KR20090033897A - Led 반도체 몸체 - Google Patents
Led 반도체 몸체 Download PDFInfo
- Publication number
- KR20090033897A KR20090033897A KR1020097003151A KR20097003151A KR20090033897A KR 20090033897 A KR20090033897 A KR 20090033897A KR 1020097003151 A KR1020097003151 A KR 1020097003151A KR 20097003151 A KR20097003151 A KR 20097003151A KR 20090033897 A KR20090033897 A KR 20090033897A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- quantum
- semiconductor body
- barrier layer
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 172
- 230000004888 barrier function Effects 0.000 claims abstract description 80
- 230000005855 radiation Effects 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 10
- 238000001228 spectrum Methods 0.000 claims description 4
- 238000005253 cladding Methods 0.000 description 25
- 239000000463 material Substances 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 16
- 239000002800 charge carrier Substances 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 230000008901 benefit Effects 0.000 description 13
- 229910052738 indium Inorganic materials 0.000 description 11
- 238000006073 displacement reaction Methods 0.000 description 10
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 10
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 9
- 238000000151 deposition Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 230000003595 spectral effect Effects 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000012876 carrier material Substances 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910017115 AlSb Inorganic materials 0.000 description 1
- 229910005542 GaSb Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006035627.6 | 2006-07-31 | ||
| DE102006035627A DE102006035627A1 (de) | 2006-07-31 | 2006-07-31 | LED-Halbleiterkörper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090033897A true KR20090033897A (ko) | 2009-04-06 |
Family
ID=38739481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097003151A Withdrawn KR20090033897A (ko) | 2006-07-31 | 2007-07-27 | Led 반도체 몸체 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8405065B2 (enExample) |
| EP (1) | EP2047527B1 (enExample) |
| JP (1) | JP2009545865A (enExample) |
| KR (1) | KR20090033897A (enExample) |
| CN (1) | CN101496187A (enExample) |
| DE (1) | DE102006035627A1 (enExample) |
| TW (1) | TWI370557B (enExample) |
| WO (1) | WO2008014772A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200070168A (ko) * | 2019-10-01 | 2020-06-17 | 에피스타 코포레이션 | 발광 디바이스 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307920B (zh) | 2009-02-05 | 2014-09-03 | 阿科玛股份有限公司 | 用聚醚酮酮上胶的纤维 |
| JP5684501B2 (ja) * | 2010-07-06 | 2015-03-11 | 昭和電工株式会社 | 発光ダイオード用エピタキシャルウェーハ |
| JP5801542B2 (ja) * | 2010-07-13 | 2015-10-28 | 昭和電工株式会社 | 発光ダイオード及び発光ダイオードランプ |
| JP5228122B1 (ja) | 2012-03-08 | 2013-07-03 | 株式会社東芝 | 窒化物半導体素子及び窒化物半導体ウェーハ |
| JP6024278B2 (ja) * | 2012-08-10 | 2016-11-16 | 住友電気工業株式会社 | 発光素子 |
| DE102012107795B4 (de) * | 2012-08-23 | 2022-02-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip |
| US9508891B2 (en) | 2014-11-21 | 2016-11-29 | Epistar Corporation | Method for making light-emitting device |
| US9306115B1 (en) | 2015-02-10 | 2016-04-05 | Epistar Corporation | Light-emitting device |
| DE102015109793A1 (de) * | 2015-06-18 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
| DE102015109796A1 (de) * | 2015-06-18 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
| DE102015119817A1 (de) * | 2015-11-17 | 2017-05-18 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement |
| US9859470B2 (en) * | 2016-03-10 | 2018-01-02 | Epistar Corporation | Light-emitting device with adjusting element |
| DE102019115351A1 (de) * | 2019-06-06 | 2020-12-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen |
| CN112838150B (zh) * | 2020-12-31 | 2022-05-13 | 武汉光迅科技股份有限公司 | 发光二极管及其形成方法 |
| US12278304B2 (en) * | 2021-02-04 | 2025-04-15 | Mellanox Technologies, Ltd. | High modulation speed PIN-type photodiode |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132981A (en) * | 1989-05-31 | 1992-07-21 | Hitachi, Ltd. | Semiconductor optical device |
| GB2263814B (en) * | 1992-01-17 | 1996-01-10 | Northern Telecom Ltd | Semiconductor mixed crystal quantum well device manufacture |
| JPH07202260A (ja) * | 1993-12-27 | 1995-08-04 | Furukawa Electric Co Ltd:The | 歪超格子発光素子 |
| DE69524691T2 (de) * | 1994-08-29 | 2002-08-08 | Matsushita Electric Industrial Co., Ltd. | Halbleiterlaservorrichtung mit verspannter Quantentrogstruktur und deren Herstellungsverfahren |
| JPH09162482A (ja) | 1995-12-08 | 1997-06-20 | Nippon Telegr & Teleph Corp <Ntt> | 面発光半導体レーザ |
| US6233264B1 (en) * | 1996-08-27 | 2001-05-15 | Ricoh Company, Ltd. | Optical semiconductor device having an active layer containing N |
| US5825796A (en) * | 1996-09-25 | 1998-10-20 | Picolight Incorporated | Extended wavelength strained layer lasers having strain compensated layers |
| JPH11150330A (ja) * | 1997-11-14 | 1999-06-02 | Sony Corp | 半導体発光素子 |
| JPH11274635A (ja) * | 1998-03-19 | 1999-10-08 | Hitachi Ltd | 半導体発光装置 |
| US6657233B2 (en) * | 1998-08-19 | 2003-12-02 | Ricoh Company, Ltd. | Light emitting devices with layered III-V semiconductor structures, and modules and systems for computer, network and optical communication, using such device |
| US6711195B2 (en) * | 2002-02-28 | 2004-03-23 | Agilent Technologies, Inc. | Long-wavelength photonic device with GaAsSb quantum-well layer |
| US20030235224A1 (en) * | 2002-06-19 | 2003-12-25 | Ohlander Ulf Roald | Strained quantum-well structure having ternary-alloy material in both quantum-well layers and barrier layers |
| US7801194B2 (en) * | 2002-07-01 | 2010-09-21 | Sharp Kabushiki Kaisha | Semiconductor laser device and optical disk unit using the same |
| TWI226138B (en) * | 2003-01-03 | 2005-01-01 | Super Nova Optoelectronics Cor | GaN-based LED vertical device structure and the manufacturing method thereof |
| JP2004235649A (ja) * | 2003-01-31 | 2004-08-19 | Osram Opto Semiconductors Gmbh | 電気コンタクト領域を備えたモジュールの製造方法および半導体層列および活性ゾーンを有するモジュール |
| JP2004296634A (ja) * | 2003-03-26 | 2004-10-21 | Sharp Corp | 半導体レーザ装置および光ディスク装置 |
| JP2004296637A (ja) * | 2003-03-26 | 2004-10-21 | Sharp Corp | 半導体レーザ装置および光ディスク装置 |
| DE102004024611A1 (de) * | 2003-05-23 | 2005-03-03 | Osram Opto Semiconductors Gmbh | Optisch gepumpte Halbleitervorrichtung |
| JP2005109124A (ja) | 2003-09-30 | 2005-04-21 | Shin Etsu Handotai Co Ltd | 発光素子及びその製造方法 |
| TW200520266A (en) * | 2003-11-21 | 2005-06-16 | Sanken Electric Co Ltd | Semiconductor luminous element and manufacturing method of the same |
| JP4164689B2 (ja) * | 2003-11-21 | 2008-10-15 | サンケン電気株式会社 | 半導体発光素子 |
