TWI370557B - Led semiconductor body - Google Patents

Led semiconductor body

Info

Publication number
TWI370557B
TWI370557B TW096127685A TW96127685A TWI370557B TW I370557 B TWI370557 B TW I370557B TW 096127685 A TW096127685 A TW 096127685A TW 96127685 A TW96127685 A TW 96127685A TW I370557 B TWI370557 B TW I370557B
Authority
TW
Taiwan
Prior art keywords
semiconductor body
led semiconductor
led
semiconductor
Prior art date
Application number
TW096127685A
Other languages
English (en)
Chinese (zh)
Other versions
TW200810159A (en
Inventor
Alexander Behres
Guenther Groenninger
Peter Heidborn
Christian Jung
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200810159A publication Critical patent/TW200810159A/zh
Application granted granted Critical
Publication of TWI370557B publication Critical patent/TWI370557B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Devices (AREA)
TW096127685A 2006-07-31 2007-07-30 Led semiconductor body TWI370557B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006035627A DE102006035627A1 (de) 2006-07-31 2006-07-31 LED-Halbleiterkörper

Publications (2)

Publication Number Publication Date
TW200810159A TW200810159A (en) 2008-02-16
TWI370557B true TWI370557B (en) 2012-08-11

Family

ID=38739481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127685A TWI370557B (en) 2006-07-31 2007-07-30 Led semiconductor body

Country Status (8)

Country Link
US (1) US8405065B2 (enExample)
EP (1) EP2047527B1 (enExample)
JP (1) JP2009545865A (enExample)
KR (1) KR20090033897A (enExample)
CN (1) CN101496187A (enExample)
DE (1) DE102006035627A1 (enExample)
TW (1) TWI370557B (enExample)
WO (1) WO2008014772A1 (enExample)

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CN102307920B (zh) 2009-02-05 2014-09-03 阿科玛股份有限公司 用聚醚酮酮上胶的纤维
JP5684501B2 (ja) * 2010-07-06 2015-03-11 昭和電工株式会社 発光ダイオード用エピタキシャルウェーハ
JP5801542B2 (ja) * 2010-07-13 2015-10-28 昭和電工株式会社 発光ダイオード及び発光ダイオードランプ
JP5228122B1 (ja) 2012-03-08 2013-07-03 株式会社東芝 窒化物半導体素子及び窒化物半導体ウェーハ
JP6024278B2 (ja) * 2012-08-10 2016-11-16 住友電気工業株式会社 発光素子
DE102012107795B4 (de) * 2012-08-23 2022-02-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip
US9508891B2 (en) 2014-11-21 2016-11-29 Epistar Corporation Method for making light-emitting device
US9306115B1 (en) 2015-02-10 2016-04-05 Epistar Corporation Light-emitting device
DE102015109793A1 (de) * 2015-06-18 2016-12-22 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
DE102015109796A1 (de) * 2015-06-18 2016-12-22 Osram Opto Semiconductors Gmbh Leuchtdiodenchip
DE102015119817A1 (de) * 2015-11-17 2017-05-18 Osram Opto Semiconductors Gmbh Halbleiterbauelement
US9859470B2 (en) * 2016-03-10 2018-01-02 Epistar Corporation Light-emitting device with adjusting element
DE102019115351A1 (de) * 2019-06-06 2020-12-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen
KR102333489B1 (ko) * 2019-10-01 2021-12-01 에피스타 코포레이션 발광 디바이스
CN112838150B (zh) * 2020-12-31 2022-05-13 武汉光迅科技股份有限公司 发光二极管及其形成方法
US12278304B2 (en) * 2021-02-04 2025-04-15 Mellanox Technologies, Ltd. High modulation speed PIN-type photodiode

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JPH07202260A (ja) * 1993-12-27 1995-08-04 Furukawa Electric Co Ltd:The 歪超格子発光素子
DE69524691T2 (de) * 1994-08-29 2002-08-08 Matsushita Electric Industrial Co., Ltd. Halbleiterlaservorrichtung mit verspannter Quantentrogstruktur und deren Herstellungsverfahren
JPH09162482A (ja) 1995-12-08 1997-06-20 Nippon Telegr & Teleph Corp <Ntt> 面発光半導体レーザ
US6233264B1 (en) * 1996-08-27 2001-05-15 Ricoh Company, Ltd. Optical semiconductor device having an active layer containing N
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JPH11150330A (ja) * 1997-11-14 1999-06-02 Sony Corp 半導体発光素子
JPH11274635A (ja) * 1998-03-19 1999-10-08 Hitachi Ltd 半導体発光装置
US6657233B2 (en) * 1998-08-19 2003-12-02 Ricoh Company, Ltd. Light emitting devices with layered III-V semiconductor structures, and modules and systems for computer, network and optical communication, using such device
US6711195B2 (en) * 2002-02-28 2004-03-23 Agilent Technologies, Inc. Long-wavelength photonic device with GaAsSb quantum-well layer
US20030235224A1 (en) * 2002-06-19 2003-12-25 Ohlander Ulf Roald Strained quantum-well structure having ternary-alloy material in both quantum-well layers and barrier layers
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JP2005109124A (ja) 2003-09-30 2005-04-21 Shin Etsu Handotai Co Ltd 発光素子及びその製造方法
TW200520266A (en) * 2003-11-21 2005-06-16 Sanken Electric Co Ltd Semiconductor luminous element and manufacturing method of the same
JP4164689B2 (ja) * 2003-11-21 2008-10-15 サンケン電気株式会社 半導体発光素子
TWI254469B (en) 2004-04-14 2006-05-01 Osram Opto Semiconductors Gmbh Luminous diode chip
DE102005016592A1 (de) * 2004-04-14 2005-11-24 Osram Opto Semiconductors Gmbh Leuchtdiodenchip
DE102004026125A1 (de) * 2004-05-28 2005-12-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Verfahren zu dessen Herstellung
US7684458B2 (en) * 2004-06-11 2010-03-23 Ricoh Company, Ltd. Surface-emission laser diode and fabrication process thereof
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JP2006120884A (ja) 2004-10-22 2006-05-11 Ricoh Co Ltd 半導体発光素子および面発光レーザおよび面発光レーザアレイおよび画像形成装置および光ピックアップシステムおよび光送信モジュールおよび光送受信モジュールおよび光通信システム
DE102004057802B4 (de) * 2004-11-30 2011-03-24 Osram Opto Semiconductors Gmbh Strahlungemittierendes Halbleiterbauelement mit Zwischenschicht
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US7459719B2 (en) * 2004-12-17 2008-12-02 Panasonic Corporation Superlattice optical semiconductor device where each barrier layer has high content of group III elements in center portion and low content near well layer
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DE102006039369A1 (de) * 2005-12-30 2007-07-05 Osram Opto Semiconductors Gmbh LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers
DE102006028692B4 (de) * 2006-05-19 2021-09-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium
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US20080197369A1 (en) * 2007-02-20 2008-08-21 Cree, Inc. Double flip semiconductor device and method for fabrication
US20090238227A1 (en) * 2008-03-05 2009-09-24 Rohm Co., Ltd. Semiconductor light emitting device
JP5102082B2 (ja) * 2008-03-18 2012-12-19 株式会社リコー 画像形成装置

Also Published As

Publication number Publication date
CN101496187A (zh) 2009-07-29
EP2047527B1 (de) 2017-11-22
US20090302307A1 (en) 2009-12-10
EP2047527A1 (de) 2009-04-15
US8405065B2 (en) 2013-03-26
TW200810159A (en) 2008-02-16
WO2008014772A1 (de) 2008-02-07
KR20090033897A (ko) 2009-04-06
JP2009545865A (ja) 2009-12-24
DE102006035627A1 (de) 2008-02-07

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