JP2009545865A - Led半導体基体 - Google Patents

Led半導体基体 Download PDF

Info

Publication number
JP2009545865A
JP2009545865A JP2009522085A JP2009522085A JP2009545865A JP 2009545865 A JP2009545865 A JP 2009545865A JP 2009522085 A JP2009522085 A JP 2009522085A JP 2009522085 A JP2009522085 A JP 2009522085A JP 2009545865 A JP2009545865 A JP 2009545865A
Authority
JP
Japan
Prior art keywords
layer
quantum
semiconductor substrate
led semiconductor
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009522085A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009545865A5 (enExample
Inventor
グレニンガー ギュンター
ユング クリスティアン
ハイトボルン ペーター
ベーレス アレクサンダー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2009545865A publication Critical patent/JP2009545865A/ja
Publication of JP2009545865A5 publication Critical patent/JP2009545865A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Devices (AREA)
JP2009522085A 2006-07-31 2007-07-27 Led半導体基体 Pending JP2009545865A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006035627A DE102006035627A1 (de) 2006-07-31 2006-07-31 LED-Halbleiterkörper
PCT/DE2007/001349 WO2008014772A1 (de) 2006-07-31 2007-07-27 Led-halbleiterkörper

Publications (2)

Publication Number Publication Date
JP2009545865A true JP2009545865A (ja) 2009-12-24
JP2009545865A5 JP2009545865A5 (enExample) 2011-06-16

Family

ID=38739481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009522085A Pending JP2009545865A (ja) 2006-07-31 2007-07-27 Led半導体基体

Country Status (8)

Country Link
US (1) US8405065B2 (enExample)
EP (1) EP2047527B1 (enExample)
JP (1) JP2009545865A (enExample)
KR (1) KR20090033897A (enExample)
CN (1) CN101496187A (enExample)
DE (1) DE102006035627A1 (enExample)
TW (1) TWI370557B (enExample)
WO (1) WO2008014772A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287369B2 (en) 2012-03-08 2016-03-15 Kabushiki Kaisha Toshiba Nitride semiconductor element and nitride semiconductor wafer

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102307920B (zh) 2009-02-05 2014-09-03 阿科玛股份有限公司 用聚醚酮酮上胶的纤维
JP5684501B2 (ja) * 2010-07-06 2015-03-11 昭和電工株式会社 発光ダイオード用エピタキシャルウェーハ
JP5801542B2 (ja) * 2010-07-13 2015-10-28 昭和電工株式会社 発光ダイオード及び発光ダイオードランプ
JP6024278B2 (ja) * 2012-08-10 2016-11-16 住友電気工業株式会社 発光素子
DE102012107795B4 (de) * 2012-08-23 2022-02-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip
US9508891B2 (en) 2014-11-21 2016-11-29 Epistar Corporation Method for making light-emitting device
US9306115B1 (en) 2015-02-10 2016-04-05 Epistar Corporation Light-emitting device
DE102015109793A1 (de) * 2015-06-18 2016-12-22 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
DE102015109796A1 (de) * 2015-06-18 2016-12-22 Osram Opto Semiconductors Gmbh Leuchtdiodenchip
DE102015119817A1 (de) * 2015-11-17 2017-05-18 Osram Opto Semiconductors Gmbh Halbleiterbauelement
US9859470B2 (en) * 2016-03-10 2018-01-02 Epistar Corporation Light-emitting device with adjusting element
DE102019115351A1 (de) * 2019-06-06 2020-12-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen
KR102333489B1 (ko) * 2019-10-01 2021-12-01 에피스타 코포레이션 발광 디바이스
CN112838150B (zh) * 2020-12-31 2022-05-13 武汉光迅科技股份有限公司 发光二极管及其形成方法
US12278304B2 (en) * 2021-02-04 2025-04-15 Mellanox Technologies, Ltd. High modulation speed PIN-type photodiode

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162482A (ja) * 1995-12-08 1997-06-20 Nippon Telegr & Teleph Corp <Ntt> 面発光半導体レーザ
JP2005109124A (ja) * 2003-09-30 2005-04-21 Shin Etsu Handotai Co Ltd 発光素子及びその製造方法
JP2005175462A (ja) * 2003-11-21 2005-06-30 Sanken Electric Co Ltd 半導体発光素子及びその製造方法
JP2006120884A (ja) * 2004-10-22 2006-05-11 Ricoh Co Ltd 半導体発光素子および面発光レーザおよび面発光レーザアレイおよび画像形成装置および光ピックアップシステムおよび光送信モジュールおよび光送受信モジュールおよび光通信システム
JP2006196880A (ja) * 2004-12-17 2006-07-27 Matsushita Electric Ind Co Ltd 光半導体装置及びその製造方法
JP2007012688A (ja) * 2005-06-28 2007-01-18 Toshiba Corp 半導体発光素子

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132981A (en) * 1989-05-31 1992-07-21 Hitachi, Ltd. Semiconductor optical device
GB2263814B (en) * 1992-01-17 1996-01-10 Northern Telecom Ltd Semiconductor mixed crystal quantum well device manufacture
JPH07202260A (ja) * 1993-12-27 1995-08-04 Furukawa Electric Co Ltd:The 歪超格子発光素子
DE69524691T2 (de) * 1994-08-29 2002-08-08 Matsushita Electric Industrial Co., Ltd. Halbleiterlaservorrichtung mit verspannter Quantentrogstruktur und deren Herstellungsverfahren
US6233264B1 (en) * 1996-08-27 2001-05-15 Ricoh Company, Ltd. Optical semiconductor device having an active layer containing N
US5825796A (en) * 1996-09-25 1998-10-20 Picolight Incorporated Extended wavelength strained layer lasers having strain compensated layers
JPH11150330A (ja) * 1997-11-14 1999-06-02 Sony Corp 半導体発光素子
JPH11274635A (ja) * 1998-03-19 1999-10-08 Hitachi Ltd 半導体発光装置
US6657233B2 (en) * 1998-08-19 2003-12-02 Ricoh Company, Ltd. Light emitting devices with layered III-V semiconductor structures, and modules and systems for computer, network and optical communication, using such device
US6711195B2 (en) * 2002-02-28 2004-03-23 Agilent Technologies, Inc. Long-wavelength photonic device with GaAsSb quantum-well layer
US20030235224A1 (en) * 2002-06-19 2003-12-25 Ohlander Ulf Roald Strained quantum-well structure having ternary-alloy material in both quantum-well layers and barrier layers
US7801194B2 (en) * 2002-07-01 2010-09-21 Sharp Kabushiki Kaisha Semiconductor laser device and optical disk unit using the same
TWI226138B (en) * 2003-01-03 2005-01-01 Super Nova Optoelectronics Cor GaN-based LED vertical device structure and the manufacturing method thereof
JP2004235649A (ja) * 2003-01-31 2004-08-19 Osram Opto Semiconductors Gmbh 電気コンタクト領域を備えたモジュールの製造方法および半導体層列および活性ゾーンを有するモジュール
JP2004296634A (ja) * 2003-03-26 2004-10-21 Sharp Corp 半導体レーザ装置および光ディスク装置
JP2004296637A (ja) * 2003-03-26 2004-10-21 Sharp Corp 半導体レーザ装置および光ディスク装置
DE102004024611A1 (de) * 2003-05-23 2005-03-03 Osram Opto Semiconductors Gmbh Optisch gepumpte Halbleitervorrichtung
TW200520266A (en) * 2003-11-21 2005-06-16 Sanken Electric Co Ltd Semiconductor luminous element and manufacturing method of the same
TWI254469B (en) 2004-04-14 2006-05-01 Osram Opto Semiconductors Gmbh Luminous diode chip
DE102005016592A1 (de) * 2004-04-14 2005-11-24 Osram Opto Semiconductors Gmbh Leuchtdiodenchip
DE102004026125A1 (de) * 2004-05-28 2005-12-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zu dessen Herstellung
US7684458B2 (en) * 2004-06-11 2010-03-23 Ricoh Company, Ltd. Surface-emission laser diode and fabrication process thereof
JP4224041B2 (ja) * 2004-08-26 2009-02-12 シャープ株式会社 半導体レーザ素子、半導体レーザ素子の製造方法、光ディスク装置および光伝送システム
DE102004057802B4 (de) * 2004-11-30 2011-03-24 Osram Opto Semiconductors Gmbh Strahlungemittierendes Halbleiterbauelement mit Zwischenschicht
US7459719B2 (en) * 2004-12-17 2008-12-02 Panasonic Corporation Superlattice optical semiconductor device where each barrier layer has high content of group III elements in center portion and low content near well layer
JP4460473B2 (ja) * 2005-02-23 2010-05-12 シャープ株式会社 半導体レーザ装置の製造方法
US7376169B2 (en) * 2005-03-07 2008-05-20 Joseph Reid Henrichs Optical phase conjugation laser diode
DE102006039369A1 (de) * 2005-12-30 2007-07-05 Osram Opto Semiconductors Gmbh LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers
DE102006028692B4 (de) * 2006-05-19 2021-09-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium
US8115213B2 (en) * 2007-02-08 2012-02-14 Phoseon Technology, Inc. Semiconductor light sources, systems, and methods
US20080197369A1 (en) * 2007-02-20 2008-08-21 Cree, Inc. Double flip semiconductor device and method for fabrication
US20090238227A1 (en) * 2008-03-05 2009-09-24 Rohm Co., Ltd. Semiconductor light emitting device
JP5102082B2 (ja) * 2008-03-18 2012-12-19 株式会社リコー 画像形成装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09162482A (ja) * 1995-12-08 1997-06-20 Nippon Telegr & Teleph Corp <Ntt> 面発光半導体レーザ
JP2005109124A (ja) * 2003-09-30 2005-04-21 Shin Etsu Handotai Co Ltd 発光素子及びその製造方法
JP2005175462A (ja) * 2003-11-21 2005-06-30 Sanken Electric Co Ltd 半導体発光素子及びその製造方法
JP2006120884A (ja) * 2004-10-22 2006-05-11 Ricoh Co Ltd 半導体発光素子および面発光レーザおよび面発光レーザアレイおよび画像形成装置および光ピックアップシステムおよび光送信モジュールおよび光送受信モジュールおよび光通信システム
JP2006196880A (ja) * 2004-12-17 2006-07-27 Matsushita Electric Ind Co Ltd 光半導体装置及びその製造方法
JP2007012688A (ja) * 2005-06-28 2007-01-18 Toshiba Corp 半導体発光素子

