JP2010055696A - 半導体記憶装置 - Google Patents
半導体記憶装置 Download PDFInfo
- Publication number
- JP2010055696A JP2010055696A JP2008220560A JP2008220560A JP2010055696A JP 2010055696 A JP2010055696 A JP 2010055696A JP 2008220560 A JP2008220560 A JP 2008220560A JP 2008220560 A JP2008220560 A JP 2008220560A JP 2010055696 A JP2010055696 A JP 2010055696A
- Authority
- JP
- Japan
- Prior art keywords
- nmos transistor
- bit line
- memory device
- semiconductor memory
- memory cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/12—Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4091—Sense or sense/refresh amplifiers, or associated sense circuitry, e.g. for coupled bit-line precharging, equalising or isolating
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4094—Bit-line management or control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4097—Bit-line organisation, e.g. bit-line layout, folded bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/06—Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
- G11C7/067—Single-ended amplifiers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/18—Bit line organisation; Bit line lay-out
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/401—Indexing scheme relating to cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C2211/4016—Memory devices with silicon-on-insulator cells
Abstract
【解決手段】本発明の半導体記憶装置において、メモリセルMCに含まれるNMOSトランジスタQ0は、ゲート電極がワード線WLに接続され、一方のソース・ドレイン領域がビット線BLに接続されている。センスアンプ回路10に含まれるNMOSトランジスタQ10は、ゲート電極がビット線BLに接続され、一方のソース・ドレイン領域が所定の電位(グランド電位)に接続されている。NMOSトランジスタQ0、Q10は、フローティングボディ型のNMOSトランジスタであって、少なくともプリチャージ動作時に、ビット線BLに所定の電位(グランド電位)が供給されるので、ボディへの電位が安定化し、正孔の蓄積に起因する特性劣化を抑えることができる。
【選択図】図1
Description
11…グローバルセンスアンプ
20…ゲート電極
21…絶縁膜
22…ドレイン領域
23…ソース領域
24…ボディ
GBL…グローバルビット線
LBL…ローカルビット線
WL…ワード線
MC…メモリセル
Q10、Q11、Q12、Q13…NMOSトランジスタ
Q14…PMOSトランジスタ
Q0、Q0a、Q0b…選択NMOSトランジスタ
Cs…キャパシタ
Rs…抵抗素子
PC…プリチャージ信号
/PC…反転プリチャージ信号
RE、RWE…制御信号
VDD…電源電圧
VPLT…セルプレート電位
Claims (10)
- ゲート電極がワード線に接続され、一方のソース・ドレイン領域がビット線に接続された第1のNMOSトランジスタを含むメモリセルと、
ゲート電極が前記ビット線に接続され、一方のソース・ドレイン領域が所定の電位に接続された第2のNMOSトランジスタを含むセンスアンプ回路と、
前記第1のNMOSトランジスタ及び前記第2のNMOSトランジスタは、フローティングボディ型のNMOSトランジスタであり、少なくともプリチャージ動作時に前記ビット線に前記所定の電位が供給されることを特徴とする半導体記憶装置。 - 前記フローティングボディ型のNMOSトランジスタは、サラウンドゲート構造を有することを特徴とする請求項1に記載の半導体記憶装置。
- 前記センスアンプ回路は、前記ビット線を前記所定の電位にプリチャージするプリチャージ回路を含むことを特徴とする請求項1に記載の半導体記憶装置。
- 前記所定の電位はグランド電位以下であることを特徴とする請求項1に記載の半導体記憶装置。
- 前記メモリセルは、蓄積電荷に応じて情報を保持するキャパシタを含み、当該キャパシタの一方の端子が、前記第1のNMOSトランジスタの他方のソース・ドレイン領域に接続されていることを特徴とする請求項1に記載の半導体記憶装置。
- 前記メモリセルは、抵抗値の大小に応じて情報を保持する抵抗素子を含み、当該抵抗素子の一方の端子が、前記第1のNMOSトランジスタの他方のソース・ドレイン領域に接続されていることを特徴とする請求項1に記載の半導体記憶装置。
- 前記メモリセルは、抵抗値の大小に応じて情報を保持する抵抗素子を含み、前記第1のNMOSトランジスタの前記一方の端子は、前記抵抗素子を介して前記ビット線に接続されていることを特徴とする請求項1に記載の半導体記憶装置。
- 前記第1のNMOSトランジスタは、ゲート絶縁膜中に設けたチャージトラップ領域の電荷に応じて情報を保持することを特徴とする請求項1に記載の半導体記憶装置。
- 前記第1のNMOSトランジスタは、強誘電体を用いたゲート絶縁膜の分極の方向に応じて情報を保持することを特徴とする請求項1に記載の半導体記憶装置。
- 複数の前記メモリセルを階層化して配置したメモリセルアレイが構成され、
前記ビット線としての所定数のローカルビット線が、前記センスアンプ回路を介して選択的にグローバルビット線に接続されることを特徴とする請求項1に記載の半導体記憶装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008220560A JP2010055696A (ja) | 2008-08-28 | 2008-08-28 | 半導体記憶装置 |
