JP2009532861A - ドレイン及びソース領域にリセスを設けることでチャネル領域に極めて近接するトランジスタにストレスソース与える技術 - Google Patents
ドレイン及びソース領域にリセスを設けることでチャネル領域に極めて近接するトランジスタにストレスソース与える技術 Download PDFInfo
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- JP2009532861A JP2009532861A JP2009502792A JP2009502792A JP2009532861A JP 2009532861 A JP2009532861 A JP 2009532861A JP 2009502792 A JP2009502792 A JP 2009502792A JP 2009502792 A JP2009502792 A JP 2009502792A JP 2009532861 A JP2009532861 A JP 2009532861A
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Abstract
Description
Claims (13)
- 半導体デバイス(150、250)であって、
第1導電型の第1トランジスタ(100、200)を含み、前記第1トランジスタ(100、200)は、
第1チャネル領域(106、206)の上方に形成される第1ゲート電極(105、205)と、
前記第1ゲート電極(105、205)と前記第1チャネル領域(106、206)との間に形成される第1ゲート絶縁層(104、204)と、
前記第1チャネル領域(106、206)に隣接して形成される第1ドレインならびにソース領域(114、214)と、を含み、前記第1ドレインならびにソース領域(114、214)は前記第1ゲート絶縁層(104、204)の底面に対してリセス(112D、212D)を設けた上面を有するものであって、さらに、
前記第1ドレインならびにソース領域(114、214)の上方に形成される第1応力層(118、218)を含み、前記第1応力層(118、218)は、前記第1リセスを設けたドレインならびにソース領域(114、214)によって形成されるリセス(112、212)にまで延びている、半導体デバイス(150、250)。 - 前記第1導電型とは異なる第2導電型の第2トランジスタ(100、200)をさらに含み、前記第2トランジスタ(100、200)は、
第2チャネル領域(106、206)の上方に形成される第2ゲート電極(105、205)と、
前記第2ゲート電極(105、205)と前記第2チャネル領域(106、206)との間に形成される第2ゲート絶縁層(104、204)と、
前記第2チャネル領域(106、206)に隣接して形成される第2ドレインならびにソース領域(114、214)を含み、前記第2ドレインならびにソース領域(114、214)は前記第2ゲート絶縁層(104、204)の底面に対してリセス(112D、212D)を設けた上面を有するものであって、さらに、
前記第2ドレインならびにソース領域(114、214)の上方に形成される第2応力層(118、218)を含み、前記第2応力層(118、218)は、前記第2リセスを設けたドレインならびにソース領域(112、214)によって形成されるリセス(112、212)にまで延びている、請求項1記載の半導体デバイス(150、250)。 - 前記第1リセスを設けたドレインならびにソース領域(214)は、第1の歪みのある半導体材料(230n、230p)を含む、請求項1記載の半導体デバイス(150、250)。
- 前記第1リセスを設けたドレインならびにソース領域(114、214)は、第1の歪みのある半導体材料(230、230p)を含み、前記第2リセスを設けたドレインならびにソース領域(114、214)は、前記第1の歪みのある半導体材料(230n、230p)とは異なる第2の歪みのある半導体材料(230n、230p)を含む、請求項2記載の半導体デバイス(150、250)。
- 前記第1ゲート電極(205)のサイドウォールに形成されるサイドウォールスペーサ(232)と、
前記サイドウォールスペーサ(232)に隣接する前記第1ドレインならびにソース領域(214)に形成される金属シリサイド(217)と、
前記第1ドレインならびにソース領域(214)中の歪みのある半導体材料(230)と、を含み、前記歪みのある半導体材料(230)の一部は、前記金属シリサイド(217)と前記第1チャネル領域(206)との間に横方向(217A)に設けられるように前記サイドウォールスペーサの下方に形成される、請求項1記載の半導体デバイス(250)。 - 第1の幅(208W)の第1サイドウォールスペーサ(208)を含むゲート電極構造(205)に隣接するリセス(212)を半導体層(203)に形成するステップと、
前記リセス(212)に歪みのある半導体材料(230)を形成するステップと、
前記第1サイドウォールスペーサ(208)を除去するステップと、
前記第1の幅(208)よりも広い第2の幅(232W)を有する第2サイドウォールスペーサ(232)に基づいて、少なくとも前記歪みのある半導体材料(230)にドレインならびにソース領域(214)を形成するステップと、を含む、方法。 - 前記歪みのある半導体(230)を形成するステップは、前記ゲート電極構造(205)と前記半導体層(203)との間に設けられるゲート絶縁層(204)に対してリセス(212D)が設けられるように、少なくとも一部を形成するステップを含む、請求項6記載の方法。
