JP2009515320A - Iii族窒化物半導体素子の製造 - Google Patents
Iii族窒化物半導体素子の製造 Download PDFInfo
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- JP2009515320A JP2009515320A JP2008533784A JP2008533784A JP2009515320A JP 2009515320 A JP2009515320 A JP 2009515320A JP 2008533784 A JP2008533784 A JP 2008533784A JP 2008533784 A JP2008533784 A JP 2008533784A JP 2009515320 A JP2009515320 A JP 2009515320A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 78
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- 150000004767 nitrides Chemical class 0.000 title claims description 75
- 230000001681 protective effect Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 45
- 125000006850 spacer group Chemical group 0.000 claims description 34
- 229910002704 AlGaN Inorganic materials 0.000 claims description 18
- 239000012212 insulator Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- -1 Si 3 N 4 Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- 238000000206 photolithography Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66522—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with an active layer made of a group 13/15 material
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
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- H01L29/2003—Nitride compounds
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- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
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Abstract
【選択図】 図2
Description
2 N極GaN層
3 N極AlGaN層
4 N極GaN層
5 N極AlGaN層
6 電源電極
7 電源電極
8 ゲート構造
10 支持本体
12 第1N極III族窒化物半導体本体
14 第2N極III族窒化物半導体本体
16 第3N極III族窒化物半導体本体
18 第1電源電極
20 第2電源電極
22 スペーサ本体
24 第4N極III族窒化物半導体本体
26 ゲート構造体
28 ゲート絶縁体
30 ゲート電極
32 基板
34 バッファ層
36 隙間
40 第1電源電極マスク
42 絶縁体本体
44 第2電源電極マスク
Claims (27)
- 第1N極III族窒化物半導体本体を、支持本体の上に成長させる工程と、
第2N極III族窒化物半導体本体を、前記第1N極III族窒化物半導体本体の上に成長させる工程と、
第3N極III族窒化物半導体本体を前記第2N極III族窒化物半導体本体の上に成長させる工程と、
保護スペーサ本体を、前記第3III族窒化物半導体本体の上に成長させる工程と、
前記保護スペーサ本体の一部を除去して、そこに開口を画定し、前記第3III族窒化物半導体本体の一部を露出させる工程と、
第4N極III族窒化物半導体本体を、少なくとも前記露出部分の上に成長させる工程と、
ゲート構造を前記第4III族窒化物半導体本体の上に形成する工程、
とを含む半導体素子の製造方法。 - 前記第1および第3III族窒化物半導体本体は、GaNから成り、前記第2および第4III族窒化物半導体本体は、AlGaNから成る請求項1に記載の方法。
- 前記支持本体は、基板および基板上に配置されているバッファ層から成る請求項1に記載の方法。
- 前記基板は、シリコンから成る請求項3に記載の方法。
- 前記基板は、炭化ケイ素から成る請求項3に記載の方法。
- 前記基板は、サファイアから成る請求項3に記載の方法。
- 前記バッファ層は、III族窒化物本体から成る請求項3に記載の方法。
- 前記バッファ層は、AlNから成る請求項3に記載の方法。
- 前記支持本体は、III族窒化物材料から成る請求項1に記載の方法。
- 前記支持本体は、GaNから成る請求項1に記載の方法。
- 前記ゲート構造は、ゲート絶縁体、およびゲート電極から成る請求項1に記載の方法。
- 前記ゲート構造は、前記第4III族窒化物半導体本体とショットキー接触している請求項1に記載の方法。
- 前記第3III族窒化物半導体本体とそれぞれ電気的に結合される電源電極を形成する工程をさらに含む請求項1に記載の方法。
- 前記保護スペーサ本体は、Ge、SiO2、Si3N4、およびAl2O3の少なくとも1つから成る請求項1に記載の方法。
- 第1III族窒化物半導体本体を、支持本体の上に成長させる工程と、
第2III族窒化物半導体本体を、前記第1III族窒化物半導体本体の上に成長させる工程と、
第3III族窒化物半導体本体を、前記第2III族窒化物半導体本体の上に成長させる工程と、
保護スペーサ本体を、前記第3III族窒化物半導体本体の上に成長させる工程と、
前記保護スペーサ本体の一部を除去して、そこに開口を画定し、前記第3III族窒化物半導体本体の一部を露出させる工程と、
ゲート構造を、前記第3III族窒化物半導体本体の上に形成する工程、
とを含む半導体素子の製造方法。 - 前記ゲート構造の形成後に、前記第3III族窒化物半導体本体と電気的に結合される電源電極を形成する工程をさらに含む請求項15に記載の方法。
- 前記ゲート構造に隣接する前記保護スペーサ本体の一部を除去して、少なくとも前記第3III族窒化物半導体本体を露出させる工程と、絶縁体本体を前記ゲート構造の上に、かつ少なくとも前記ゲート構造に隣接する前記露出部分の上に形成する工程と、前記保護スペーサ本体の残りの少なくとも一部を除去して、前記第3III族窒化物半導体本体の少なくとも一部を露出させる工程と、電源電極を、前記第3III族窒化物半導体本体の前記露出部分の上に形成する工程とをさらに含む請求項15に記載の方法。
- 前記第1および前記第3III族窒化物半導体本体は、GaNから成り、前記第2III族窒化物半導体本体は、AlGaNから成る請求項15に記載の方法。
- 前記支持本体は、基板および前記基板上に配置されるバッファ層から成る請求項15に記載の方法。
- 前記基板は、シリコン、炭化ケイ素、またはサファイアの少なくとも1つから成る請求項19に記載の方法。
- 前記バッファ層は、III族窒化物本体から成る請求項19に記載の方法。
- 前記バッファ層は、AlNから成る請求項19に記載の方法。
- 前記支持本体は、III族窒化物材料から成る請求項15に記載の方法。
- 前記支持本体は、GaNから成る請求項15に記載の方法。
- 前記ゲート構造は、ゲート絶縁体およびゲート電極から成る請求項15に記載の方法。
- 前記ゲート構造は、前記第3III族窒化物半導体本体とショットキー接触している請求項15に記載の方法。
- 前記保護スペーサ本体は、Ge、SiO2、Si3N4、およびAl2O3のいずれか1つから成る請求項15に記載の方法。
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US72304005P | 2005-10-03 | 2005-10-03 | |
US60/723,040 | 2005-10-03 | ||
PCT/US2006/038678 WO2007041595A2 (en) | 2005-10-03 | 2006-10-03 | Iii-nitride semiconductor fabrication |
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JP2009515320A true JP2009515320A (ja) | 2009-04-09 |
JP5297806B2 JP5297806B2 (ja) | 2013-09-25 |
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Country | Link |
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US (1) | US7399692B2 (ja) |
JP (1) | JP5297806B2 (ja) |
DE (1) | DE112006002487B4 (ja) |
TW (1) | TWI323012B (ja) |
WO (1) | WO2007041595A2 (ja) |
Cited By (1)
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JP2012156332A (ja) * | 2011-01-26 | 2012-08-16 | Toshiba Corp | 半導体素子 |
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US8309987B2 (en) | 2008-07-15 | 2012-11-13 | Imec | Enhancement mode semiconductor device |
US8624260B2 (en) | 2010-01-30 | 2014-01-07 | National Semiconductor Corporation | Enhancement-mode GaN MOSFET with low leakage current and improved reliability |
US8710511B2 (en) * | 2011-07-29 | 2014-04-29 | Northrop Grumman Systems Corporation | AIN buffer N-polar GaN HEMT profile |
CN102290345B (zh) * | 2011-09-21 | 2013-04-03 | 西安电子科技大学 | 深亚微米栅长AlGaN/GaN HEMT制作方法 |
US9269788B2 (en) | 2012-02-23 | 2016-02-23 | Sensor Electronic Technology, Inc. | Ohmic contact to semiconductor |
CN106206695B (zh) * | 2015-05-07 | 2019-03-08 | 中国科学院苏州纳米技术与纳米仿生研究所 | 降低注入损伤实现增强型hemt器件的方法及增强型hemt器件 |
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US9865721B1 (en) * | 2016-06-15 | 2018-01-09 | Qorvo Us, Inc. | High electron mobility transistor (HEMT) device and method of making the same |
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- 2006-10-03 WO PCT/US2006/038678 patent/WO2007041595A2/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
US20070077745A1 (en) | 2007-04-05 |
DE112006002487T5 (de) | 2008-07-24 |
WO2007041595A3 (en) | 2009-04-23 |
US7399692B2 (en) | 2008-07-15 |
TW200725754A (en) | 2007-07-01 |
JP5297806B2 (ja) | 2013-09-25 |
DE112006002487B4 (de) | 2011-02-24 |
TWI323012B (en) | 2010-04-01 |
WO2007041595A2 (en) | 2007-04-12 |
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