DE10085268T1 - Elektrostatische Scheibenhalter mit Flachfilmelektrode - Google Patents

Elektrostatische Scheibenhalter mit Flachfilmelektrode

Info

Publication number
DE10085268T1
DE10085268T1 DE10085268T DE10085268T DE10085268T1 DE 10085268 T1 DE10085268 T1 DE 10085268T1 DE 10085268 T DE10085268 T DE 10085268T DE 10085268 T DE10085268 T DE 10085268T DE 10085268 T1 DE10085268 T1 DE 10085268T1
Authority
DE
Germany
Prior art keywords
film electrode
flat film
disk holder
electrostatic disk
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10085268T
Other languages
English (en)
Inventor
Ramesh Divakar
Morteza Zandi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Ceramics and Plastics Inc
Original Assignee
Saint Gobain Ceramics and Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics and Plastics Inc filed Critical Saint Gobain Ceramics and Plastics Inc
Publication of DE10085268T1 publication Critical patent/DE10085268T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
DE10085268T 1999-12-09 2000-12-05 Elektrostatische Scheibenhalter mit Flachfilmelektrode Withdrawn DE10085268T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16985999P 1999-12-09 1999-12-09
PCT/US2000/042562 WO2001043184A2 (en) 1999-12-09 2000-12-05 Electrostatic chucks with flat film electrode

Publications (1)

Publication Number Publication Date
DE10085268T1 true DE10085268T1 (de) 2002-12-12

Family

ID=22617494

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10085268T Withdrawn DE10085268T1 (de) 1999-12-09 2000-12-05 Elektrostatische Scheibenhalter mit Flachfilmelektrode

Country Status (8)

Country Link
US (1) US6744618B2 (de)
JP (1) JP2003516635A (de)
KR (1) KR20020059438A (de)
CN (1) CN1409871A (de)
AU (1) AU4516701A (de)
DE (1) DE10085268T1 (de)
GB (1) GB2375231A (de)
WO (1) WO2001043184A2 (de)

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US6780591B2 (en) 1998-05-01 2004-08-24 Arizona Board Of Regents Method of determining the nucleotide sequence of oligonucleotides and DNA molecules
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JP4057977B2 (ja) * 2003-08-08 2008-03-05 株式会社巴川製紙所 静電チャック装置用電極シート、静電チャック装置および吸着方法
TWI247551B (en) * 2003-08-12 2006-01-11 Ngk Insulators Ltd Method of manufacturing electrical resistance heating element
JP4744855B2 (ja) * 2003-12-26 2011-08-10 日本碍子株式会社 静電チャック
JP4476701B2 (ja) * 2004-06-02 2010-06-09 日本碍子株式会社 電極内蔵焼結体の製造方法
US20060163774A1 (en) * 2005-01-25 2006-07-27 Norbert Abels Methods for shaping green bodies and articles made by such methods
US20060166159A1 (en) 2005-01-25 2006-07-27 Norbert Abels Laser shaping of green metal body used in manufacturing an orthodontic bracket
US20060166158A1 (en) * 2005-01-25 2006-07-27 Norbert Abels Laser shaping of green metal body to yield an orthodontic bracke
US7446284B2 (en) * 2005-12-21 2008-11-04 Momentive Performance Materials Inc. Etch resistant wafer processing apparatus and method for producing the same
US20070181065A1 (en) * 2006-02-09 2007-08-09 General Electric Company Etch resistant heater and assembly thereof
US20070221132A1 (en) * 2006-03-24 2007-09-27 General Electric Company Composition, coating, coated article, and method
JP2007258610A (ja) * 2006-03-24 2007-10-04 Ngk Insulators Ltd アルミナ焼成体
US20080009417A1 (en) * 2006-07-05 2008-01-10 General Electric Company Coating composition, article, and associated method
US20080006204A1 (en) * 2006-07-06 2008-01-10 General Electric Company Corrosion resistant wafer processing apparatus and method for making thereof
US20080141938A1 (en) * 2006-12-13 2008-06-19 General Electric Company Processing apparatus, coated article and method
US20080142755A1 (en) * 2006-12-13 2008-06-19 General Electric Company Heater apparatus and associated method
US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP5972630B2 (ja) * 2011-03-30 2016-08-17 日本碍子株式会社 静電チャックの製法
WO2015013142A1 (en) * 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
CN104465478B (zh) * 2014-12-22 2017-01-25 北京中科信电子装备有限公司 一种静电吸盘的加工方法
CN104576490A (zh) * 2014-12-31 2015-04-29 上海卡贝尼精密陶瓷有限公司 一种静电吸盘及其制造方法
US20180166311A1 (en) * 2016-12-12 2018-06-14 Applied Materials, Inc. New repair method for electrostatic chuck
JP7209515B2 (ja) * 2018-11-27 2023-01-20 東京エレクトロン株式会社 基板保持機構および成膜装置
CN111620701B (zh) * 2020-03-27 2022-05-13 烟台睿瓷新材料技术有限公司 一种多层复合陶瓷盘及其制造方法
US11955361B2 (en) * 2021-04-15 2024-04-09 Applied Materials, Inc. Electrostatic chuck with mesas

