JP2010028111A - 印刷回路基板の製造方法 - Google Patents
印刷回路基板の製造方法 Download PDFInfo
- Publication number
- JP2010028111A JP2010028111A JP2009163053A JP2009163053A JP2010028111A JP 2010028111 A JP2010028111 A JP 2010028111A JP 2009163053 A JP2009163053 A JP 2009163053A JP 2009163053 A JP2009163053 A JP 2009163053A JP 2010028111 A JP2010028111 A JP 2010028111A
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- wiring
- printed circuit
- circuit board
- base film
- manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】上記方法は、第1の面と上記第1の面に対向する第2の面とを含むベースフィルムを製造するステップと、5,000乃至300,000CPSの粘度を有する高粘度導電性物質で上記ベースフィルムの上記第1の面に第1の配線を印刷するステップと、上記ベースフィルムの両面を貫通し、上記第1の配線を通るビアホールを形成するステップと、100乃至5,000CPSの粘度を有する低粘度導電性物質で上記ベースフィルムの上記第2の面に第2の配線を印刷するステップとを含む。上記低粘度導電性物質が上記ビアホールの内壁に塗布されることにより上記第1の配線を上記第2の配線に導電接続する。
【選択図】図5B
Description
101・・・ベースフィルム
111・・・第1の配線
115,195・・・ビアホール
121・・・第2の配線
123・・・ビアホールの内壁
129・・・メッキ層
191・・・リード
193・・・接続端
Claims (7)
- 印刷回路基板の製造方法であって、
第1の面と前記第1の面に対向する第2の面とを含むベースフィルムを製造するステップと、
5,000乃至300,000CPSの粘度を有する高粘度導電性物質で前記ベースフィルムの前記第1の面に第1の配線を印刷する第1の印刷ステップと、
前記ベースフィルムの前記第1及び前記第2の面を貫通し、前記第1の配線を通るビアホールを形成するステップと、
100乃至5,000CPSの粘度を有する低粘度導電性物質で前記ベースフィルムの前記第2の面に第2の配線を印刷する第2の印刷ステップとを有し、
前記低粘度導電性物質が前記ビアホールの内壁に塗布されることにより前記第1の配線を前記第2の配線に導電接続することを特徴とする印刷回路基板の製造方法。 - 前記ベースフィルムは、ポリイミド及びポリエチレンテレフタレートの中の少なくとも1つで製造されることを特徴とする請求項1に記載の印刷回路基板の製造方法。
- 前記第2の配線を印刷した後に、前記ベースフィルムの前記第1及び前記2の面をコーティングするステップをさらに含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。
- 前記第2の配線を印刷した後に、前記第1及び前記第2の配線にメッキレイヤーを形成するステップをさらに含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。
- 前記メッキレイヤーは、前記第1及び前記第2の配線にすべて形成されることを特徴とする請求項4に記載の印刷回路基板の製造方法。
- 前記メッキレイヤーは、前記印刷回路基板の接続端に形成されることを特徴とする請求項4に記載の印刷回路基板の製造方法。
- 前記第1及び前記第2の配線を印刷するのに使用される導電性物質は、銀(Ag)、銅(Cu)、及び銀とニッケルの合金(Ag+Ni)の中の少なくとも1つを含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080069096A KR101411717B1 (ko) | 2008-07-16 | 2008-07-16 | 인쇄회로 기판의 제조 방법 |
KR10-2008-0069096 | 2008-07-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010028111A true JP2010028111A (ja) | 2010-02-04 |
JP4728417B2 JP4728417B2 (ja) | 2011-07-20 |
Family
ID=40886236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009163053A Expired - Fee Related JP4728417B2 (ja) | 2008-07-16 | 2009-07-09 | 印刷回路基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8474135B2 (ja) |
EP (1) | EP2146560B1 (ja) |
JP (1) | JP4728417B2 (ja) |
KR (1) | KR101411717B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5450885B2 (ja) * | 2010-04-02 | 2014-03-26 | インクテック カンパニー リミテッド | 両面プリント回路基板の製造方法 |
JP6311200B2 (ja) * | 2014-06-26 | 2018-04-18 | 住友電工プリントサーキット株式会社 | プリント配線板、電子部品及びプリント配線板の製造方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512777A (en) * | 1978-07-14 | 1980-01-29 | Fujitsu Ltd | Method of manufacturing ceramic substrate |
JPS6267898A (ja) * | 1985-09-20 | 1987-03-27 | 北陸電気工業株式会社 | 電子回路基板のスル−ホ−ル接続部形成方法 |
JPH07249866A (ja) * | 1994-03-09 | 1995-09-26 | Tokuyama Corp | 硬化性ペーストの充填方法 |
