DE60005615D1 - Klebefolien - Google Patents

Klebefolien

Info

Publication number
DE60005615D1
DE60005615D1 DE60005615T DE60005615T DE60005615D1 DE 60005615 D1 DE60005615 D1 DE 60005615D1 DE 60005615 T DE60005615 T DE 60005615T DE 60005615 T DE60005615 T DE 60005615T DE 60005615 D1 DE60005615 D1 DE 60005615D1
Authority
DE
Germany
Prior art keywords
adhesive films
films
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60005615T
Other languages
English (en)
Other versions
DE60005615T2 (de
Inventor
Shigeki Muta
Hiroshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE60005615D1 publication Critical patent/DE60005615D1/de
Application granted granted Critical
Publication of DE60005615T2 publication Critical patent/DE60005615T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/28—Presence of paper
    • C09J2400/283—Presence of paper in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/005—Presence of polysiloxane in the release coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
DE60005615T 1999-07-29 2000-07-21 Klebefolien Expired - Fee Related DE60005615T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21482899A JP4480814B2 (ja) 1999-07-29 1999-07-29 接着シート類
JP21482899 1999-07-29

Publications (2)

Publication Number Publication Date
DE60005615D1 true DE60005615D1 (de) 2003-11-06
DE60005615T2 DE60005615T2 (de) 2004-04-29

Family

ID=16662219

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60005615T Expired - Fee Related DE60005615T2 (de) 1999-07-29 2000-07-21 Klebefolien

Country Status (6)

Country Link
EP (1) EP1072664B1 (de)
JP (1) JP4480814B2 (de)
KR (1) KR100610982B1 (de)
CN (1) CN1282770A (de)
DE (1) DE60005615T2 (de)
SG (1) SG109424A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2214432T3 (es) * 2000-05-20 2004-09-16 Tesa Ag Utilizacion de un soporte de papel de elevada densidad como tira soporte en un material de revestimiento para una cinta adhesiva.
JP4660949B2 (ja) * 2001-03-27 2011-03-30 日本ゼオン株式会社 感圧接着性組成物およびそれを用いたシート
CN100341391C (zh) * 2001-04-18 2007-10-03 日东电工株式会社 在柔性印刷电路上安装电子部件的方法及用于固定柔性印刷电路的压敏胶粘剂片
JP4115711B2 (ja) * 2002-02-14 2008-07-09 日東電工株式会社 フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法
JP4484478B2 (ja) * 2003-09-19 2010-06-16 日東電工株式会社 接着機能付き回路基板
DE102005015876A1 (de) * 2005-04-06 2006-10-12 Tesa Ag Verwendung eines holzschliffhaltigen hochdichten Papierträgers als Trägerbahn für antladhäsive Trennlackbeschichtungen
JP5110779B2 (ja) * 2005-07-21 2012-12-26 日東電工株式会社 光反応生成物シート類の製造方法及び装置
CN100406532C (zh) * 2005-12-10 2008-07-30 上海华仕德电路技术有限公司 用于柔性印制线路板的胶带的加工方法
JP4916757B2 (ja) * 2006-04-10 2012-04-18 日東電工株式会社 医療用粘着テープまたはシート
CA2583954C (en) * 2006-04-10 2014-01-28 Nitto Denko Corporation Pressure-sensitive adhesive tape or sheet, and process for producing pressure-sensitive adhesive tape or sheet
JP5382995B2 (ja) 2006-04-11 2014-01-08 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP2008083684A (ja) * 2006-08-30 2008-04-10 Nitto Denko Corp フレキシブル配線回路基板用感光性樹脂組成物およびそれを用いて得られるフレキシブル配線回路基板
CN101275059B (zh) * 2007-03-28 2012-05-23 深圳丹邦科技股份有限公司 耐热可剥离微粘性压敏胶膜及其制备方法
JP5101919B2 (ja) 2007-04-09 2012-12-19 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび両面粘着テープ付き配線回路基板
US10428462B2 (en) * 2007-06-15 2019-10-01 Upm Specialty Papers Oy Release product
JP5280034B2 (ja) * 2007-10-10 2013-09-04 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP5289747B2 (ja) * 2007-10-10 2013-09-11 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP5362291B2 (ja) * 2008-08-26 2013-12-11 日東電工株式会社 アクリル系粘着剤組成物、アクリル系粘着剤層およびアクリル系粘着テープ又はシート
JP5696345B2 (ja) * 2009-11-27 2015-04-08 エルジー・ケム・リミテッド 粘着剤組成物
WO2012124566A1 (ja) 2011-03-14 2012-09-20 日東電工株式会社 リリースライナー
DE102011089566A1 (de) 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
DE102011089565A1 (de) * 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
JP5923377B2 (ja) * 2012-04-27 2016-05-24 リンテック株式会社 剥離シート、粘着シートおよび粘着シートの製造方法
KR101441003B1 (ko) * 2012-12-04 2014-09-17 (주)리가테크 접착력이 향상된 양면 점착 테이프 및 그 제조방법
KR101639739B1 (ko) * 2015-12-30 2016-07-15 한국에이.엔.디 주식회사 검교정용 rf 태그
JP6715142B2 (ja) * 2016-09-20 2020-07-01 東京応化工業株式会社 接着剤組成物、及びその利用
CN108368405B (zh) * 2016-11-21 2019-07-12 日东电工株式会社 粘合片
JP6614180B2 (ja) * 2017-02-21 2019-12-04 トヨタ自動車株式会社 水素タンク素体の製造方法、および水素タンクの製造方法
WO2019075418A1 (en) 2017-10-12 2019-04-18 Avery Dennison Corporation CLEAN ADHESIVE WITH LOW DEGASSING
JP7125259B2 (ja) * 2017-11-30 2022-08-24 日東電工株式会社 粘着シート
CN112111232A (zh) * 2020-09-02 2020-12-22 星光印刷（苏州）有限公司 一种热塑粘合胶膜及其制备工艺
CN113999626A (zh) * 2021-11-02 2022-02-01 芜湖徽氏新材料科技有限公司 一种锂离子电池用高剪切胶带

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0241139Y2 (de) * 1985-03-29 1990-11-01
JPS61245397A (ja) * 1985-04-04 1986-10-31 日本製紙株式会社 剥離紙及びその製造方法
CA2037987A1 (en) * 1990-04-24 1991-10-25 Susan Z. Paquette Adhesive-backed film composite which can become permanently bonded to a plasticized substrate
JP2612528B2 (ja) * 1992-12-22 1997-05-21 株式会社巴川製紙所 剥離紙
JPH0881655A (ja) * 1994-07-12 1996-03-26 Sekisui Chem Co Ltd ポリスチレン系フィルムを基材とした粘着フィルム及びその製造方法
DE4425737C2 (de) * 1994-07-21 1998-01-08 Kaemmerer Gmbh Trennrohpapier mit silikathaltigen Primerstrichen und damit hergestelltes Trennpapier
JP3281490B2 (ja) * 1994-09-30 2002-05-13 日東電工株式会社 粘着剤組成物および該組成物を用いてなる粘着シートもしくはシート
JP3487313B2 (ja) * 1995-01-05 2004-01-19 日東電工株式会社 剥離ライナーならびに両面粘着テープまたはシート
JPH08222818A (ja) * 1995-02-15 1996-08-30 Nitto Denko Corp 粘着機能付きフレキシブル回路基板
JPH09137399A (ja) * 1995-11-08 1997-05-27 Oji Paper Co Ltd 剥離紙の製造方法
JPH09316411A (ja) * 1996-05-30 1997-12-09 Sekisui Chem Co Ltd グリーンシート用表面保護フィルム
JPH10102017A (ja) * 1996-09-30 1998-04-21 Oji Paper Co Ltd 粘着シートとその製造方法

Also Published As

Publication number Publication date
CN1282770A (zh) 2001-02-07
KR20010049882A (ko) 2001-06-15
DE60005615T2 (de) 2004-04-29
EP1072664A1 (de) 2001-01-31
KR100610982B1 (ko) 2006-08-10
JP4480814B2 (ja) 2010-06-16
SG109424A1 (en) 2005-03-30
EP1072664B1 (de) 2003-10-01
JP2001040301A (ja) 2001-02-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee