31 is positioned on the side of the platform 12 beyond the preceding position, the rise of the pin 14 is stopped by the sensor 17b being turned ON. In other words, in a state where the robot hand 31 is not in the front position but on the side of the platform 12 and the pin 14 is driven and the substrate W is raised, the robot hand 31 interferes with the substrate W, and the substrate W is damaged. . Therefore, the substrate W can be avoided by confirming that the sensor 17b is turned off when the pin 14 is raised. damage.

The pin 14 is disposed such that its tip can be moved to the upper target position above the platform 12, and the upper target position of the upper target position is exceeded. In order to transfer the substrate W to the robot portion 31, the latter will be described later. Exceeding the action is performed. Further, the upper target position is a position at which the robot hand 31 (the robot hand 21) can enter the platform 12, and the substrate W is disposed at a position above the robot hand 31, and is carried by the tip end of the pin 14. The substrate W does not interfere with the delivery of the substrate W and approaches the robot hand 31 on the stage 12 in the horizontal direction. Further, the upper excess position is a position higher than the upper target position, and even if the tip end of the pin 14 is in the upper out position, the substrate W on the tip does not interfere with the robot portion 31.

The above-mentioned [upper-out operation] is an operation performed by the above-described control unit 16 of the coating control device 16 to control the pin drive mechanism 15, and is shown by FIG. 6 (illustration of the position of the tip end of the pin 14). The pin 14 of the initial position (the tip is below the top surface of the platform 12) is raised so that the tip end of the pin 14 passes upwardly through the upper target position, and after reaching the upper excess position, the pin 14 is lowered, so that the tip end of the pin 14 is exceeded The action of folding back and bringing it to the upper target position.

Since the coating control device 16 (position detecting portion 6a) can obtain information on the height position of the (tip of) the pin 14, it is possible to detect that the tip end of the pin 14 reaches the upper target position. Therefore, when the position detecting unit 6a detects that the tip end of the pin 14 located at the initial position becomes the upper target position or more in the above-described overrun operation, the coating control device 16 transmits the communication line L5 (see FIG. 1) as an action signal. So that the robot hand 31 starts to enter the flat from the aforementioned front position The entry start signal on the stage 12 is transmitted to the carry-out control device 33.

The carry-out control device 33 that receives the entry start signal takes the entry start signal as a trigger (that is, the entry start signal becomes a trigger), and causes the robot hand 31 to start entering the stage 12 before the overrun operation is completed, so that the pin 14 can be placed thereon. The excess action is in parallel with a portion of the action on the entry platform 12 of the robot 31 (including the parallel action of the first overrun action). Moreover, as shown in FIG. 3(c), on the way of the robot hand 31 entering the platform 12, the tip end of the pin 14 is returned from the upper out position to the upper target position and reaches the upper target position. As described above, by the start of the entry of the robot hand 31 before the completion of the operation of the pin 14, the operation of transferring the substrate W can cause the tip end of the pin 14 to reach the upper target position and the robot for carrying out the substrate W. The movement of the portions 31 is temporally overlapped, and the time for delivering and transporting the substrate W can be shortened.

Further, the moving speed of the pin 14 in the case where the above-described upper limit operation is performed will be described with reference to FIG. The pin 14 stopped at the initial position is accelerated until the speed starts to rise to a predetermined value (maximum moving speed) (time t1), and the predetermined value becomes the constant speed. Further, in the mechanical configuration of the pin drive mechanism 15 for raising and lowering the pin 14 at a high speed, in order to stop the pin 14 at a predetermined position, it is necessary to decelerate the position of the pin 14 before it is stopped. Therefore, in the present invention, the pin 14 is decelerated (time t2 to t3) when the tip end of the pin 14 reaches the upper end position by the control of the excess control unit 7. Thus, since the pin 14 is decelerated before the tip end of the pin 14 reaches the upper end position, the tip end of the pin 14 in the initial position can quickly overtake the upper target position.

Further, the comparison is, for example, indicated by the broken line of FIG. 7, in the case where the tip end of the pin is not moved to the upper end position but directly reaches the upper target position. Next, the pin needs to be decelerated until the tip of the pin reaches the upper target position and stops at the upper target position (set the speed to zero). Therefore, in the case of the comparative example, the time until the tip end of the pin first reaches the upper target position is only a slow time Δt as compared with the embodiment.

According to the embodiment, by the tip end of the pin 14 reaching the upper target position early, the state in which the substrate W on the tip end of the pin 14 does not interfere with the robot hand 31 can be obtained at an early timing. Therefore, the robot hand 31 can be brought close to the stage 12 at an early timing for the delivery of the substrate W, and the time required for transporting the substrate W can be shortened. Further, by folding the pin 14 back from the upper position to the upper target position, the pin 14 can be brought to the upper target position (time t4), and it can be prepared for the subsequent delivery operation of the substrate W.

Further, since the speed control is performed beyond the control portion 7, the dowel 14 passes the upper target position after reaching the maximum moving speed, so that the tip end of the pin 14 can more quickly exceed the upper target position, and the robot hand 31 can be made at an earlier timing. Start approaching platform 12. Further, the control unit 7 is extended beyond the constant speed (maximum moving speed) section of FIG. 7 (that is, the slowdown start is started), and the pin 14 may be passed through the upper target position at the maximum moving speed. The excess control unit 7 has a function of adjusting (changing) the speed and the acceleration/deceleration of the pin 14 .

As shown in Fig. 3 (d), when the robot hand 31 moves in the horizontal direction toward the stage 12 and reaches the position below the substrate W on the pin 14, the position detecting unit 6c of the carry-out control device 33 (see Fig. 1) When the arrival of the robot 31 is raised by the carry-out driving device 32, the carry-out control device 33 transmits a pin lowering start signal as an operation signal to the coating control device 16 via the communication line L5. Coating control device 16 The pin lowering start signal is received, and the lowering of the pin 14 at the upper target position is started (times t5 in Fig. 6 and Fig. 7). That is, the rise of the robot hand 31 and the lowering of the pin 14 are performed in parallel, and the top surface of the robot hand 31 is moved beyond the tip end of the pin 14 and displaced to the upper side, so that the substrate W on the pin 14 is transferred to the robot hand. 31. By lowering the pin 14 together with the rise of the robot hand 31, the rising distance of the robot hand 31 required for the delivery of the substrate W can be reduced. Then, the robot unit 31 located at the front position starts to move between the receiving substrate W, and the carry-out control device 33 transmits an in-operation operation signal as an operation signal to the coating control device 16 via the communication line L5.

Further, after the pin 14 located at the upper target position at time t5 starts to descend in FIGS. 6 and 7, the deceleration starts at time t6, and then the delivery of the substrate W is actually performed. That is, when the delivery of the substrate W is performed, the falling speed of the pin 14 is made low. This is to weaken the collision given to the substrate W at the time of delivery of the substrate W. When the delivery is completed (time t7), the lowered pin 14 is accelerated, the falling speed is switched to a high speed, and the lower target position (time t8) is exceeded and decelerated to reach the lower excess position (time t9), and then The moving direction of the pin 14 is reversed toward the rising direction to reach the lower target position (time t10). Thus, by lowering the pin 14 having the tip end located at the upper target position, the tip end of the pin 14 is passed downward to pass the lower target position and reaches the lower excess position, the pin 14 is raised, and the tip end of the pin 14 is made to pass downward. The position is folded back and causes it to reach the lower target position. The following description is given for the lower target position and the lower position.

A sensor (not shown) for detecting the presence or absence of the substrate W is disposed in the robot hand 31 that carries out the robot arm 30, and the carry-out control device 33 can detect the machine. The presence or absence of the substrate W on the hand 31.

The substrate W on the pin 14 is conveyed to the robot hand 31, and the carry-out control device 33 transmits a substrate received signal as an operation signal to the coating control device 16 via the communication line L5. The carry-out control device 33 can detect that the substrate W is carried on the robot hand 31 by the sensor, and outputs the signal that the substrate has been received.

When it is described in FIG. 3(b), the coating control device 16 causes the robot to be moved into the robot arm 20, which is the operation signal, and is located at the retracted position, through the communication line L4 during the above-described overrun of the pin 14. The entry preparation signal of the portion 21 moving to the front position of the platform 12 is transmitted to the carry-in control device 23. Thereby, the loading control device 23 moves the robot hand 21 located at the standby position to the front position of the platform 12. According to this, the movement stroke of the robot hand 21 from the standby position to the position on the stage 12 is shortened in advance.