- 前記ドレインならびにソース領域(214)の上方に、前記歪みのある半導体材料(230)によって画定されるリセス(212)にまで延びる応力層(218)を形成するステップをさらに含む、請求項7記載の方法。
- 前記第2サイドウォールスペーサ(232)に基づいて前記歪みのある半導体材料(230)に金属シリサイド(217)を形成するステップをさらに含む、請求項6記載の方法。
- 第1電界効果トランジスタ(100、200)のゲート電極(105、205)に隣接して第1リセス(112、212)を形成するステップを含み、前記ゲート電極(105、205)は半導体層(103、203)の上方に設けられ、そのサイドウォールにはサイドウォールスペーサ(115、232)が形成されているものであって、さらに、
前記サイドウォールスペーサ(115、232)に隣接してドレイン領域ならびにソース領域(114、214)を形成するステップと、
前記第1電界効果トランジスタ(100、200)の上方に第1誘電応力層(118、218)を形成するステップを含み、前記第1誘電応力層(118、218)は、前記第1誘電応力層(118、218)の底面が、前記ゲート電極(105、205)と前記半導体層(103、203)との間に設けられるゲート絶縁層(104、204)の底面の下方に延びるように、前記リセス(112、212)に形成される、方法。 - 前記ゲート電極(105、205)の前記サイドウォールにオフセットスペーサ(108、231)を形成するステップと、
前記オフセットスペーサ(108、231)に基づいてドレインならびにソース拡張領域(111、211)を形成するステップと、を含む請求項10記載の方法。 - 前記ドレインならびにソース拡張領域(111、121)は前記リセス(112、212)の形成前に形成される、請求項11記載の方法。
- 第2電界効果トランジスタ(100、200)のゲート電極(105、205)に隣接して第2リセス(112、212)を形成するステップを含み、前記第2電界効果トランジスタ(100、200)の前記ゲート電極(105、205)は、前記半導体層(103、203)の上方に設けられており、さらに、そのサイドウォールにはサイドウォールスペーサ(115、232)が形成されているものであって、
前記サイドウォールスペーサ(115、232)に隣接してドレイン領域ならびにソース領域(114、214)を形成するステップと、
前記第2電界効果トランジスタ(100、200)の上方に第2誘電応力層(118、218)を形成するステップを含み、前記第2誘電応力層(118、218)は、前記第12誘電応力層(118、218)の底面が、前記第2電界効果トランジスタ(100、200)の前記ゲート電極(105、205)と前記半導体層(103、203)との間に設けられるゲート絶縁層(104、204)の底面の下方に延びるように、前記リセス(112、212)に形成されるものであって、前記第2誘電応力層(118、218)の固有応力は前記第1誘電応力層(118、218)の固有応力とは異なる、請求項10記載の方法。
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DE102006015077A DE102006015077B4 (de) | 2006-03-31 | 2006-03-31 | Transistor mit abgesenkten Drain- und Source-Gebieten und Verfahren zur Herstellung desselben |
US11/558,006 | 2006-11-09 | ||
US11/558,006 US7696052B2 (en) | 2006-03-31 | 2006-11-09 | Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions |
PCT/US2007/004689 WO2007126495A1 (en) | 2006-03-31 | 2007-02-21 | Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions |
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KR101452977B1 (ko) | 2014-02-27 | 2014-10-22 | 연세대학교 산학협력단 | 트랜지스터, 및 트랜지스터의 스트레인 인가 방법 |
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US20100155850A1 (en) | 2010-06-24 |
US20070228482A1 (en) | 2007-10-04 |
TW200802803A (en) | 2008-01-01 |
JP5576655B2 (ja) | 2014-08-20 |
US7696052B2 (en) | 2010-04-13 |
TWI511273B (zh) | 2015-12-01 |
US8274120B2 (en) | 2012-09-25 |
DE102006015077A1 (de) | 2007-10-11 |
DE102006015077B4 (de) | 2010-12-23 |
KR20090007388A (ko) | 2009-01-16 |
KR101430703B1 (ko) | 2014-08-14 |
CN101416287A (zh) | 2009-04-22 |
CN101416287B (zh) | 2010-07-21 |
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