ATE533084T1 - Stubstrat mit reflektierenden schichten geeignet zur herstellung von reflexionsmaskenrohlingen für die euv-lithographie - Google Patents
Stubstrat mit reflektierenden schichten geeignet zur herstellung von reflexionsmaskenrohlingen für die euv-lithographieInfo
- Publication number
- ATE533084T1 ATE533084T1 AT07707133T AT07707133T ATE533084T1 AT E533084 T1 ATE533084 T1 AT E533084T1 AT 07707133 T AT07707133 T AT 07707133T AT 07707133 T AT07707133 T AT 07707133T AT E533084 T1 ATE533084 T1 AT E533084T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- substrate
- reflective layer
- euv lithography
- stubstrate
- Prior art date
Links
- 238000001900 extreme ultraviolet lithography Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/40—Electrostatic discharge [ESD] related features, e.g. antistatic coatings or a conductive metal layer around the periphery of the mask substrate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31616—Next to polyester [e.g., alkyd]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/330,205 US7678511B2 (en) | 2006-01-12 | 2006-01-12 | Reflective-type mask blank for EUV lithography |
| PCT/JP2007/050845 WO2007081059A2 (en) | 2006-01-12 | 2007-01-12 | Reflective-type mask blank for euv lithography |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE533084T1 true ATE533084T1 (de) | 2011-11-15 |
Family
ID=37891724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07707133T ATE533084T1 (de) | 2006-01-12 | 2007-01-12 | Stubstrat mit reflektierenden schichten geeignet zur herstellung von reflexionsmaskenrohlingen für die euv-lithographie |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7678511B2 (enExample) |
| EP (3) | EP2278395A1 (enExample) |
| JP (2) | JP4862892B2 (enExample) |
| KR (1) | KR101287697B1 (enExample) |
| AT (1) | ATE533084T1 (enExample) |
| TW (1) | TWI452418B (enExample) |
| WO (1) | WO2007081059A2 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1962326B1 (en) * | 2005-12-12 | 2012-06-06 | Asahi Glass Company, Limited | Reflection-type mask blank for euv lithography, and substrate with electrically conductive film for the mask blank |
| JP4532533B2 (ja) * | 2007-09-18 | 2010-08-25 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | Euv露光用マスクブランクおよびeuv露光用マスク |
| JP4663749B2 (ja) * | 2008-03-11 | 2011-04-06 | 大日本印刷株式会社 | 反射型マスクの検査方法および製造方法 |
| WO2009116348A1 (ja) * | 2008-03-18 | 2009-09-24 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランク |
| JP2010135732A (ja) * | 2008-08-01 | 2010-06-17 | Asahi Glass Co Ltd | Euvマスクブランクス用基板 |
| KR20110065439A (ko) * | 2008-09-05 | 2011-06-15 | 아사히 가라스 가부시키가이샤 | Euv 리소그래피용 반사형 마스크 블랭크 및 그 제조 방법 |
| EP2511945A4 (en) * | 2009-12-09 | 2014-09-03 | Asahi Glass Co Ltd | MULTILAYER MIRROR FOR EUV LITHOGRAPHY AND METHOD OF MANUFACTURING THEREOF |
| JP5590113B2 (ja) | 2010-03-02 | 2014-09-17 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクおよびその製造方法 |
| JP5560776B2 (ja) * | 2010-03-03 | 2014-07-30 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクスの製造方法 |
| DE102011079933A1 (de) * | 2010-08-19 | 2012-02-23 | Carl Zeiss Smt Gmbh | Optisches Element für die UV- oder EUV-Lithographie |
| WO2012105698A1 (ja) | 2011-02-04 | 2012-08-09 | 旭硝子株式会社 | 導電膜付基板、多層反射膜付基板、およびeuvリソグラフィ用反射型マスクブランク |
| JP5950535B2 (ja) * | 2011-10-25 | 2016-07-13 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| CN103858209B (zh) * | 2011-09-28 | 2017-06-06 | 凸版印刷株式会社 | 反射型曝光用掩模坯及反射型曝光用掩模 |
| EP2581789B1 (en) * | 2011-10-14 | 2020-04-29 | Fundació Institut de Ciències Fotòniques | Optically transparent and electrically conductive coatings and method for their deposition on a substrate |
| JP6157874B2 (ja) * | 2012-03-19 | 2017-07-05 | Hoya株式会社 | Euvリソグラフィー用多層反射膜付き基板及びeuvリソグラフィー用反射型マスクブランク、並びにeuvリソグラフィー用反射型マスク及び半導体装置の製造方法 |
| KR20140016662A (ko) | 2012-07-30 | 2014-02-10 | 에스케이하이닉스 주식회사 | 극자외선 리소그래피용 마스크 및 그 제조방법, 마스크 정렬도 에러 보정방법 |
| WO2014021235A1 (ja) * | 2012-07-31 | 2014-02-06 | Hoya株式会社 | 反射型マスクブランク及びその製造方法、反射型マスクの製造方法、並びに半導体装置の製造方法 |
| WO2014050891A1 (ja) | 2012-09-28 | 2014-04-03 | 旭硝子株式会社 | Euvリソグラフィ用反射型マスクブランクおよびその製造方法、ならびにeuvリソグラフィ用反射型マスクおよびその製造方法 |
| US9664997B2 (en) * | 2012-11-08 | 2017-05-30 | Hoya Corporation | Method of manufacturing mask blank and method of manufacturing transfer mask |
| KR102205778B1 (ko) * | 2012-11-20 | 2021-01-21 | 호야 가부시키가이샤 | 마스크 블랭크, 전사용 마스크, 마스크 블랭크의 제조방법, 전사용 마스크의 제조방법 및 반도체 디바이스의 제조방법 |
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| US9632411B2 (en) | 2013-03-14 | 2017-04-25 | Applied Materials, Inc. | Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor |
| US9612521B2 (en) | 2013-03-12 | 2017-04-04 | Applied Materials, Inc. | Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| US9354508B2 (en) | 2013-03-12 | 2016-05-31 | Applied Materials, Inc. | Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor |
| JP6263051B2 (ja) * | 2013-03-13 | 2018-01-17 | Hoya株式会社 | ハーフトーン型位相シフトマスクブランクの製造方法 |
| DE102013107192A1 (de) * | 2013-07-08 | 2015-01-08 | Carl Zeiss Laser Optics Gmbh | Reflektives optisches Element für streifenden Einfall im EUV-Wellenlängenbereich |
| JP6303346B2 (ja) * | 2013-09-09 | 2018-04-04 | 凸版印刷株式会社 | 反射型マスクブランクおよび反射型マスク |
| SG10201805079YA (en) * | 2013-09-27 | 2018-07-30 | Hoya Corp | Conductive film coated substrate, multilayer reflectivefilm coated substrate, reflective mask blank, reflectivemask, and semiconductor device manufacturing method |
| JP6647198B2 (ja) * | 2013-12-22 | 2020-02-14 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | チャックアセンブリを有する極端紫外線リソグラフィーシステム及びその製造方法 |
| JP2016122751A (ja) * | 2014-12-25 | 2016-07-07 | Hoya株式会社 | 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに多層反射膜付き基板、反射型マスクブランク及び半導体装置の製造方法 |
| WO2016204051A1 (ja) * | 2015-06-17 | 2016-12-22 | Hoya株式会社 | 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法 |
| KR102408195B1 (ko) | 2016-04-25 | 2022-06-13 | 에이에스엠엘 네델란즈 비.브이. | Euv 리소그래피를 위한 멤브레인 |
| US10775693B2 (en) * | 2016-12-07 | 2020-09-15 | Fundacio Institut De Ciencies Fotoniques | Transparent and electrically conductive coatings containing nitrides, borides or carbides |
| JP6904234B2 (ja) * | 2017-12-15 | 2021-07-14 | Agc株式会社 | マスクブランク用基板およびマスクブランク |