US12/461,860 US8248875B2 (en) | 2008-08-28 | 2009-08-26 | Semiconductor memory device having floating body type NMOS transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008220560A JP2010055696A (ja) | 2008-08-28 | 2008-08-28 | 半導体記憶装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010055696A true JP2010055696A (ja) | 2010-03-11 |
Family
ID=41725239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008220560A Ceased JP2010055696A (ja) | 2008-08-28 | 2008-08-28 | 半導体記憶装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8248875B2 (ja) |
JP (1) | JP2010055696A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012064264A (ja) * | 2010-09-14 | 2012-03-29 | Elpida Memory Inc | 半導体装置及びその制御方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2957449B1 (fr) | 2010-03-11 | 2022-07-15 | S O I Tec Silicon On Insulator Tech | Micro-amplificateur de lecture pour memoire |
EP2365487A3 (en) * | 2010-03-11 | 2011-09-21 | S.O.I. Tec Silicon on Insulator Technologies | Nano-sense amplifier for memory |
JP2011222105A (ja) | 2010-04-14 | 2011-11-04 | Elpida Memory Inc | 半導体装置 |
KR20140028612A (ko) * | 2012-08-29 | 2014-03-10 | 에스케이하이닉스 주식회사 | 라이트 드라이버를 구비한 반도체 메모리 장치 및 그의 제어 방법 |
US9025266B2 (en) * | 2013-06-14 | 2015-05-05 | Rohm Co., Ltd. | Semiconductor integrated circuit device, magnetic disk storage device, and electronic apparatus |
US9196357B2 (en) | 2013-12-20 | 2015-11-24 | Micron Technology, Inc. | Voltage stabilizing for a memory cell array |
ITUA20161478A1 (it) * | 2016-03-09 | 2017-09-09 | St Microelectronics Srl | Circuito e metodo di lettura di una cella di memoria di un dispositivo di memoria non volatile |
US9792967B1 (en) * | 2016-06-13 | 2017-10-17 | International Business Machines Corporation | Managing semiconductor memory array leakage current |
US9786345B1 (en) | 2016-09-16 | 2017-10-10 | Micron Technology, Inc. | Compensation for threshold voltage variation of memory cell components |
WO2019074506A1 (en) * | 2017-10-12 | 2019-04-18 | Intel Corporation | THIN-CHANNEL THIN-FILM THIN-FILTER TRANSISTOR WITHDRAWN |
US11017845B2 (en) * | 2019-09-11 | 2021-05-25 | Sigmasense, Llc. | RAM cell processing circuit for concurrency of refresh and read |
US11495284B2 (en) * | 2020-07-17 | 2022-11-08 | Samsung Electronics Co., Ltd. | Memory device including bitline sense amplifier and operating method thereof |
WO2022219704A1 (ja) * | 2021-04-13 | 2022-10-20 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体素子を用いたメモリ装置 |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61280651A (ja) * | 1985-05-24 | 1986-12-11 | Fujitsu Ltd | 半導体記憶装置 |
JPS63228496A (ja) * | 1987-03-17 | 1988-09-22 | Fujitsu Ltd | メモリ回路 |
JPH0689574A (ja) * | 1992-03-30 | 1994-03-29 | Mitsubishi Electric Corp | 半導体装置 |
JPH07230690A (ja) * | 1994-02-17 | 1995-08-29 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH08125034A (ja) * | 1993-12-03 | 1996-05-17 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH09246483A (ja) * | 1996-03-04 | 1997-09-19 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH10172279A (ja) * | 1996-12-10 | 1998-06-26 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH1139872A (ja) * | 1997-05-19 | 1999-02-12 | Fujitsu Ltd | ダイナミックram |
