JP2010034523A5 - - Google Patents

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Publication number
JP2010034523A5
JP2010034523A5 JP2009139952A JP2009139952A JP2010034523A5 JP 2010034523 A5 JP2010034523 A5 JP 2010034523A5 JP 2009139952 A JP2009139952 A JP 2009139952A JP 2009139952 A JP2009139952 A JP 2009139952A JP 2010034523 A5 JP2010034523 A5 JP 2010034523A5
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JP
Japan
Prior art keywords
oxide film
substrate
nitrogen
forming
containing layer
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JP2009139952A
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English (en)
Japanese (ja)
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JP5548395B2 (ja
JP2010034523A (ja
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Priority to JP2009139952A priority Critical patent/JP5548395B2/ja
Priority claimed from JP2009139952A external-priority patent/JP5548395B2/ja
Publication of JP2010034523A publication Critical patent/JP2010034523A/ja
Publication of JP2010034523A5 publication Critical patent/JP2010034523A5/ja
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Publication of JP5548395B2 publication Critical patent/JP5548395B2/ja
Expired - Fee Related legal-status Critical Current
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JP2009139952A 2008-06-25 2009-06-11 Ｓｏｉ基板の作製方法 Expired - Fee Related JP5548395B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009139952A JP5548395B2 (ja) 2008-06-25 2009-06-11 Ｓｏｉ基板の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008166447 2008-06-25
JP2008166447 2008-06-25
JP2009139952A JP5548395B2 (ja) 2008-06-25 2009-06-11 Ｓｏｉ基板の作製方法

Publications (3)

Publication Number Publication Date
JP2010034523A JP2010034523A (ja) 2010-02-12
JP2010034523A5 true JP2010034523A5 (enExample) 2012-06-21
JP5548395B2 JP5548395B2 (ja) 2014-07-16

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Family Applications (1)

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JP2009139952A Expired - Fee Related JP5548395B2 (ja) 2008-06-25 2009-06-11 Ｓｏｉ基板の作製方法

Country Status (5)

Country Link
US (2) US7829432B2 (enExample)
JP (1) JP5548395B2 (enExample)
KR (1) KR101574138B1 (enExample)
TW (1) TWI538111B (enExample)
WO (1) WO2009157369A1 (enExample)

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CN103477420B (zh) 2011-04-08 2016-11-16 Ev集团E·索尔纳有限责任公司 永久性粘合晶片的方法
JP2014096454A (ja) * 2012-11-08 2014-05-22 Tokyo Electron Ltd 有機半導体素子の製造方法、絶縁膜の形成方法、及び溶液
JP5780234B2 (ja) 2012-12-14 2015-09-16 信越半導体株式会社 Ｓｏｉウェーハの製造方法
US20170062569A1 (en) * 2014-06-13 2017-03-02 Intel Corporation Surface encapsulation for wafer bonding
JP6471650B2 (ja) * 2015-08-27 2019-02-20 株式会社Sumco Ｓｏｉウェーハの製造方法およびｓｏｉウェーハ
JP6524862B2 (ja) 2015-08-27 2019-06-05 株式会社Sumco Ｓｏｉウェーハの製造方法およびｓｏｉウェーハ
CN106601615B (zh) * 2016-12-27 2020-05-15 上海新傲科技股份有限公司 提高键合强度的退火方法
CN117038572A (zh) * 2017-07-14 2023-11-10 太阳能爱迪生半导体有限公司 绝缘体上半导体结构的制造方法
US10686037B2 (en) 2018-07-19 2020-06-16 Vanguard International Semiconductor Corporation Semiconductor structure with insulating substrate and fabricating method thereof
TWI692874B (zh) * 2018-09-17 2020-05-01 世界先進積體電路股份有限公司 半導體結構以及製造方法
JP2024165393A (ja) * 2023-05-17 2024-11-28 信越半導体株式会社 接合基板の製造方法および半導体装置の製造方法

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KR101484296B1 (ko) 2007-06-26 2015-01-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기판의 제작방법
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JP5367330B2 (ja) 2007-09-14 2013-12-11 株式会社半導体エネルギー研究所 Ｓｏｉ基板の作製方法及び半導体装置の作製方法
TWI437696B (zh) 2007-09-21 2014-05-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
US8236668B2 (en) 2007-10-10 2012-08-07 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
JP5522917B2 (ja) 2007-10-10 2014-06-18 株式会社半導体エネルギー研究所 Ｓｏｉ基板の製造方法
US7696058B2 (en) 2007-10-31 2010-04-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate

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