JP2009502533A5 - - Google Patents

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Publication number
JP2009502533A5
JP2009502533A5 JP2008523966A JP2008523966A JP2009502533A5 JP 2009502533 A5 JP2009502533 A5 JP 2009502533A5 JP 2008523966 A JP2008523966 A JP 2008523966A JP 2008523966 A JP2008523966 A JP 2008523966A JP 2009502533 A5 JP2009502533 A5 JP 2009502533A5
Authority
JP
Japan
Prior art keywords
hardness
abrasive
particles
conditioning
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008523966A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009502533A (ja
Filing date
Publication date
Priority claimed from US11/191,722 external-priority patent/US7169031B1/en
Application filed filed Critical
Publication of JP2009502533A publication Critical patent/JP2009502533A/ja
Publication of JP2009502533A5 publication Critical patent/JP2009502533A5/ja
Pending legal-status Critical Current

Links

JP2008523966A 2005-07-28 2006-07-19 自蔵型コンディショニング研磨物品 Pending JP2009502533A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/191,722 US7169031B1 (en) 2005-07-28 2005-07-28 Self-contained conditioning abrasive article
PCT/US2006/028064 WO2007015911A1 (en) 2005-07-28 2006-07-19 Self-contained conditioning abrasive article

Publications (2)

Publication Number Publication Date
JP2009502533A JP2009502533A (ja) 2009-01-29
JP2009502533A5 true JP2009502533A5 (enExample) 2009-09-03

Family

ID=37402642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523966A Pending JP2009502533A (ja) 2005-07-28 2006-07-19 自蔵型コンディショニング研磨物品

Country Status (8)

Country Link
US (1) US7169031B1 (enExample)
EP (1) EP1910026B1 (enExample)
JP (1) JP2009502533A (enExample)
KR (1) KR101299266B1 (enExample)
CN (1) CN101232968B (enExample)
DE (1) DE602006007857D1 (enExample)
TW (1) TWI399260B (enExample)
WO (1) WO2007015911A1 (enExample)

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JP6561058B2 (ja) 2013-12-09 2019-08-14 スリーエム イノベイティブ プロパティズ カンパニー 集塊性研磨粒子、その粒子を含む研磨物品、及びその製造方法
EP2928275A1 (en) * 2014-04-04 2015-10-07 ABB Technology Ltd Arrangement for cooling components of a subsea electric system
JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
CN103962973A (zh) * 2014-05-08 2014-08-06 武汉法山磨料磨具有限公司 一种含羧甲基纤维素钠的树脂砂轮的制作方法
US10086500B2 (en) 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US10654146B2 (en) * 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN109894930B (zh) * 2019-03-22 2021-06-25 湖南科技大学 一种缓释型柔性磨具及抛光方法
CN111300224B (zh) * 2020-04-10 2021-05-21 昆山顺天金属制品有限公司 一种磨料精选的精加工打磨机
CN118927171A (zh) * 2024-09-19 2024-11-12 郑州磨料磨具磨削研究所有限公司 一种研抛一体化复合磨具及其制备方法和应用

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