JP2003045949A5 - - Google Patents

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Publication number
JP2003045949A5
JP2003045949A5 JP2001229464A JP2001229464A JP2003045949A5 JP 2003045949 A5 JP2003045949 A5 JP 2003045949A5 JP 2001229464 A JP2001229464 A JP 2001229464A JP 2001229464 A JP2001229464 A JP 2001229464A JP 2003045949 A5 JP2003045949 A5 JP 2003045949A5
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JP
Japan
Prior art keywords
electrode
protective film
replacement
replace
complicated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001229464A
Other languages
English (en)
Japanese (ja)
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JP4166449B2 (ja
JP2003045949A (ja
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Publication date
Application filed filed Critical
Priority to JP2001229464A priority Critical patent/JP4166449B2/ja
Priority claimed from JP2001229464A external-priority patent/JP4166449B2/ja
Publication of JP2003045949A publication Critical patent/JP2003045949A/ja
Publication of JP2003045949A5 publication Critical patent/JP2003045949A5/ja
Application granted granted Critical
Publication of JP4166449B2 publication Critical patent/JP4166449B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001229464A 2001-07-30 2001-07-30 真空処理装置 Expired - Lifetime JP4166449B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001229464A JP4166449B2 (ja) 2001-07-30 2001-07-30 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001229464A JP4166449B2 (ja) 2001-07-30 2001-07-30 真空処理装置

Publications (3)

Publication Number Publication Date
JP2003045949A JP2003045949A (ja) 2003-02-14
JP2003045949A5 true JP2003045949A5 (enExample) 2005-05-12
JP4166449B2 JP4166449B2 (ja) 2008-10-15

Family

ID=19061809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001229464A Expired - Lifetime JP4166449B2 (ja) 2001-07-30 2001-07-30 真空処理装置

Country Status (1)

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JP (1) JP4166449B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100524585C (zh) * 2003-02-18 2009-08-05 松下电器产业株式会社 等离子体显示屏的制造方法以及基板保持件
JP4233897B2 (ja) * 2003-03-14 2009-03-04 シャープ株式会社 液晶表示装置の製造方法および液晶表示装置の製造装置
US20060096946A1 (en) * 2004-11-10 2006-05-11 General Electric Company Encapsulated wafer processing device and process for making thereof
JP2010034510A (ja) * 2008-07-02 2010-02-12 Murata Mfg Co Ltd 静電チャック
JP5566117B2 (ja) * 2009-05-27 2014-08-06 東京エレクトロン株式会社 静電吸着電極およびその製造方法、ならびに基板処理装置
JP6067210B2 (ja) * 2011-03-31 2017-01-25 芝浦メカトロニクス株式会社 プラズマ処理装置
JP5665679B2 (ja) 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
KR101196441B1 (ko) 2011-12-20 2012-11-01 이준호 정전 척의 리페어 방법
CN102994982B (zh) * 2012-11-23 2015-06-17 京东方科技集团股份有限公司 等离子体增强化学气相沉积电极板装置、沉积方法及沉积装置
NL2010527A (en) * 2013-03-27 2014-09-30 Asml Netherlands Bv Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder.
JP5929835B2 (ja) * 2013-05-29 2016-06-08 住友金属鉱山株式会社 長尺樹脂フィルムの表面処理装置及び表面処理方法、並びに該表面処理装置を備えたロールツーロール成膜装置
JP2017515301A (ja) * 2014-05-09 2017-06-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保護カバーを有する基板キャリアシステム
JP6174210B2 (ja) * 2016-08-18 2017-08-02 芝浦メカトロニクス株式会社 載置台およびプラズマ処理装置

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