JP2009514212A5 - - Google Patents
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- Publication number
- JP2009514212A5 JP2009514212A5 JP2008537717A JP2008537717A JP2009514212A5 JP 2009514212 A5 JP2009514212 A5 JP 2009514212A5 JP 2008537717 A JP2008537717 A JP 2008537717A JP 2008537717 A JP2008537717 A JP 2008537717A JP 2009514212 A5 JP2009514212 A5 JP 2009514212A5
- Authority
- JP
- Japan
- Prior art keywords
- memory cell
- substrate
- thyristor
- trench
- isolation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002955 isolation Methods 0.000 claims 24
- 239000000758 substrate Substances 0.000 claims 17
- 238000000034 method Methods 0.000 claims 8
- 239000012212 insulator Substances 0.000 claims 3
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/263,254 US7655973B2 (en) | 2005-10-31 | 2005-10-31 | Recessed channel negative differential resistance-based memory cell |
| US11/263,254 | 2005-10-31 | ||
| PCT/US2006/037750 WO2007055817A2 (en) | 2005-10-31 | 2006-09-26 | Recessed channel negative differential resistance-based memory cell |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009514212A JP2009514212A (ja) | 2009-04-02 |
| JP2009514212A5 true JP2009514212A5 (enExample) | 2009-12-17 |
| JP4893971B2 JP4893971B2 (ja) | 2012-03-07 |
Family
ID=37995128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008537717A Active JP4893971B2 (ja) | 2005-10-31 | 2006-09-26 | 溝形チャネルの負性微分抵抗をベースとするメモリセル |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US7655973B2 (enExample) |
| JP (1) | JP4893971B2 (enExample) |
| KR (1) | KR100989772B1 (enExample) |
| CN (2) | CN101300665B (enExample) |
| DE (1) | DE112006002913B4 (enExample) |
| TW (1) | TWI334139B (enExample) |
| WO (1) | WO2007055817A2 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007067133A (ja) * | 2005-08-31 | 2007-03-15 | Sony Corp | 半導体装置 |
| US7655973B2 (en) | 2005-10-31 | 2010-02-02 | Micron Technology, Inc. | Recessed channel negative differential resistance-based memory cell |
| US7781797B2 (en) * | 2006-06-29 | 2010-08-24 | International Business Machines Corporation | One-transistor static random access memory with integrated vertical PNPN device |
| US7630235B2 (en) * | 2007-03-28 | 2009-12-08 | Globalfoundries Inc. | Memory cells, memory devices and integrated circuits incorporating the same |
| JP4434252B2 (ja) * | 2007-09-27 | 2010-03-17 | ソニー株式会社 | 半導体装置 |
| JP5151370B2 (ja) * | 2007-09-28 | 2013-02-27 | ソニー株式会社 | 半導体装置 |
| US8035126B2 (en) * | 2007-10-29 | 2011-10-11 | International Business Machines Corporation | One-transistor static random access memory with integrated vertical PNPN device |
| US8138541B2 (en) * | 2009-07-02 | 2012-03-20 | Micron Technology, Inc. | Memory cells |
| US8021943B2 (en) * | 2009-11-25 | 2011-09-20 | International Business Machines Corporation | Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology |
| CN101807601A (zh) * | 2010-03-25 | 2010-08-18 | 复旦大学 | 一种使用SiGe源极的栅控PNPN场效应晶体管及其制备方法 |
| CN101814503B (zh) * | 2010-04-08 | 2012-05-23 | 复旦大学 | 一种互补栅控pnpn场效应晶体管及其制造方法 |
| US8535992B2 (en) | 2010-06-29 | 2013-09-17 | Micron Technology, Inc. | Thyristor random access memory device and method |
| US8455919B2 (en) * | 2010-07-19 | 2013-06-04 | Micron Technology, Inc. | High density thyristor random access memory device and method |
| DE102011009373B4 (de) * | 2011-01-25 | 2017-08-03 | Austriamicrosystems Ag | Fotodiodenbauelement |
| US8525245B2 (en) | 2011-04-21 | 2013-09-03 | International Business Machines Corporation | eDRAM having dynamic retention and performance tradeoff |
| US8816470B2 (en) | 2011-04-21 | 2014-08-26 | International Business Machines Corporation | Independently voltage controlled volume of silicon on a silicon on insulator chip |
| US8492207B2 (en) | 2011-04-21 | 2013-07-23 | International Business Machines Corporation | Implementing eFuse circuit with enhanced eFuse blow operation |
| US8456187B2 (en) | 2011-04-21 | 2013-06-04 | International Business Machines Corporation | Implementing temporary disable function of protected circuitry by modulating threshold voltage of timing sensitive circuit |