| TWI254469B (en) | 2004-04-14 | 2006-05-01 | Osram Opto Semiconductors Gmbh | Luminous diode chip |
| DE102005016592A1 (de) * | 2004-04-14 | 2005-11-24 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
| DE102004026125A1 (de) * | 2004-05-28 | 2005-12-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Verfahren zu dessen Herstellung |
| US7684458B2 (en) * | 2004-06-11 | 2010-03-23 | Ricoh Company, Ltd. | Surface-emission laser diode and fabrication process thereof |
| JP4224041B2 (ja) * | 2004-08-26 | 2009-02-12 | シャープ株式会社 | 半導体レーザ素子、半導体レーザ素子の製造方法、光ディスク装置および光伝送システム |
| JP2006120884A (ja) | 2004-10-22 | 2006-05-11 | Ricoh Co Ltd | 半導体発光素子および面発光レーザおよび面発光レーザアレイおよび画像形成装置および光ピックアップシステムおよび光送信モジュールおよび光送受信モジュールおよび光通信システム |
| DE102004057802B4 (de) * | 2004-11-30 | 2011-03-24 | Osram Opto Semiconductors Gmbh | Strahlungemittierendes Halbleiterbauelement mit Zwischenschicht |
| JP2006196880A (ja) | 2004-12-17 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 光半導体装置及びその製造方法 |
| US7459719B2 (en) * | 2004-12-17 | 2008-12-02 | Panasonic Corporation | Superlattice optical semiconductor device where each barrier layer has high content of group III elements in center portion and low content near well layer |
| JP4460473B2 (ja) * | 2005-02-23 | 2010-05-12 | シャープ株式会社 | 半導体レーザ装置の製造方法 |
| US7376169B2 (en) * | 2005-03-07 | 2008-05-20 | Joseph Reid Henrichs | Optical phase conjugation laser diode |
| JP2007012688A (ja) * | 2005-06-28 | 2007-01-18 | Toshiba Corp | 半導体発光素子 |
| DE102006039369A1 (de) * | 2005-12-30 | 2007-07-05 | Osram Opto Semiconductors Gmbh | LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers |
| DE102006028692B4 (de) * | 2006-05-19 | 2021-09-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium |
| US8115213B2 (en) * | 2007-02-08 | 2012-02-14 | Phoseon Technology, Inc. | Semiconductor light sources, systems, and methods |
| US20080197369A1 (en) * | 2007-02-20 | 2008-08-21 | Cree, Inc. | Double flip semiconductor device and method for fabrication |
| US20090238227A1 (en) * | 2008-03-05 | 2009-09-24 | Rohm Co., Ltd. | Semiconductor light emitting device |
| JP5102082B2 (ja) * | 2008-03-18 | 2012-12-19 | 株式会社リコー | 画像形成装置 |
-
2006
- 2006-07-31 DE DE102006035627A patent/DE102006035627A1/de not_active Withdrawn
-
2007
- 2007-07-27 JP JP2009522085A patent/JP2009545865A/ja active Pending
- 2007-07-27 KR KR1020097003151A patent/KR20090033897A/ko not_active Withdrawn
- 2007-07-27 WO PCT/DE2007/001349 patent/WO2008014772A1/de not_active Ceased
- 2007-07-27 US US12/375,528 patent/US8405065B2/en active Active
- 2007-07-27 CN CNA2007800285790A patent/CN101496187A/zh active Pending
- 2007-07-27 EP EP07817415.8A patent/EP2047527B1/de active Active
- 2007-07-30 TW TW096127685A patent/TWI370557B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200070168A (ko) * | 2019-10-01 | 2020-06-17 | 에피스타 코포레이션 | 발광 디바이스 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101496187A (zh) | 2009-07-29 |
| EP2047527B1 (de) | 2017-11-22 |
| US20090302307A1 (en) | 2009-12-10 |
| EP2047527A1 (de) | 2009-04-15 |
| US8405065B2 (en) | 2013-03-26 |
| TW200810159A (en) | 2008-02-16 |
| WO2008014772A1 (de) | 2008-02-07 |
| JP2009545865A (ja) | 2009-12-24 |
| DE102006035627A1 (de) | 2008-02-07 |
| TWI370557B (en) | 2012-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20090216 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |