JP4166449B2 - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP4166449B2
JP4166449B2 JP2001229464A JP2001229464A JP4166449B2 JP 4166449 B2 JP4166449 B2 JP 4166449B2 JP 2001229464 A JP2001229464 A JP 2001229464A JP 2001229464 A JP2001229464 A JP 2001229464A JP 4166449 B2 JP4166449 B2 JP 4166449B2
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JP
Japan
Prior art keywords
substrate
chuck body
chuck
adherend
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001229464A
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English (en)
Japanese (ja)
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JP2003045949A5 (enExample
JP2003045949A (ja
Inventor
耕 不破
謙 前平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2001229464A priority Critical patent/JP4166449B2/ja
Publication of JP2003045949A publication Critical patent/JP2003045949A/ja
Publication of JP2003045949A5 publication Critical patent/JP2003045949A5/ja
Application granted granted Critical
Publication of JP4166449B2 publication Critical patent/JP4166449B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP2001229464A 2001-07-30 2001-07-30 真空処理装置 Expired - Lifetime JP4166449B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001229464A JP4166449B2 (ja) 2001-07-30 2001-07-30 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001229464A JP4166449B2 (ja) 2001-07-30 2001-07-30 真空処理装置

Publications (3)

Publication Number Publication Date
JP2003045949A JP2003045949A (ja) 2003-02-14
JP2003045949A5 JP2003045949A5 (enExample) 2005-05-12
JP4166449B2 true JP4166449B2 (ja) 2008-10-15

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ID=19061809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001229464A Expired - Lifetime JP4166449B2 (ja) 2001-07-30 2001-07-30 真空処理装置

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JP (1) JP4166449B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100524585C (zh) * 2003-02-18 2009-08-05 松下电器产业株式会社 等离子体显示屏的制造方法以及基板保持件
JP4233897B2 (ja) * 2003-03-14 2009-03-04 シャープ株式会社 液晶表示装置の製造方法および液晶表示装置の製造装置
US20060096946A1 (en) * 2004-11-10 2006-05-11 General Electric Company Encapsulated wafer processing device and process for making thereof
JP2010034510A (ja) * 2008-07-02 2010-02-12 Murata Mfg Co Ltd 静電チャック
JP5566117B2 (ja) * 2009-05-27 2014-08-06 東京エレクトロン株式会社 静電吸着電極およびその製造方法、ならびに基板処理装置
JP6067210B2 (ja) * 2011-03-31 2017-01-25 芝浦メカトロニクス株式会社 プラズマ処理装置
JP5665679B2 (ja) 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
KR101196441B1 (ko) 2011-12-20 2012-11-01 이준호 정전 척의 리페어 방법
CN102994982B (zh) * 2012-11-23 2015-06-17 京东方科技集团股份有限公司 等离子体增强化学气相沉积电极板装置、沉积方法及沉积装置
NL2010527A (en) * 2013-03-27 2014-09-30 Asml Netherlands Bv Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder.
JP5929835B2 (ja) * 2013-05-29 2016-06-08 住友金属鉱山株式会社 長尺樹脂フィルムの表面処理装置及び表面処理方法、並びに該表面処理装置を備えたロールツーロール成膜装置
JP2017515301A (ja) * 2014-05-09 2017-06-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保護カバーを有する基板キャリアシステム
JP6174210B2 (ja) * 2016-08-18 2017-08-02 芝浦メカトロニクス株式会社 載置台およびプラズマ処理装置

Also Published As

Publication number Publication date
JP2003045949A (ja) 2003-02-14

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