JP2009523311A5 - - Google Patents
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- Publication number
- JP2009523311A5 JP2009523311A5 JP2008518548A JP2008518548A JP2009523311A5 JP 2009523311 A5 JP2009523311 A5 JP 2009523311A5 JP 2008518548 A JP2008518548 A JP 2008518548A JP 2008518548 A JP2008518548 A JP 2008518548A JP 2009523311 A5 JP2009523311 A5 JP 2009523311A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- reflective layer
- chuck
- reflective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 50
- 238000001900 extreme ultraviolet lithography Methods 0.000 claims 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 3
- 230000037430 deletion Effects 0.000 claims 3
- 238000012217 deletion Methods 0.000 claims 3
- 229910010413 TiO 2 Inorganic materials 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- -1 Ta 2 O 5 Inorganic materials 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/330,205 US7678511B2 (en) | 2006-01-12 | 2006-01-12 | Reflective-type mask blank for EUV lithography |
| US11/330,205 | 2006-01-12 | ||
| PCT/JP2007/050845 WO2007081059A2 (en) | 2006-01-12 | 2007-01-12 | Reflective-type mask blank for euv lithography |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011166856A Division JP4862970B2 (ja) | 2006-01-12 | 2011-07-29 | Euvリソグラフィ用反射型マスクブランク |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009523311A JP2009523311A (ja) | 2009-06-18 |
| JP2009523311A5 true JP2009523311A5 (enExample) | 2009-10-15 |
| JP4862892B2 JP4862892B2 (ja) | 2012-01-25 |
Family
ID=37891724
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008518548A Expired - Fee Related JP4862892B2 (ja) | 2006-01-12 | 2007-01-12 | Euvリソグラフィ用反射型マスクブランクの製造方法 |
| JP2011166856A Active JP4862970B2 (ja) | 2006-01-12 | 2011-07-29 | Euvリソグラフィ用反射型マスクブランク |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011166856A Active JP4862970B2 (ja) | 2006-01-12 | 2011-07-29 | Euvリソグラフィ用反射型マスクブランク |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7678511B2 (enExample) |
| EP (3) | EP2278395A1 (enExample) |
| JP (2) | JP4862892B2 (enExample) |
| KR (1) | KR101287697B1 (enExample) |
| AT (1) | ATE533084T1 (enExample) |
| TW (1) | TWI452418B (enExample) |
| WO (1) | WO2007081059A2 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1962326B1 (en) * | 2005-12-12 | 2012-06-06 | Asahi Glass Company, Limited | Reflection-type mask blank for euv lithography, and substrate with electrically conductive film for the mask blank |
| JP4532533B2 (ja) * | 2007-09-18 | 2010-08-25 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | Euv露光用マスクブランクおよびeuv露光用マスク |
| JP4663749B2 (ja) * | 2008-03-11 | 2011-04-06 | 大日本印刷株式会社 | 反射型マスクの検査方法および製造方法 |
| WO2009116348A1 (ja) * | 2008-03-18 | 2009-09-24 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
| JP2010135732A (ja) * | 2008-08-01 | 2010-06-17 | Asahi Glass Co Ltd | Euvマスクブランクス用基板 |
| KR20110065439A (ko) * | 2008-09-05 | 2011-06-15 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 및 그 제조 방법 |
| EP2511945A4 (en) * | 2009-12-09 | 2014-09-03 | Asahi Glass Co Ltd | MULTILAYER MIRROR FOR EUV LITHOGRAPHY AND METHOD OF MANUFACTURING THEREOF |
| JP5590113B2 (ja) | 2010-03-02 | 2014-09-17 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクおよびその製造方法 |
| JP5560776B2 (ja) * | 2010-03-03 | 2014-07-30 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクスの製造方法 |
| DE102011079933A1 (de) * | 2010-08-19 | 2012-02-23 | Carl Zeiss Smt Gmbh | Optisches Element für die UV- oder EUV-Lithographie |
| WO2012105698A1 (ja) | 2011-02-04 | 2012-08-09 | 旭硝子株式会社 | 導電膜付基板、多層反射膜付基板、およびeuvリソグラフィ用反射型マスクブランク |
| JP5950535B2 (ja) * | 2011-10-25 | 2016-07-13 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| CN103858209B (zh) * | 2011-09-28 | 2017-06-06 | 凸版印刷株式会社 | 反射型曝光用掩模坯及反射型曝光用掩模 |