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9287369B2 (en) 2012-03-08 2016-03-15 Kabushiki Kaisha Toshiba Nitride semiconductor element and nitride semiconductor wafer
US9508804B2 (en) 2012-03-08 2016-11-29 Kabushiki Kaisha Toshiba Nitride semiconductor element and nitride semiconductor wafer

Also Published As

Publication number Publication date
CN101496187A (zh) 2009-07-29
EP2047527B1 (de) 2017-11-22
US20090302307A1 (en) 2009-12-10
EP2047527A1 (de) 2009-04-15
US8405065B2 (en) 2013-03-26
TW200810159A (en) 2008-02-16
WO2008014772A1 (de) 2008-02-07
KR20090033897A (ko) 2009-04-06
DE102006035627A1 (de) 2008-02-07
TWI370557B (en) 2012-08-11

Similar Documents

Publication Publication Date Title
JP2009545865A (ja) Led半導体基体
US8093606B2 (en) Nitride semiconductor light emitting device
US7939833B2 (en) Nitride semiconductor light emitting device
JP6452651B2 (ja) 半導体光デバイスの製造方法および半導体光デバイス
JP5735984B2 (ja) 発光半導体チップ
JP2014003329A (ja) 応力低減電子ブロッキング層を有する窒化ガリウム・ベース半導体デバイス
US8796711B2 (en) Light-emitting element
US6265734B1 (en) Opto-electronic component made from II-VI semiconductor material
KR101184862B1 (ko) 질화물 반도체 발광 소자 및 질화물 반도체 발광 소자의 제조 방법
EP1793429A1 (en) Semiconductor light emitting device having a reflection layer comprising silver
US20030086467A1 (en) DBR comprising GaP, and use thereof in a semiconductor resonant cavity device
JP2006332205A (ja) 窒化物半導体発光素子
JP5405545B2 (ja) 光電変換素子
US20090001402A1 (en) Semiconductor element and method of making the same
US7791081B2 (en) Radiation-emitting semiconductor chip
JP2006040998A (ja) 半導体発光素子、半導体発光素子用エピタキシャルウェハ
EP1302791A1 (en) Distributed Bragg Reflector comprising a GaP layer, and a semiconductor resonant cavity device comprising such a DBR
KR20050042715A (ko) 전극 구조체, 이를 구비하는 반도체 발광 소자 및 그제조방법
JP2008244360A (ja) 半導体発光素子
JP7413599B1 (ja) Iii-v族化合物半導体発光素子及びiii-v族化合物半導体発光素子の製造方法
JP2015529974A (ja) オプトエレクトロニクス半導体ボディ及びオプトエレクトロニクス半導体チップ
JPH09102630A (ja) Ii−vi族半導体発光素子および半導体面発光レーザ
Mauk et al. Resonant cavity LEDs by lateral epitaxy
JPH07211936A (ja) 半導体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100510

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101227

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110422

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120523

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120523

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120820

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120827

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121030

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130222