The [front position] of the robot hand 21 that is moved into the robot arm 20 is a position in front of the platform 12, and the robot hand portion 31 of the carry-out robot arm 30 that is located at the front position of the base 11 is the front position. different. In other words, as described above, the [front position] of the robot hand 31 that is carried out of the robot arm 30 is required to avoid contact between the gantry 13 and the robot hand 31 when the gantry 13 after the application operation is moved to the initial position E. It is set to a position other than the movement path of the gantry 13. However, since the robot hand 21 that has been moved into the robot arm 20 moves to the initial position E (see FIG. 2) after the gantry 13 has finished moving, it moves in the state of the initial position E, and thus is not affected by the movement of the gantry 13. Therefore, even in the moving path of the gantry 13 is the position in front of the platform 12. The [closest position] is set to the [front position] of the robot hand 21.

In the front position of the robot hand 21, the robot hand 21 does not interfere with the substrate W. Specifically, the position detecting unit 6b of the loading control device 23 causes the robot hand 21 to be driven and controlled by the retracted position at the preceding position. It is assumed that the action of the pin 14 is locked by the sensor 17c being turned on by the side of the platform 12 being closer to the front position. According to this, the robot hand 21 can be prevented from colliding with the substrate W in advance.

Then, as shown in FIG. 4(e), the substrate W is received by the robot portion 31, and the coating control device 16 receives the substrate receiving signal, and the tip end of the detecting pin 14 reaches the lower target position (FIG. 6 and FIG. 7). At time t8), the retraction start signal (trigger of the start of retraction) for causing the robot hand 31 to be retracted from the stage 12 to the standby position side as the operation signal is transmitted to the carry-out control device 33 as the operation signal. . The carry-out control device 33 that receives the retraction start signal retracts the robot hand 31 by the carry-out drive mechanism 32 (see FIG. 4(f)).

The coating control device 16 transmits an operation start signal to the operation of the robot hand 21 from the front position of the platform 12 to the platform 12 via the communication line L4 via the communication line L4. The trigger is transmitted to the loading control device 23. The loading control device 23 that receives the entry start signal causes the robot hand 21 that carries the next substrate W to enter the platform 12 by the loading drive mechanism 22 (see FIG. 4(f)).

Accordingly, the retracting operation of the robot hand 31 and the movement of the robot hand 21 into the platform 12 to move the next substrate W into the coating device body 10 are performed. The work is done in parallel.

When the robot unit 31 returns to the standby position, the carry-out control device 33 transmits a signal for the retracting operation as the operation signal to the coating control device 16 via the communication line L5. When the robot unit 31 passes beyond the preceding position and retreats to the standby position (Fig. 4(g)), the carry-out control device 33 transmits a signal indicating that the operation signal is retracted to the coating control device 16 via the communication line L5. Further, the main control device 2 can perform a state of controlling the command signal for starting the operation of the robot 30. When the carry-out control device 33 detects that the substrate W is present on the robot unit 31 by the sensor (not shown), the substrate signal is transmitted to the coating control device 16 via the communication line L5. The substrate registration signal is transmitted to the main control device 2 via the communication line L3, and the main control device 2 updates the POS data of the substrate W to which the coating liquid is applied. Further, the substrate W carried out by the stage 12 is advanced to a drying process by a drying device (VCD) of the next process.

(3, moving into the program)

A loading procedure for moving the next substrate W to which the coating liquid is applied into the stage 12 will be described.

When the tip end of the pin 14 first reaches the lower target position (time t8 in FIGS. 6 and 7) and becomes below the lower target position, the coating control device 16 transmits the robot arm portion as described above. 31 is a back-off start signal that is retracted from the platform 12 to the operation on the standby position side, and the coating control device 16 transmits the robot hand 21 from the front position as an operation signal via the communication line L4 (see FIG. 1). Entry on platform 12 The start signal is transmitted to the carry-in control device 23. Upon receiving the aforementioned entry start signal, the loading control device 23 moves the robot portion 21 located at the front position to the stage 12 as shown in Fig. 4(f).

As shown in FIG. 4(f), the lower target position is a position at which the robot hand 21 carrying the substrate W can enter the platform 12, and the tip end of the pin 14 is present below the substrate W on the robot portion 31. The robot hand 21 is moved into a position where the substrate W on the stage 12 does not interfere with the tip end of the pin 14. Further, the lower end position is set below the lower target position, and even if the lower position is exceeded, the substrate W on the robot hand 31 does not interfere with the tip end of the pin 14.

As described above, the carry-in control device 23 that receives the entry start signal triggers the entry start signal (that is, the entry start signal becomes a trigger), and starts the entry of the robot hand 21 onto the stage 12 before the above-described overrun operation is completed. Accordingly, in order to carry out the processing of the substrate W, the downward movement of the pin 14 can be parallel with the operation of the robot hand 21 on the entry platform 12 (including the parallel operation of the second overrun operation). Moreover, on the way that the robot hand 21 enters the platform 12, the tip end of the pin 14 returns from the lower over position to the lower target position and reaches the lower target position. Further, the lower overrunning operation is performed by the above-described excess control unit 7 of the coating control device 16 controlling the pin driving mechanism 15.

Thus, by starting the entry of the robot hand 21 before the lowering of the pin 14 is completed, the action of the delivery of the substrate W can be made to bring the tip end of the pin 14 to the lower target position, and the next substrate W can be transferred. The movement time of the robot hand 21 for the processing of the pin 14 is overlapped, and the time required for transporting the substrate W can be shortened. Moreover, as shown in Figure 7, by making the pin 14 in the lower The front end of the position (time t8~t9) is decelerated, and the tip end of the pin 14 can quickly exceed the lower target position. Therefore, the state in which the substrate W on the robot hand 21 and the tip end of the pin 14 do not interfere with each other can be obtained at an early timing. Therefore, the robot hand 21 can be approached to the stage 12 at an early timing, and the transport of the substrate W can be shortened. time.

When the robot hand 21 moves in the horizontal direction and reaches the upper position of the tip end of the pin 14 as shown in Fig. 4(g), the loading control device 23 transmits a pin rising start signal as an operation signal via the communication line L4. It is sent to the coating control device 16. At this time, when the sensor 17b is turned OFF, the robot hand 31 is not confirmed on the stage 12. That is, the interference of the robot portion 31 with the substrate W is prevented. Further, the coating control device 16 that receives the pin rise start signal raises the pin 14, the tip end of the pin 14 passes over the top surface of the robot hand portion 21 and is displaced to the upper side, and the substrate W on the robot hand portion 21 is transferred to the pin. 14 (refer to Figure 4 (h)). Further, during the rise of the pin 14, the same operation as the above-described overrun operation is performed by the control unit 7.

When the tip end of the pin 14 that has detected the rise in the upper movement operation is equal to or higher than the upper target position, the coating control device 16 retracts the robot hand 21 from the platform 12 to the evacuation via the communication line L4 as an operation signal. The back-off start signal on the position side is transmitted to the carry-in control device 23. The carry-in control device 23 that receives the back-off start signal is triggered by the back-off start signal (that is, the back-off start signal is a trigger), and the robot 12 is retracted from the platform 12 before the above-described overrun operation is completed. Accordingly, the upward movement of the pin 14 can be made in parallel with a part of the operation of the robot 21 that is retracted from the platform 12 (including the parallel operation of the third excess operation). And, as shown 5(i) shows that on the way of the robot hand 21 retreating from the platform 12, the tip end of the pin 14 returns from the upper out position to the upper target position and reaches the upper target position.

By starting the retraction of the robot hand 21 before the operation of the pin 14 is completed, the operation of loading the substrate W can cause the tip end of the pin 14 to reach the upper target position, and after the substrate W is loaded. The movement time of the robot hand 21 overlaps, and the time required for the conveyance of the substrate W can be shortened. Moreover, in the above-described over-excession action, the tip end of the pin 14 can quickly overtake the upper target position by decelerating the tip end of the pin 14 above the position, and the robot hand 21 can be placed on the platform 12 at an early timing. By retreating, the time required to transport the substrate W can be shortened.

Then, the robot hand 21 moves to the stage 12, and the substrate W is transferred between the pins 14. The carry-in control device 23 transmits a signal indicating the operation of the operation signal to the coating control device via the communication line L4. 16. When the substrate W on the robot unit 21 is transmitted to the pin 14, the carry-in control device 23 transmits a signal indicating that the substrate is an operation signal to the coating control device 16 via the communication line L4.

Then, as shown in FIG. 5(j), the loading control device 23 retracts the robot hand 21 to the standby position side. When the robot unit 21 returns to the standby position, the loading control device 23 transmits a signal for the retracting operation as the operation signal to the coating control device 16 via the communication line L4. When the robot unit 21 is in a state of being over the forward position and retracted to the standby position, the loading control device 23 transmits a signal indicating that the operation signal is retracted to the coating control device 16 via the communication line L4.

As soon as the coating control device 16 receives the retraction signal, as shown in FIG. 5(k), the pin 14 of the carrier substrate W is lowered to assume that the substrate W has been placed on the stage 12. At this time, it is confirmed that the sensor 17c is OFF, and interference between the robot hand 21 and the substrate W is avoided. Further, the substrate W is adsorbed to the stage 12 to start the aforementioned coating process. When the robot hand 21 reaches the standby position, the main control device 2 can control the command signal for allowing the movement of the robot arm 20 to start.

According to the substrate processing system 1 configured as described above, since the coating device 3 and the unloading device 5 can communicate directly via the communication line L5 without passing through the main control device 2, the coating device 3 and the loading device 4 can be prevented from passing through the main control device 2. Since it is directly communicated by the communication line L4, it is easy to precisely control the operation timing of the application device 3 and the carry-out device 5, and to precisely control the operation timing of the application device 3 and the loading device 4.

Then, the carry-out control device 33 and the carry-in control device 23 cause the pin 14 (the gantry 13) to reach the target position when the operation signal transmitted from the application device 3 through the communication lines L5 and L4 is turned on (the work is completed). When the movement of the robot hand is started before the operation of the position is completed, the movement of the pin 14 (the gantry 13) to the target position (the work-completed position) can be overlapped with the movement time of the robot for the delivery of the substrate W. Therefore, the time required for the process of loading the substrate W, applying the coating liquid to the substrate W, and carrying out the substrate W can be shortened, and the production efficiency (processing efficiency) of the substrate W can be improved.

The parallel operation performed by the substrate processing system 51 of the other embodiment will be described. As shown in FIG. 8, the substrate processing system 51 includes a drying device (VCD) 40, a loading device 4, and a carrying device 5 as a substrate processing device. Drying The coating 40 is to dry the coating film on the substrate W coated with the coating liquid by the coating device 3. The drying device 40 includes a drying control device 45 (corresponding to the coating control device 16) and a drying robot arm 46. The drying robot arm 46 includes a base 41 and a lifting pin 44 similar to the coating device 3 described above. Further, a cover 42 that covers the substrate W on the base 41 from above and a cover drive mechanism 43 that lifts and lowers the cover 42 are provided. The loading device 4 and the unloading device 5 are the same as those of the user in the form of Fig. 1 .

When the substrate W is dried by the drying robot arm 46, as shown in Fig. 8(a), the lid 42 is positioned at the lowest position on the base 41, and the lid 42 and the top surface of the base 41 are formed to be sealed in a sealed state. Space V. Further, the upper end of the pin 44 is located below the top surface of the base 41.

When the drying process of the substrate W is completed, the lid 42 is moved to the upward position (target position) above the base 41. In the raised position, even if the robot hand 21 that has been loaded into the robot arm 20 and the robot hand 31 that carries out the robot arm 30 enter the platform 12, the cover 42 and the robot portions 21 and 31 do not interfere. Conversely, if the manipulators 21, 31 enter the platform 12 until the cover 42 reaches the raised position, the two collide. The position of the cover 42 can be detected by the position detecting unit (which is the same as that described in the above embodiment) included in the drying control device 45.

In addition, in the above-described embodiment, the operation is performed as the above-described cover 42 as an operation unit that performs a vertical operation by applying a process of drying the substrate W. The carry-out device 5 is provided to transport the substrate W. The base 41 is approached away from the moving robot 31.

In order to achieve this parallel operation, one of the above embodiments (Fig. 1) The drying control device 45 and the carry-out control device 33 are connected by a dedicated communication line L5. In addition, by the transmission and reception of signals between the drying control device 45 and the carry-out control device 33 by the communication line L5, it is possible to control the timing of the operation of the cover 42 and the carry-out robot 30.

The drying process of the substrate W by the substrate processing system 51 thus constituted will be described. The substrate W coated with the coating liquid by the coating device is carried into the base 41 of the drying robot arm 46 by the loading device 4, and the lid 42 is lowered to the lowest position, and the substrate W is made in the drying space V. Dry (refer to Figure 8 (a)). When the drying of the substrate W is completed, the lid 42 is moved to the upward position (target position) above the base 41, and the substrate W is lifted to the carry-out robot arm 30 to raise the pin 44 and lift the substrate W. When the lid 42 is raised, the main control device 2 transmits the preparation signal for moving the robot hand 31 to the front position of the drying robot arm 46 (the position indicated by the two-dot chain line of FIG. 8) through the communication line to the drying. Control device 45.

The drying control device 45 that receives the preparation signal transmits the entry ready signal transmission to and from the robot arm portion 31 at the retracted position as the operation signal to the front position of the drying robot arm 46 through the communication line L5 during the ascending operation of the cover 42. It is up to the carry-out control device 33. The carry-out control device 33 that receives the entry preparation signal triggers the entry preparation signal (that is, the entry preparation signal becomes a trigger), and causes the robot hand 31 located at the standby position to start toward the preceding position before the rising operation of the cover 42 is completed. mobile. Further, the robot portion 31 located at the aforementioned front position does not interfere with the rising cover 42. As a result, the upward movement of the lid 42 can be made parallel with the preparation operation of the carry-out robot arm 30. By bringing the robot portion 31 in the standby position Starting to move toward the front position, the movement stroke of the robot hand 31 from the standby position to the position on the base 41 can be shortened in advance. By the start of the entry of the carry-out robot 30 before the upward movement of the cover 42 is completed, the upward movement of the cover 42 and the movement of the robot hand 31 for receiving the substrate W can be overlapped, and the transport substrate can be shortened. W used time.

When the drying control device 45 detects that the cover 42 has reached the rising position, the drying start signal is transmitted to the loading/unloading signal by the communication line L5, which causes the robot hand 31 to enter the base 41 from the preceding position. With the control device 33, the carry-out control device 33 causes the robot hand 31 to start entering the base 41 by the entry start signal (Fig. 8(c)). Further, as in the above-described embodiment, the robot hand 31 receives the substrate W on the pin 44 and can carry out the substrate W.

Further, the substrate processing system 1 of the present invention is not limited to the illustrated embodiment, and may be other forms within the scope of the present invention. In the above embodiment, the transmission path for transmitting and receiving signals between the devices is described as a communication line (cable), but the transmission path may be configured by wireless. Further, the main control device 2 and the coating control device 16 may be different from each other but may be housed in a common casing.

1‧‧‧Substrate processing system

2‧‧‧Main control unit (main control unit)

3‧‧‧ Coating device (substrate processing device)

4‧‧‧Moving device (first conveyor)

5‧‧‧Withdrawal device (second conveyor)

6a, 6b, 6c‧‧‧ position detection department

7‧‧‧Exceeding the Control Department

10‧‧‧ Coating device body

11‧‧‧Abutment

12‧‧‧ platform

13‧‧‧Rack (action department)

14‧‧‧ Pin (Action Department)

15‧‧‧ pin drive mechanism

16‧‧‧ Coating control device

17a~17d‧‧‧ sensor

20‧‧‧ Moving into the robotic arm

21, 31‧‧‧ Robots (Transportation Department)

22‧‧‧ Moving into the drive mechanism

23‧‧‧ Moving control device

30‧‧‧Moving out the robotic arm

32‧‧‧ Moving out of the drive mechanism

33‧‧‧Moving control device

40‧‧‧Drying device (substrate processing device)

41‧‧‧Abutment

42‧‧‧ cover (action department)

43‧‧‧ cover drive mechanism

44‧‧ ‧ sales

45‧‧‧Drying control device

46‧‧‧Drying robot

E‧‧‧ initial position

F‧‧‧Location finished

L1~L5‧‧‧ dedicated communication line (transmission path)

W‧‧‧Substrate

Fig. 1 is a schematic block diagram showing an embodiment of an embodiment of a substrate processing system of the present invention.