| EP2581789B1 (en) * | 2011-10-14 | 2020-04-29 | Fundació Institut de Ciències Fotòniques | Optically transparent and electrically conductive coatings and method for their deposition on a substrate |
| JP6157874B2 (ja) * | 2012-03-19 | 2017-07-05 | Hoya株式会社 | Euvリソグラフィー用多層反射膜付き基板及びeuvリソグラフィー用反射型マスクブランク、並びにeuvリソグラフィー用反射型マスク及び半導体装置の製造方法 |
| KR20140016662A (ko) | 2012-07-30 | 2014-02-10 | 에스케이하이닉스 주식회사 | 극자외선 리소그래피용 마스크 및 그 제조방법, 마스크 정렬도 에러 보정방법 |
| WO2014021235A1 (ja) * | 2012-07-31 | 2014-02-06 | Hoya株式会社 | 反射型マスクブランク及びその製造方法、反射型マスクの製造方法、並びに半導体装置の製造方法 |
| WO2014050891A1 (ja) | 2012-09-28 | 2014-04-03 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびにeuvリソグラフィ用反射型マスクおよびその製造方法 |
| US9664997B2 (en) * | 2012-11-08 | 2017-05-30 | Hoya Corporation | Method of manufacturing mask blank and method of manufacturing transfer mask |
| KR102205778B1 (ko) * | 2012-11-20 | 2021-01-21 | 호야 가부시키가이샤 | 마스크 블랭크, 전사용 마스크, 마스크 블랭크의 제조방법, 전사용 마스크의 제조방법 및 반도체 디바이스의 제조방법 |
| US20140272684A1 (en) | 2013-03-12 | 2014-09-18 | Applied Materials, Inc. | Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor |
| US9417515B2 (en) | 2013-03-14 | 2016-08-16 | Applied Materials, Inc. | Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor |
| US9632411B2 (en) | 2013-03-14 | 2017-04-25 | Applied Materials, Inc. | Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor |
| US9612521B2 (en) | 2013-03-12 | 2017-04-04 | Applied Materials, Inc. | Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| US9354508B2 (en) | 2013-03-12 | 2016-05-31 | Applied Materials, Inc. | Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| JP6263051B2 (ja) * | 2013-03-13 | 2018-01-17 | Hoya株式会社 | ハーフトーン型位相シフトマスクブランクの製造方法 |
| DE102013107192A1 (de) * | 2013-07-08 | 2015-01-08 | Carl Zeiss Laser Optics Gmbh | Reflektives optisches Element für streifenden Einfall im EUV-Wellenlängenbereich |
| JP6303346B2 (ja) * | 2013-09-09 | 2018-04-04 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| SG10201805079YA (en) * | 2013-09-27 | 2018-07-30 | Hoya Corp | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
| JP6647198B2 (ja) * | 2013-12-22 | 2020-02-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | チャックアセンブリを有する極端紫外線リソグラフィーシステム及びその製造方法 |
| JP2016122751A (ja) * | 2014-12-25 | 2016-07-07 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに多層反射膜付き基板、反射型マスクブランク及び半導体装置の製造方法 |
| WO2016204051A1 (ja) * | 2015-06-17 | 2016-12-22 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
| KR102408195B1 (ko) | 2016-04-25 | 2022-06-13 | 에이에스엠엘 네델란즈 비.브이. | Euv 리소그래피를 위한 멤브레인 |
| US10775693B2 (en) * | 2016-12-07 | 2020-09-15 | Fundacio Institut De Ciencies Fotoniques | Transparent and electrically conductive coatings containing nitrides, borides or carbides |
| JP6904234B2 (ja) * | 2017-12-15 | 2021-07-14 | Agc株式会社 | マスクブランク用基板およびマスクブランク |
| SG11202005918UA (en) * | 2017-12-27 | 2020-07-29 | Hoya Corp | Substrate with conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| US11448955B2 (en) * | 2018-09-27 | 2022-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mask for lithography process and method for manufacturing the same |
| US11119398B2 (en) * | 2018-09-28 | 2021-09-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV photo masks |
| CN112997116B (zh) * | 2018-11-15 | 2025-02-21 | 科盛德光掩模株式会社 | 反射型光掩模坯以及反射型光掩模 |
| KR102798354B1 (ko) * | 2019-01-14 | 2025-04-23 | 삼성전자주식회사 | 포토 마스크, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| JPWO2020235612A1 (enExample) * | 2019-05-21 | 2020-11-26 | ||
| JP7689790B2 (ja) * | 2019-09-02 | 2025-06-09 | Hoya株式会社 | 反射膜付基板、マスクブランク、反射型マスク、及び半導体デバイスの製造方法 |
| CN113253563B (zh) * | 2020-05-26 | 2024-12-27 | 台湾积体电路制造股份有限公司 | Euv光掩模及其制造方法 |
| US11506969B2 (en) | 2020-05-26 | 2022-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV photo masks and manufacturing method thereof |
| WO2024195577A1 (ja) * | 2023-03-17 | 2024-09-26 | Agc株式会社 | Euvリソグラフィ用反射型マスクブランクおよび導電膜付き基板 |
| JP2025095450A (ja) * | 2023-12-14 | 2025-06-26 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク、および半導体装置の製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6098408A (en) * | 1998-11-11 | 2000-08-08 | Advanced Micro Devices | System for controlling reflection reticle temperature in microlithography |
| JP2000208594A (ja) | 1999-01-08 | 2000-07-28 | Nissin Electric Co Ltd | ガラス基板の吸着保持方法 |
| AU5597000A (en) | 1999-06-07 | 2000-12-28 | Regents Of The University Of California, The | Coatings on reflective mask substrates |
| US6737201B2 (en) * | 2000-11-22 | 2004-05-18 | Hoya Corporation | Substrate with multilayer film, reflection type mask blank for exposure, reflection type mask for exposure and production method thereof as well as production method of semiconductor device |
| JP3939132B2 (ja) * | 2000-11-22 | 2007-07-04 | Hoya株式会社 | 多層膜付き基板、露光用反射型マスクブランク、露光用反射型マスクおよびその製造方法、並びに半導体の製造方法 |
| JP4390418B2 (ja) | 2001-02-14 | 2009-12-24 | Hoya株式会社 | Euv露光用反射型マスクブランクおよびeuv露光用反射型マスク並びに半導体の製造方法 |
| US6749973B2 (en) * | 2001-02-14 | 2004-06-15 | Hoya Corporation | Reflection type mask blank for EUV exposure and reflection type mask for EUV exposure as well as method of producing the mask |
| JP2002299228A (ja) * | 2001-04-03 | 2002-10-11 | Nikon Corp | レチクル、それを用いた露光装置及び露光方法 |
| KR20030051198A (ko) * | 2001-09-28 | 2003-06-25 | 호야 가부시키가이샤 | 마스크 및 마스크 블랭크의 제조 방법, 마스크 블랭크 및마스크, 그리고 무용 필름을 제거하는 방법 및 장치 |
| US7129010B2 (en) * | 2002-08-02 | 2006-10-31 | Schott Ag | Substrates for in particular microlithography |
| DE10255605B4 (de) * | 2002-11-28 | 2005-07-07 | Infineon Technologies Ag | Reflektionsmaske zur Projektion einer Struktur auf einen Halbleiterwafer sowie Verfahren zu deren Herstellung |
| US6806007B1 (en) * | 2003-05-02 | 2004-10-19 | Advanced Micro Devices, Inc. | EUV mask which facilitates electro-static chucking |
| CN1983028B (zh) * | 2003-09-29 | 2012-07-25 | Hoya株式会社 | 掩膜坯及变换掩膜的制造方法 |
| JP4525893B2 (ja) * | 2003-10-24 | 2010-08-18 | 信越化学工業株式会社 | 位相シフトマスクブランク、位相シフトマスク及びパターン転写方法 |
| US6984475B1 (en) * | 2003-11-03 | 2006-01-10 | Advanced Micro Devices, Inc. | Extreme ultraviolet (EUV) lithography masks |
| JP2005210093A (ja) | 2003-12-25 | 2005-08-04 | Hoya Corp | 多層反射膜付き基板、露光用反射型マスクブランクス及び露光用反射型マスク、並びにそれらの製造方法 |
| US20050238922A1 (en) * | 2003-12-25 | 2005-10-27 | Hoya Corporation | Substrate with a multilayer reflection film, reflection type mask blank for exposure, reflection type mask for exposure and methods of manufacturing them |
| US7230695B2 (en) * | 2004-07-08 | 2007-06-12 | Asahi Glass Company, Ltd. | Defect repair device and defect repair method |
| JP2006267595A (ja) * | 2005-03-24 | 2006-10-05 | Toshiba Corp | マスクブランクスとその製造方法及び使用方法、並びにマスクとその製造方法及び使用方法 |
-
2006
- 2006-01-12 US US11/330,205 patent/US7678511B2/en active Active
-
2007
- 2007-01-12 AT AT07707133T patent/ATE533084T1/de active
- 2007-01-12 EP EP20100014669 patent/EP2278395A1/en not_active Withdrawn
- 2007-01-12 TW TW96101310A patent/TWI452418B/zh active
- 2007-01-12 WO PCT/JP2007/050845 patent/WO2007081059A2/en not_active Ceased
- 2007-01-12 KR KR1020087016849A patent/KR101287697B1/ko active Active
- 2007-01-12 EP EP07707133A patent/EP1971898B1/en active Active
- 2007-01-12 EP EP20100014668 patent/EP2278394A1/en not_active Withdrawn
- 2007-01-12 JP JP2008518548A patent/JP4862892B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-27 US US12/694,860 patent/US7960077B2/en active Active
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2011
- 2011-07-29 JP JP2011166856A patent/JP4862970B2/ja active Active