| US8541773B2 (en) * | 2011-05-02 | 2013-09-24 | Intel Corporation | Vertical tunneling negative differential resistance devices |
| JP2012256390A (ja) * | 2011-06-08 | 2012-12-27 | Elpida Memory Inc | 半導体装置 |
| CN102842340B (zh) * | 2011-06-22 | 2015-09-23 | 中国科学院微电子研究所 | 基于pnpn结构的sram电路及其读写方法 |
| US8609492B2 (en) | 2011-07-27 | 2013-12-17 | Micron Technology, Inc. | Vertical memory cell |
| US11315931B2 (en) | 2011-10-13 | 2022-04-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded transistor |
| US8853021B2 (en) * | 2011-10-13 | 2014-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded transistor |
| US9634134B2 (en) | 2011-10-13 | 2017-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded transistor |
| US8633564B2 (en) * | 2011-12-02 | 2014-01-21 | Micron Technology, Inc. | Semicondutor isolation structure |
| KR20130072524A (ko) * | 2011-12-22 | 2013-07-02 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 제조 방법 |
| KR101862345B1 (ko) | 2012-02-27 | 2018-07-05 | 삼성전자주식회사 | 모오스 전계효과 트랜지스터를 포함하는 반도체 장치 및 그 제조 방법 |
| KR20130138045A (ko) * | 2012-06-08 | 2013-12-18 | 국립대학법인 울산과학기술대학교 산학협력단 | Ndr 소자 및 그 제작공정 |
| CN104425388B (zh) * | 2013-09-06 | 2017-04-05 | 苏州东微半导体有限公司 | 一种半浮栅器件的制造方法及器件 |
| US9553171B2 (en) * | 2014-02-14 | 2017-01-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fin field effect transistor (FinFET) device and method for forming the same |
| US20150333068A1 (en) | 2014-05-14 | 2015-11-19 | Globalfoundries Singapore Pte. Ltd. | Thyristor random access memory |
| US9773681B2 (en) * | 2015-06-05 | 2017-09-26 | Vanguard International Semiconductor Corporation | Semiconductor device with a trench and method for manufacturing the same |
| FR3038774B1 (fr) * | 2015-07-08 | 2018-03-02 | Stmicroelectronics (Rousset) Sas | Procede de realisation d'un transistor haute tension a encombrement reduit, et circuit integre correspondant |
| US9812454B2 (en) * | 2016-02-08 | 2017-11-07 | Kilopass Technology, Inc. | Methods and systems for reducing electrical disturb effects between thyristor memory cells using buried metal cathode lines |
| JP2017174906A (ja) * | 2016-03-22 | 2017-09-28 | 富士ゼロックス株式会社 | 発光部品、プリントヘッド及び画像形成装置 |
| KR101928629B1 (ko) | 2016-12-01 | 2018-12-12 | 한양대학교 산학협력단 | 2단자 수직형 1t-디램 및 그 제조 방법 |
| SG11202010449RA (en) * | 2018-06-19 | 2021-01-28 | Applied Materials Inc | Pulsed plasma deposition etch step coverage improvement |
| KR102552464B1 (ko) | 2018-11-19 | 2023-07-06 | 삼성전자 주식회사 | 반도체 소자 |
| KR102156685B1 (ko) | 2018-11-27 | 2020-09-16 | 한양대학교 산학협력단 | 2단자 수직형 사이리스터 기반 1t 디램 |
| FR3095891B1 (fr) * | 2019-05-09 | 2023-01-13 | St Microelectronics Sa | Circuit électronique |
| US11183095B2 (en) * | 2019-12-31 | 2021-11-23 | Micron Technology, Inc. | Dynamic screen refresh rate for an electronic device |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4158238A (en) * | 1978-04-21 | 1979-06-12 | Erb Darrell M | Stratified charge ram having an opposite dopant polarity MOSFET switching circuit |
| DE2835143A1 (de) * | 1978-08-10 | 1980-03-13 | Siemens Ag | Thyristor |
| US4247916A (en) * | 1979-10-30 | 1981-01-27 | Erb Darrell M | Memory device in which one type carrier stored during write controls the flow of the other type carrier during read |
| JP2739002B2 (ja) * | 1991-12-20 | 1998-04-08 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| US5929477A (en) * | 1997-01-22 | 1999-07-27 | International Business Machines Corporation | Self-aligned diffused source vertical transistors with stack capacitors in a 4F-square memory cell array |
| US6545297B1 (en) * | 1998-05-13 | 2003-04-08 | Micron Technology, Inc. | High density vertical SRAM cell using bipolar latchup induced by gated diode breakdown |
| US6229161B1 (en) * | 1998-06-05 | 2001-05-08 | Stanford University | Semiconductor capacitively-coupled NDR device and its applications in high-density high-speed memories and in power switches |
| KR100297737B1 (ko) | 1998-09-24 | 2001-11-01 | 윤종용 | 반도체소자의 트렌치 소자 분리 방법 |
| US6111778A (en) * | 1999-05-10 | 2000-08-29 | International Business Machines Corporation | Body contacted dynamic memory |
| US6593632B1 (en) * | 1999-08-17 | 2003-07-15 | Advanced Micro Devices, Inc. | Interconnect methodology employing a low dielectric constant etch stop layer |
| JP3356162B2 (ja) * | 1999-10-19 | 2002-12-09 | 株式会社デンソー | 半導体装置及びその製造方法 |
| WO2001069672A1 (en) * | 2000-03-13 | 2001-09-20 | Koninklijke Philips Electronics N.V. | A method of manufacturing a semiconductor device |
| US6660631B1 (en) * | 2000-08-31 | 2003-12-09 | Micron Technology, Inc. | Devices containing platinum-iridium films and methods of preparing such films and devices |
| US6458632B1 (en) * | 2001-03-14 | 2002-10-01 | Chartered Semiconductor Manufacturing Ltd. | UMOS-like gate-controlled thyristor structure for ESD protection |
| JP2003168300A (ja) | 2001-11-29 | 2003-06-13 | Mitsubishi Electric Corp | 半導体装置 |
| JP2003208799A (ja) | 2002-01-11 | 2003-07-25 | Mitsubishi Electric Corp | 半導体記憶装置 |
| US6917078B2 (en) * | 2002-08-30 | 2005-07-12 | Micron Technology Inc. | One transistor SOI non-volatile random access memory cell |
| US7042027B2 (en) * | 2002-08-30 | 2006-05-09 | Micron Technology, Inc. | Gated lateral thyristor-based random access memory cell (GLTRAM) |
| US6888200B2 (en) * | 2002-08-30 | 2005-05-03 | Micron Technology Inc. | One transistor SOI non-volatile random access memory cell |
| US6790713B1 (en) | 2002-09-09 | 2004-09-14 | T-Ram, Inc. | Method for making an inlayed thyristor-based device |
| US6686612B1 (en) | 2002-10-01 | 2004-02-03 | T-Ram, Inc. | Thyristor-based device adapted to inhibit parasitic current |
| US6666481B1 (en) * | 2002-10-01 | 2003-12-23 | T-Ram, Inc. | Shunt connection to emitter |
| US6965129B1 (en) * | 2002-11-06 | 2005-11-15 | T-Ram, Inc. | Thyristor-based device having dual control ports |
| US6768156B1 (en) * | 2003-02-10 | 2004-07-27 | Micron Technology, Inc. | Non-volatile random access memory cells associated with thin film constructions |
| US6845034B2 (en) * | 2003-03-11 | 2005-01-18 | Micron Technology, Inc. | Electronic systems, constructions for detecting properties of objects, and assemblies for identifying persons |
| US8125003B2 (en) * | 2003-07-02 | 2012-02-28 | Micron Technology, Inc. | High-performance one-transistor memory cell |
| US7329953B2 (en) * | 2003-10-29 | 2008-02-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same |
| US7081378B2 (en) * | 2004-01-05 | 2006-07-25 | Chartered Semiconductor Manufacturing Ltd. | Horizontal TRAM and method for the fabrication thereof |
| US7224002B2 (en) * | 2004-05-06 | 2007-05-29 | Micron Technology, Inc. | Silicon on insulator read-write non-volatile memory comprising lateral thyristor and trapping layer |
| US7326969B1 (en) * | 2004-12-02 | 2008-02-05 | T-Ram Semiconductor, Inc. | Semiconductor device incorporating thyristor-based memory and strained silicon |
| DE102005047058B4 (de) * | 2005-09-30 | 2009-09-24 | Qimonda Ag | Herstellungsverfahren für einen Graben-Transistor und entsprechender Graben-Transistor |
| US7655973B2 (en) * | 2005-10-31 | 2010-02-02 | Micron Technology, Inc. | Recessed channel negative differential resistance-based memory cell |
| DE102006022126B4 (de) * | 2006-05-11 | 2015-04-09 | Infineon Technologies Ag | Verfahren zum Herstellen eines elektronischen Bauelementes |
| US7630235B2 (en) * | 2007-03-28 | 2009-12-08 | Globalfoundries Inc. | Memory cells, memory devices and integrated circuits incorporating the same |
-
2005
- 2005-10-31 US US11/263,254 patent/US7655973B2/en active Active
-
2006
- 2006-09-26 KR KR1020087010415A patent/KR100989772B1/ko active Active
- 2006-09-26 DE DE112006002913.4T patent/DE112006002913B4/de active Active
- 2006-09-26 CN CN2006800408921A patent/CN101300665B/zh active Active
- 2006-09-26 CN CN201110296045.4A patent/CN102339856B/zh active Active
- 2006-09-26 JP JP2008537717A patent/JP4893971B2/ja active Active
- 2006-09-26 WO PCT/US2006/037750 patent/WO2007055817A2/en not_active Ceased
- 2006-10-17 TW TW095138151A patent/TWI334139B/zh active
-
2010
- 2010-01-07 US US12/683,939 patent/US7915673B2/en not_active Expired - Lifetime
-
2011
- 2011-03-02 US US13/038,443 patent/US8119459B2/en not_active Expired - Lifetime
-
2012
- 2012-02-16 US US13/398,549 patent/US8686494B2/en active Active
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