Fig. 2 is a schematic block diagram of the substrate processing system as seen from above.

Figure 3 is a coating process performed by the substrate processing system of the present invention. Illustrating.

4 is an explanatory view of a coating process performed by the substrate processing system of the present invention.

Fig. 5 is an explanatory view of a coating process performed by the substrate processing system of the present invention.

Fig. 6 is an explanatory view of the position of the pin tip.

Fig. 7 is an explanatory diagram of the moving speed of the pin.

Fig. 8 is an explanatory diagram of parallel operations performed by the substrate processing system of another embodiment.

1‧‧‧Substrate processing system

2‧‧‧Main control unit (main control unit)

3‧‧‧ Coating device (substrate processing device)

4‧‧‧Moving device (first conveyor)

5‧‧‧Withdrawal device (second conveyor)

6a, 6b, 6c‧‧‧ position detection department

7‧‧‧Exceeding the Control Department

10‧‧‧ Coating device body

11‧‧‧Abutment

12‧‧‧ platform

13‧‧‧Rack (action department)

14‧‧‧ Pin (Action Department)

15‧‧‧ pin drive mechanism

16‧‧‧ Coating control device

20‧‧‧ Moving into the robotic arm

21, 31‧‧‧ Robots (Transportation Department)

22‧‧‧ Moving into the drive mechanism

23‧‧‧ Moving control device

30‧‧‧Moving out the robotic arm

32‧‧‧ Moving out of the drive mechanism

33‧‧‧Moving control device

L1~L5‧‧‧ dedicated communication line (transmission path)

W‧‧‧Substrate

Claims (4)

A substrate processing system includes: a substrate processing device having an operation portion that operates to process a substrate; and a transfer device having a transport portion that transports the substrate to move away from the substrate processing device, and issues a command signal to the substrate The processing device and the main control unit of the transport device include the substrate processing device and the transport device, and the method includes: a transmission path for transmitting and receiving signals between the substrate processing device and the transport device; and The transmission path is a signal transmitted between the substrate processing apparatus and the transport apparatus, and the movement of the transport unit is started before the operation of the operation unit is completed, and the operation of the operation unit and the movement of the transport unit are controlled in parallel. The moving portion is movable to a target position that does not interfere with the transport portion that is approaching for the delivery of the substrate, and is disposed at an over position that does not interfere with the transport portion in the moving direction beyond the target position. The substrate processing apparatus has a moving portion that passes the target position in the moving direction and is in the excess position The operation of the deceleration portion, so that the folded back portion of the operation beyond the position of the target position beyond the control of the control unit. The substrate processing system according to claim 1, wherein the movement of the transport unit is started before the operation of the control unit is folded back and reaches the target position, and the movement of the operation unit and the transport unit are performed. The movement is parallel. The substrate processing system of claim 1, wherein the excess control unit performs speed control, and the action portion reaches a maximum moving speed. After passing the target position. In a substrate processing method, a transport device that moves toward a substrate processing device for transporting a substrate transport unit is used, and an operation unit of the substrate processing device is operated for processing of the substrate, and is characterized in that: The signal transmitted between the substrate processing apparatus and the transport apparatus through the transmission path starts the movement of the transport unit before the operation of the operation unit is completed, and the operation of the operation unit is parallel to the movement of the transport unit. The operation portion is movable to a target position that does not interfere with the transport portion that is approaching for the delivery of the substrate, and is disposed at an over position that does not interfere with the transport portion beyond the target position in the moving direction. The substrate processing apparatus includes an excess control unit that controls the operation unit to pass the target position in the moving direction, decelerates the operation unit before the excess position, and controls the operation unit to be folded back to the target position from the excess position.