KR101299266B1 - 자급식 컨디셔닝 연마 용품 - Google Patents

자급식 컨디셔닝 연마 용품 Download PDF

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Publication number
KR101299266B1
KR101299266B1 KR1020087002027A KR20087002027A KR101299266B1 KR 101299266 B1 KR101299266 B1 KR 101299266B1 KR 1020087002027 A KR1020087002027 A KR 1020087002027A KR 20087002027 A KR20087002027 A KR 20087002027A KR 101299266 B1 KR101299266 B1 KR 101299266B1
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KR
South Korea
Prior art keywords
abrasive
hardness
conditioning
particles
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020087002027A
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English (en)
Korean (ko)
Other versions
KR20080030054A (ko
Inventor
티모시 디. 플레처
폴 에스. 러그
빈센트 디. 로메로
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20080030054A publication Critical patent/KR20080030054A/ko
Application granted granted Critical
Publication of KR101299266B1 publication Critical patent/KR101299266B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020087002027A 2005-07-28 2006-07-19 자급식 컨디셔닝 연마 용품 Expired - Fee Related KR101299266B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/191,722 2005-07-28
US11/191,722 US7169031B1 (en) 2005-07-28 2005-07-28 Self-contained conditioning abrasive article
PCT/US2006/028064 WO2007015911A1 (en) 2005-07-28 2006-07-19 Self-contained conditioning abrasive article

Publications (2)

Publication Number Publication Date
KR20080030054A KR20080030054A (ko) 2008-04-03
KR101299266B1 true KR101299266B1 (ko) 2013-08-23

Family

ID=37402642

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087002027A Expired - Fee Related KR101299266B1 (ko) 2005-07-28 2006-07-19 자급식 컨디셔닝 연마 용품

Country Status (8)

Country Link
US (1) US7169031B1 (enExample)
EP (1) EP1910026B1 (enExample)
JP (1) JP2009502533A (enExample)
KR (1) KR101299266B1 (enExample)
CN (1) CN101232968B (enExample)
DE (1) DE602006007857D1 (enExample)
TW (1) TWI399260B (enExample)
WO (1) WO2007015911A1 (enExample)

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KR20090089431A (ko) * 2006-11-17 2009-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 광원용 광학 접합 조성물
US20100051970A1 (en) * 2006-11-17 2010-03-04 Ouderkirk Andrew J Planarized led with optical extractor
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EP2419243A1 (en) * 2009-04-17 2012-02-22 3M Innovative Properties Company Metal particle transfer article, metal modified substrate, and method of making and using the same
US8603350B2 (en) * 2009-07-17 2013-12-10 Ohara Inc. Method of manufacturing substrate for information storage media
WO2013003816A2 (en) * 2011-06-30 2013-01-03 Saint-Gobain Ceramics & Plastics, Inc. A method of polishing a workpiece with an abrasive segment comprising abrasive aggregates having silicon carbide particles
US20130065490A1 (en) 2011-09-12 2013-03-14 3M Innovative Properties Company Method of refurbishing vinyl composition tile
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US9050697B2 (en) * 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
JP6016301B2 (ja) 2013-02-13 2016-10-26 昭和電工株式会社 単結晶ＳｉＣ基板の表面加工方法、その製造方法及び単結晶ＳｉＣ基板の表面加工用研削プレート
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
JP5954293B2 (ja) * 2013-10-17 2016-07-20 信越半導体株式会社 研磨用の発泡ウレタンパッドのドレッシング装置
WO2015088953A1 (en) * 2013-12-09 2015-06-18 3M Innovative Properties Company Conglomerate abrasive particles, abrasive articles including the same, and methods of making the same
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JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
CN103962973A (zh) * 2014-05-08 2014-08-06 武汉法山磨料磨具有限公司 一种含羧甲基纤维素钠的树脂砂轮的制作方法
US10086500B2 (en) 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US10654146B2 (en) * 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN109894930B (zh) * 2019-03-22 2021-06-25 湖南科技大学 一种缓释型柔性磨具及抛光方法
CN111300224B (zh) * 2020-04-10 2021-05-21 昆山顺天金属制品有限公司 一种磨料精选的精加工打磨机
CN118927171A (zh) * 2024-09-19 2024-11-12 郑州磨料磨具磨削研究所有限公司 一种研抛一体化复合磨具及其制备方法和应用

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Patent Citations (1)

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JPH09508324A (ja) * 1994-01-28 1997-08-26 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 侵食性凝集体を含有する被覆研磨材

Also Published As

Publication number Publication date
WO2007015911A1 (en) 2007-02-08
US7169031B1 (en) 2007-01-30
TW200720021A (en) 2007-06-01
EP1910026A1 (en) 2008-04-16
US20070026774A1 (en) 2007-02-01
JP2009502533A (ja) 2009-01-29
DE602006007857D1 (de) 2009-08-27
CN101232968A (zh) 2008-07-30
TWI399260B (zh) 2013-06-21
KR20080030054A (ko) 2008-04-03
EP1910026B1 (en) 2009-07-15
CN101232968B (zh) 2010-05-19

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