JP2009543355A5 - - Google Patents

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Publication number
JP2009543355A5
JP2009543355A5 JP2009518542A JP2009518542A JP2009543355A5 JP 2009543355 A5 JP2009543355 A5 JP 2009543355A5 JP 2009518542 A JP2009518542 A JP 2009518542A JP 2009518542 A JP2009518542 A JP 2009518542A JP 2009543355 A5 JP2009543355 A5 JP 2009543355A5
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JP
Japan
Prior art keywords
substrate
chamber
support
processing
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009518542A
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English (en)
Japanese (ja)
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JP2009543355A (ja
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Publication date
Priority claimed from US11/460,864 external-priority patent/US20070134821A1/en
Application filed filed Critical
Priority claimed from PCT/US2007/072264 external-priority patent/WO2008005773A2/en
Publication of JP2009543355A publication Critical patent/JP2009543355A/ja
Publication of JP2009543355A5 publication Critical patent/JP2009543355A5/ja
Pending legal-status Critical Current

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JP2009518542A 2006-07-03 2007-06-27 進歩型フロントエンド処理のためのクラスターツール Pending JP2009543355A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US80651806P 2006-07-03 2006-07-03
US11/460,864 US20070134821A1 (en) 2004-11-22 2006-07-28 Cluster tool for advanced front-end processing
PCT/US2007/072264 WO2008005773A2 (en) 2006-07-03 2007-06-27 Cluster tool for advanced front-end processing

Publications (2)

Publication Number Publication Date
JP2009543355A JP2009543355A (ja) 2009-12-03
JP2009543355A5 true JP2009543355A5 (https=) 2010-08-05

Family

ID=38895329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009518542A Pending JP2009543355A (ja) 2006-07-03 2007-06-27 進歩型フロントエンド処理のためのクラスターツール

Country Status (5)

Country Link
EP (1) EP2041774A2 (https=)
JP (1) JP2009543355A (https=)
KR (1) KR20090035578A (https=)
TW (1) TW200811916A (https=)
WO (1) WO2008005773A2 (https=)

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JP7158133B2 (ja) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
KR102366749B1 (ko) 2017-04-28 2022-02-23 어플라이드 머티어리얼스, 인코포레이티드 Oled 디바이스들의 제조에서 사용되는 진공 시스템을 세정하기 위한 방법, oled 디바이스들을 제조하기 위한 기판 상의 진공 증착을 위한 방법, 및 oled 디바이스들을 제조하기 위한 기판 상의 진공 증착을 위한 장치
US10697059B2 (en) 2017-09-15 2020-06-30 Lam Research Corporation Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching
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WO2019182916A1 (en) * 2018-03-20 2019-09-26 Tokyo Electron Limited Substrate processing tool with integrated metrology and method of using
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JP7206961B2 (ja) 2019-01-30 2023-01-18 日立金属株式会社 半導体製造装置の管理システム及びその方法
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KR20220041358A (ko) * 2020-09-25 2022-04-01 에스케이하이닉스 주식회사 반도체장치 및 그 제조 방법
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JP7485729B2 (ja) 2021-07-07 2024-05-16 アプライド マテリアルズ インコーポレイテッド エピタキシャル成長のための統合湿式洗浄
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CN114000192B (zh) * 2021-10-29 2023-10-13 北京北方华创微电子装备有限公司 半导体工艺设备以及晶圆位置状态的监测方法
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