JPH08316600A (ja) * | 1995-03-15 | 1996-11-29 | Tokuyama Corp | 両面回路基板 |
JPH09260801A (ja) * | 1996-03-25 | 1997-10-03 | Soshin Denki Kk | スルーホール基板及びその製法 |
JP2000200951A (ja) * | 1999-01-05 | 2000-07-18 | Alps Electric Co Ltd | プリント基板、およびプリント基板の製造方法 |
JP2001135903A (ja) * | 1999-11-02 | 2001-05-18 | Seiko Epson Corp | フレキシブル配線基板 |
JP2003234572A (ja) * | 2002-02-06 | 2003-08-22 | Nitto Denko Corp | 両面配線基板の製造方法 |
JP2008066444A (ja) * | 2006-09-06 | 2008-03-21 | Sony Chemical & Information Device Corp | 配線基板の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4567542A (en) * | 1984-04-23 | 1986-01-28 | Nec Corporation | Multilayer ceramic substrate with interlayered capacitor |
DE3429236A1 (de) * | 1984-08-08 | 1986-02-13 | Krone Gmbh, 1000 Berlin | Folie mit beidseitig aufgedruckten elektrischen leiterbahnen |
US5601672A (en) * | 1994-11-01 | 1997-02-11 | International Business Machines Corporation | Method for making ceramic substrates from thin and thick ceramic greensheets |
JPH10256687A (ja) * | 1997-03-14 | 1998-09-25 | Matsushita Electric Ind Co Ltd | ビアホール充填用導体ペースト組成物とそれを用いたプリント配線基板 |
JP2000299560A (ja) * | 1999-04-15 | 2000-10-24 | Matsushita Electric Ind Co Ltd | セラミック回路板の製造方法 |
US6337037B1 (en) * | 1999-12-09 | 2002-01-08 | Methode Electronics Inc. | Printed wiring board conductive via hole filler having metal oxide reducing capability |
JP2007220764A (ja) | 2006-02-15 | 2007-08-30 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
-
2008
- 2008-07-16 KR KR1020080069096A patent/KR101411717B1/ko active IP Right Grant
-
2009
- 2009-06-26 EP EP09163914A patent/EP2146560B1/en not_active Not-in-force
- 2009-07-09 JP JP2009163053A patent/JP4728417B2/ja not_active Expired - Fee Related
- 2009-07-16 US US12/504,339 patent/US8474135B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5512777A (en) * | 1978-07-14 | 1980-01-29 | Fujitsu Ltd | Method of manufacturing ceramic substrate |
JPS6267898A (ja) * | 1985-09-20 | 1987-03-27 | 北陸電気工業株式会社 | 電子回路基板のスル−ホ−ル接続部形成方法 |
JPH07249866A (ja) * | 1994-03-09 | 1995-09-26 | Tokuyama Corp | 硬化性ペーストの充填方法 |
JPH08316600A (ja) * | 1995-03-15 | 1996-11-29 | Tokuyama Corp | 両面回路基板 |
JPH09260801A (ja) * | 1996-03-25 | 1997-10-03 | Soshin Denki Kk | スルーホール基板及びその製法 |
JP2000200951A (ja) * | 1999-01-05 | 2000-07-18 | Alps Electric Co Ltd | プリント基板、およびプリント基板の製造方法 |
JP2001135903A (ja) * | 1999-11-02 | 2001-05-18 | Seiko Epson Corp | フレキシブル配線基板 |
JP2003234572A (ja) * | 2002-02-06 | 2003-08-22 | Nitto Denko Corp | 両面配線基板の製造方法 |
JP2008066444A (ja) * | 2006-09-06 | 2008-03-21 | Sony Chemical & Information Device Corp | 配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101411717B1 (ko) | 2014-06-26 |
EP2146560A1 (en) | 2010-01-20 |
US20100011573A1 (en) | 2010-01-21 |
KR20100008551A (ko) | 2010-01-26 |
JP4728417B2 (ja) | 2011-07-20 |
US8474135B2 (en) | 2013-07-02 |
EP2146560B1 (en) | 2012-05-16 |
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