| SG11202005918UA (en) * | 2017-12-27 | 2020-07-29 | Hoya Corp | Substrate with conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and semiconductor device manufacturing method |
| US11448955B2 (en) * | 2018-09-27 | 2022-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mask for lithography process and method for manufacturing the same |
| US11119398B2 (en) * | 2018-09-28 | 2021-09-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV photo masks |
| CN112997116B (zh) * | 2018-11-15 | 2025-02-21 | 科盛德光掩模株式会社 | 反射型光掩模坯以及反射型光掩模 |
| KR102798354B1 (ko) * | 2019-01-14 | 2025-04-23 | 삼성전자주식회사 | 포토 마스크, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
| JPWO2020235612A1 (enExample) * | 2019-05-21 | 2020-11-26 | ||
| JP7689790B2 (ja) * | 2019-09-02 | 2025-06-09 | Hoya株式会社 | 反射膜付基板、マスクブランク、反射型マスク、及び半導体デバイスの製造方法 |
| CN113253563B (zh) * | 2020-05-26 | 2024-12-27 | 台湾积体电路制造股份有限公司 | Euv光掩模及其制造方法 |
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| WO2024195577A1 (ja) * | 2023-03-17 | 2024-09-26 | Agc株式会社 | Euvリソグラフィ用反射型マスクブランクおよび導電膜付き基板 |
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| US20050238922A1 (en) * | 2003-12-25 | 2005-10-27 | Hoya Corporation | Substrate with a multilayer reflection film, reflection type mask blank for exposure, reflection type mask for exposure and methods of manufacturing them |
| US7230695B2 (en) * | 2004-07-08 | 2007-06-12 | Asahi Glass Company, Ltd. | Defect repair device and defect repair method |
| JP2006267595A (ja) * | 2005-03-24 | 2006-10-05 | Toshiba Corp | マスクブランクスとその製造方法及び使用方法、並びにマスクとその製造方法及び使用方法 |
-
2006
- 2006-01-12 US US11/330,205 patent/US7678511B2/en active Active
-
2007
- 2007-01-12 AT AT07707133T patent/ATE533084T1/de active
- 2007-01-12 EP EP20100014669 patent/EP2278395A1/en not_active Withdrawn
- 2007-01-12 TW TW96101310A patent/TWI452418B/zh active
- 2007-01-12 WO PCT/JP2007/050845 patent/WO2007081059A2/en not_active Ceased
- 2007-01-12 KR KR1020087016849A patent/KR101287697B1/ko active Active
- 2007-01-12 EP EP07707133A patent/EP1971898B1/en active Active
- 2007-01-12 EP EP20100014668 patent/EP2278394A1/en not_active Withdrawn
- 2007-01-12 JP JP2008518548A patent/JP4862892B2/ja not_active Expired - Fee Related
-
2010
- 2010-01-27 US US12/694,860 patent/US7960077B2/en active Active
-
2011
- 2011-07-29 JP JP2011166856A patent/JP4862970B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2278394A1 (en) | 2011-01-26 |
| JP4862892B2 (ja) | 2012-01-25 |
| WO2007081059A2 (en) | 2007-07-19 |
| US20100167187A1 (en) | 2010-07-01 |
| US7960077B2 (en) | 2011-06-14 |
| JP2009523311A (ja) | 2009-06-18 |
| US7678511B2 (en) | 2010-03-16 |
| WO2007081059A3 (en) | 2007-11-08 |
| EP1971898A2 (en) | 2008-09-24 |
| KR101287697B1 (ko) | 2013-07-24 |
| EP1971898B1 (en) | 2011-11-09 |
| EP2278395A1 (en) | 2011-01-26 |
| JP2011228744A (ja) | 2011-11-10 |
| US20070160916A1 (en) | 2007-07-12 |
| TW200741332A (en) | 2007-11-01 |
| JP4862970B2 (ja) | 2012-01-25 |
| KR20080092363A (ko) | 2008-10-15 |
| TWI452418B (zh) | 2014-09-11 |
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