JP2000124418A (ja) * | 1998-10-16 | 2000-04-28 | Sony Corp | 半導体記憶装置 |
JP2003257187A (ja) * | 2002-02-28 | 2003-09-12 | Hitachi Ltd | 不揮発性メモリ、icカード及びデータ処理装置 |
JP2005010448A (ja) * | 2003-06-19 | 2005-01-13 | Hitachi Ltd | 画像表示装置 |
JP2005122892A (ja) * | 2004-11-24 | 2005-05-12 | Renesas Technology Corp | 半導体記憶装置 |
JP2007019559A (ja) * | 2006-10-23 | 2007-01-25 | Hitachi Ltd | 半導体記憶装置及びその製造方法 |
JP2007048429A (ja) * | 2005-08-05 | 2007-02-22 | Samsung Electronics Co Ltd | 不揮発性半導体メモリ装置及びその駆動方法 |
JP2007179602A (ja) * | 2005-12-27 | 2007-07-12 | Hitachi Ltd | 半導体装置 |
JP2008177276A (ja) * | 2007-01-17 | 2008-07-31 | Toshiba Corp | 磁気ランダムアクセスメモリ及びその書き込み方法 |
JP2008192670A (ja) * | 2007-02-01 | 2008-08-21 | Seiko Epson Corp | 強誘電体トランジスタメモリ装置 |
JP2008293605A (ja) * | 2007-05-25 | 2008-12-04 | Elpida Memory Inc | 半導体記憶装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621400A (ja) | 1992-06-30 | 1994-01-28 | Sony Corp | 半導体メモリ装置 |
JP2006324683A (ja) | 1993-12-03 | 2006-11-30 | Renesas Technology Corp | 半導体記憶装置 |
JP4684098B2 (ja) | 1993-12-03 | 2011-05-18 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
US6037808A (en) * | 1997-12-24 | 2000-03-14 | Texas Instruments Incorporated | Differential SOI amplifiers having tied floating body connections |
JPH11284146A (ja) | 1998-03-30 | 1999-10-15 | Nippon Steel Corp | 半導体記憶装置及びその製造方法 |
JPH11284137A (ja) | 1998-03-30 | 1999-10-15 | Nippon Steel Corp | 半導体記憶装置及びその製造方法 |
DE19929210C1 (de) * | 1999-06-25 | 2000-10-26 | Infineon Technologies Ag | SOI-Substrat und Verfahren zu dessen Herstellung |
US6858491B1 (en) * | 2001-06-26 | 2005-02-22 | Kabushiki Kaisha Toshiba | Method of manufacturing the semiconductor device having a capacitor formed in SOI substrate |
JP2003007856A (ja) | 2001-06-26 | 2003-01-10 | Toshiba Corp | 半導体装置及びその製造方法 |
KR100752669B1 (ko) * | 2006-08-22 | 2007-08-29 | 삼성전자주식회사 | 오픈 비트 라인 구조를 가지는 반도체 메모리 장치의 비트라인 센스 앰프 |
US7460387B2 (en) * | 2007-01-05 | 2008-12-02 | International Business Machines Corporation | eDRAM hierarchical differential sense amp |
-
2008
- 2008-08-28 JP JP2008220560A patent/JP2010055696A/ja not_active Ceased
-
2009
- 2009-08-26 US US12/461,860 patent/US8248875B2/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61280651A (ja) * | 1985-05-24 | 1986-12-11 | Fujitsu Ltd | 半導体記憶装置 |
JPS63228496A (ja) * | 1987-03-17 | 1988-09-22 | Fujitsu Ltd | メモリ回路 |
JPH0689574A (ja) * | 1992-03-30 | 1994-03-29 | Mitsubishi Electric Corp | 半導体装置 |
JPH08125034A (ja) * | 1993-12-03 | 1996-05-17 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH07230690A (ja) * | 1994-02-17 | 1995-08-29 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH09246483A (ja) * | 1996-03-04 | 1997-09-19 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH10172279A (ja) * | 1996-12-10 | 1998-06-26 | Mitsubishi Electric Corp | 半導体記憶装置 |
JPH1139872A (ja) * | 1997-05-19 | 1999-02-12 | Fujitsu Ltd | ダイナミックram |
JP2000124418A (ja) * | 1998-10-16 | 2000-04-28 | Sony Corp | 半導体記憶装置 |
JP2003257187A (ja) * | 2002-02-28 | 2003-09-12 | Hitachi Ltd | 不揮発性メモリ、icカード及びデータ処理装置 |
JP2005010448A (ja) * | 2003-06-19 | 2005-01-13 | Hitachi Ltd | 画像表示装置 |
JP2005122892A (ja) * | 2004-11-24 | 2005-05-12 | Renesas Technology Corp | 半導体記憶装置 |
JP2007048429A (ja) * | 2005-08-05 | 2007-02-22 | Samsung Electronics Co Ltd | 不揮発性半導体メモリ装置及びその駆動方法 |
JP2007179602A (ja) * | 2005-12-27 | 2007-07-12 | Hitachi Ltd | 半導体装置 |
JP2007019559A (ja) * | 2006-10-23 | 2007-01-25 | Hitachi Ltd | 半導体記憶装置及びその製造方法 |
JP2008177276A (ja) * | 2007-01-17 | 2008-07-31 | Toshiba Corp | 磁気ランダムアクセスメモリ及びその書き込み方法 |
JP2008192670A (ja) * | 2007-02-01 | 2008-08-21 | Seiko Epson Corp | 強誘電体トランジスタメモリ装置 |
JP2008293605A (ja) * | 2007-05-25 | 2008-12-04 | Elpida Memory Inc | 半導体記憶装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012064264A (ja) * | 2010-09-14 | 2012-03-29 | Elpida Memory Inc | 半導体装置及びその制御方法 |
Also Published As
Publication number | Publication date |
---|---|
US8248875B2 (en) | 2012-08-21 |
US20100054016A1 (en) | 2010-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2010055696A (ja) | 半導体記憶装置 | |
US7145811B2 (en) | Semiconductor storage device | |
US7336523B2 (en) | Memory device using nanotube cells | |
US20030227041A1 (en) | Semiconductor memories | |
US8072823B2 (en) | Semiconductor memory device | |
KR101026658B1 (ko) | 단일-종단 감지 증폭기를 갖는 반도체 디바이스 | |
KR20010075543A (ko) | 반도체 장치 | |
US7969794B2 (en) | One-transistor type DRAM | |
US20230380139A1 (en) | Memory apparatus using semiconductor devices | |
TWI806597B (zh) | 使用半導體元件的記憶裝置 | |
TWI793973B (zh) | 半導體元件記憶裝置 | |
JP2007035157A (ja) | 強誘電体メモリ装置 | |
US9530502B2 (en) | Configuration memory storing data by injecting carriers in gate insulating layer of MISFET | |
US7864611B2 (en) | One-transistor type DRAM | |
TWI806492B (zh) | 半導體元件記憶裝置 | |
TW202245147A (zh) | 半導體元件記憶裝置 | |
JP2006073055A (ja) | 半導体記憶装置 | |
JP6377556B2 (ja) | 半導体デバイス及び半導体メモリデバイス | |
WO2019087769A1 (ja) | 抵抗変化型メモリ装置の読み出し回路及びその読み出し方法 | |
JP2006338729A (ja) | 半導体記憶装置 | |
TWI802404B (zh) | 使用半導體元件的記憶裝置 | |
TWI813133B (zh) | 半導體元件記憶裝置 | |
TWI817759B (zh) | 使用半導體元件的記憶裝置 | |
TWI806346B (zh) | 半導體元件記憶裝置 | |
WO2023112122A1 (ja) | 半導体素子を用いたメモリ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110609 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20130730 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20131107 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131119 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140213 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140218 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140516 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141209 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150305 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150324 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20150327 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20150331 |
|
A045 | Written measure of dismissal of application [lapsed due to lack of payment] |
Free format text: JAPANESE INTERMEDIATE CODE: A045 Effective date: 20150728 |