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JPS5944797A (ja) 1982-09-07 1984-03-13 増田　閃一 物体の静電的処理装置
DE3608326A1 (de) 1986-03-13 1987-09-17 Kempten Elektroschmelz Gmbh Praktisch porenfreie formkoerper aus polykristallinem aluminiumnitrid und verfahren zu ihrer herstellung ohne mitverwendung von sinterhilfsmitteln
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JP2665242B2 (ja) 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
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US5320990A (en) 1993-03-30 1994-06-14 The Dow Chemical Company Process for sintering aluminum nitride to a high thermal conductivity and resultant sintered bodies
JPH06326175A (ja) 1993-04-22 1994-11-25 Applied Materials Inc 集積回路処理装置において使用されるウエハサポートの誘電材への保護被覆とその形成方法
EP0635870A1 (de) 1993-07-20 1995-01-25 Applied Materials, Inc. Eine elektrostatische Halteplatte mit einer gerillten Fläche
DE69429243T2 (de) 1993-11-18 2002-06-27 Ngk Insulators Ltd Elektrode zur herstellung von plasma und verfahren zur herstellung der elektrode
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EP0692156A1 (de) 1994-01-31 1996-01-17 Applied Materials, Inc. Elektrostatische halteplatte mit gut an der form anliegendem isolierendem film
US5671116A (en) 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US5677253A (en) 1995-03-30 1997-10-14 Kyocera Corporation Wafer holding member
US5886863A (en) * 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
US5817406A (en) 1995-07-14 1998-10-06 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and brazing material connection
US5633073A (en) 1995-07-14 1997-05-27 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and eutectic connection
DE69635908T2 (de) 1995-08-03 2006-11-23 Ngk Insulators, Ltd., Nagoya Gesinterte Aluminiumnitridkörper und deren Verwendung als Subtrat in einer Vorrichtung zur Herstellung von Halbleitern
JP3457477B2 (ja) * 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
JP3670416B2 (ja) * 1995-11-01 2005-07-13 日本碍子株式会社 金属包含材および静電チャック
US6017485A (en) 1996-03-28 2000-01-25 Carborundum Corporation Process for making a low electrical resistivity, high purity aluminum nitride electrostatic chuck
US5764471A (en) * 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
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JP3790000B2 (ja) 1997-01-27 2006-06-28 日本碍子株式会社 セラミックス部材と電力供給用コネクターとの接合構造
JP3954177B2 (ja) 1997-01-29 2007-08-08 日本碍子株式会社 金属部材とセラミックス部材との接合構造およびその製造方法
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JP3670444B2 (ja) 1997-06-06 2005-07-13 日本碍子株式会社 窒化アルミニウム基複合体、電子機能材料、静電チャックおよび窒化アルミニウム基複合体の製造方法
JP3746594B2 (ja) 1997-06-20 2006-02-15 日本碍子株式会社 セラミックスの接合構造およびその製造方法
US5880924A (en) * 1997-12-01 1999-03-09 Applied Materials, Inc. Electrostatic chuck capable of rapidly dechucking a substrate
US5909355A (en) 1997-12-02 1999-06-01 Applied Materials, Inc. Ceramic electrostatic chuck and method of fabricating same
US6723274B1 (en) * 1999-12-09 2004-04-20 Saint-Gobain Ceramics & Plastics, Inc. High-purity low-resistivity electrostatic chucks
US6603650B1 (en) * 1999-12-09 2003-08-05 Saint-Gobain Ceramics And Plastics, Inc. Electrostatic chuck susceptor and method for fabrication
EP1394817A1 (de) * 2000-11-21 2004-03-03 Nissan Chemical Industries Ltd. Elektrisch leitfähige Oxid Partikel und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
WO2001043184A3 (en) 2001-12-13
GB2375231A (en) 2002-11-06
AU4516701A (en) 2001-06-18
GB0215881D0 (en) 2002-08-14
JP2003516635A (ja) 2003-05-13
WO2001043184A2 (en) 2001-06-14
KR20020059438A (ko) 2002-07-12
US6744618B2 (en) 2004-06-01
CN1409871A (zh) 2003-04-09
WO2001043184A9 (en) 2002-08-29
US20010043452A1 (en) 2001-11-22

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Legal Events

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OP8 Request for examination as to paragraph 44 patent law
8130 Withdrawal