TWI399260B - 自含式修整研磨物件，製造自含式修整研磨物件之方法及包含自含式修整研磨物件之拋光系統 - Google Patents
自含式修整研磨物件，製造自含式修整研磨物件之方法及包含自含式修整研磨物件之拋光系統 Download PDFInfo
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- TWI399260B TWI399260B TW095127480A TW95127480A TWI399260B TW I399260 B TWI399260 B TW I399260B TW 095127480 A TW095127480 A TW 095127480A TW 95127480 A TW95127480 A TW 95127480A TW I399260 B TWI399260 B TW I399260B
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- Prior art keywords
- abrasive
- hardness
- particles
- composite
- abrasive article
- Prior art date
Links
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- 238000000034 method Methods 0.000 title claims description 43
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- 238000004519 manufacturing process Methods 0.000 title claims description 6
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 229910052594 sapphire Inorganic materials 0.000 claims description 8
- 239000010980 sapphire Substances 0.000 claims description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
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- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000002241 glass-ceramic Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 229910052580 B4C Inorganic materials 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 2
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 1
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- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical group N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
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- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
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- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical class O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
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- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 description 1
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 235000011083 sodium citrates Nutrition 0.000 description 1
- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
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- 239000000375 suspending agent Substances 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052853 topaz Inorganic materials 0.000 description 1
- 239000011031 topaz Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/191,722 US7169031B1 (en) | 2005-07-28 | 2005-07-28 | Self-contained conditioning abrasive article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200720021A TW200720021A (en) | 2007-06-01 |
| TWI399260B true TWI399260B (zh) | 2013-06-21 |
Family
ID=37402642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095127480A TWI399260B (zh) | 2005-07-28 | 2006-07-27 | 自含式修整研磨物件，製造自含式修整研磨物件之方法及包含自含式修整研磨物件之拋光系統 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7169031B1 (enExample) |
| EP (1) | EP1910026B1 (enExample) |
| JP (1) | JP2009502533A (enExample) |
| KR (1) | KR101299266B1 (enExample) |
| CN (1) | CN101232968B (enExample) |
| DE (1) | DE602006007857D1 (enExample) |
| TW (1) | TWI399260B (enExample) |
| WO (1) | WO2007015911A1 (enExample) |
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| US7494519B2 (en) * | 2005-07-28 | 2009-02-24 | 3M Innovative Properties Company | Abrasive agglomerate polishing method |
| US7594845B2 (en) * | 2005-10-20 | 2009-09-29 | 3M Innovative Properties Company | Abrasive article and method of modifying the surface of a workpiece |
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| WO2015088953A1 (en) * | 2013-12-09 | 2015-06-18 | 3M Innovative Properties Company | Conglomerate abrasive particles, abrasive articles including the same, and methods of making the same |
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| JP6838811B2 (ja) | 2014-05-02 | 2021-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 断続的構造化研磨物品並びに被加工物の研磨方法 |
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| CN109894930B (zh) * | 2019-03-22 | 2021-06-25 | 湖南科技大学 | 一种缓释型柔性磨具及抛光方法 |
| CN111300224B (zh) * | 2020-04-10 | 2021-05-21 | 昆山顺天金属制品有限公司 | 一种磨料精选的精加工打磨机 |
| CN118927171A (zh) * | 2024-09-19 | 2024-11-12 | 郑州磨料磨具磨削研究所有限公司 | 一种研抛一体化复合磨具及其制备方法和应用 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW348090B (en) * | 1996-05-29 | 1998-12-21 | Speedfam Co Ltd | One side grinding device having dresser |
| TW431939B (en) * | 1997-09-08 | 2001-05-01 | Rikagaku Kenkyusho | Optical dressing method, dressing apparatus using such optical dressing method, polishing stone and polishing cloth |
| TW467793B (en) * | 1999-05-17 | 2001-12-11 | Ebara Corp | Dressing apparatus and polishing apparatus |
| TW471996B (en) * | 1997-06-03 | 2002-01-11 | Speedfam Ipec Corp | Method and apparatus for conditioning grinding stones |
| TW565488B (en) * | 2001-07-20 | 2003-12-11 | 3M Innovative Properties Co | Fixed abrasive articles |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US100246A (en) * | 1870-03-01 | 1870-03-01 | Liam e | |
| US4311489A (en) * | 1978-08-04 | 1982-01-19 | Norton Company | Coated abrasive having brittle agglomerates of abrasive grain |
| US4652275A (en) * | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
| US4799939A (en) * | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
| JPS63274782A (ja) | 1987-05-02 | 1988-11-11 | Mishima Kosan Co Ltd | ステンレス鋼のラッピング液 |
| JPH01183370A (ja) * | 1988-01-11 | 1989-07-21 | Noritake Dia Kk | 複合ボンドダイヤモンド砥石とその製造法 |
| US5078753A (en) * | 1990-10-09 | 1992-01-07 | Minnesota Mining And Manufacturing Company | Coated abrasive containing erodable agglomerates |
| JPH04250983A (ja) * | 1990-11-01 | 1992-09-07 | Noritake Co Ltd | 研削用複合砥石 |
| US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| US5437754A (en) * | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
| JPH0615572A (ja) * | 1992-07-01 | 1994-01-25 | Matsushita Electric Ind Co Ltd | 研削砥石 |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5435816A (en) * | 1993-01-14 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Method of making an abrasive article |
| CH686787A5 (de) * | 1993-10-15 | 1996-06-28 | Diametal Ag | Schleifbelag fuer Schleifwerkzeuge und Verfahren zur Herstellung des Schleifbelages. |
| US5632668A (en) * | 1993-10-29 | 1997-05-27 | Minnesota Mining And Manufacturing Company | Method for the polishing and finishing of optical lenses |
| US5454844A (en) * | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
| WO1995020469A1 (en) * | 1994-01-28 | 1995-08-03 | Minnesota Mining And Manufacturing Company | Coated abrasive containing erodible agglomerates |
| US5562745A (en) * | 1994-03-16 | 1996-10-08 | Minnesota Mining And Manufacturing Company | Abrasive articles, methods of making abrasive articles, and methods of using abrasive articles |
| BR9509116A (pt) * | 1994-09-30 | 1997-11-18 | Minnesota Mining & Mfg | Artigo abrasivo revestido processos para produzir o mesmo e processo para desbastar uma peça dura |
| US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
| US5702811A (en) * | 1995-10-20 | 1997-12-30 | Ho; Kwok-Lun | High performance abrasive articles containing abrasive grains and nonabrasive composite grains |
| US6595831B1 (en) * | 1996-05-16 | 2003-07-22 | Ebara Corporation | Method for polishing workpieces using fixed abrasives |
| JP3709044B2 (ja) * | 1996-10-17 | 2005-10-19 | 昭和電工株式会社 | ガラス研磨用研磨材組成物およびその製造方法 |
| JPH10156704A (ja) * | 1996-12-03 | 1998-06-16 | Toshiba Mach Co Ltd | 研磨方法およびその装置 |
| US6183346B1 (en) * | 1998-08-05 | 2001-02-06 | 3M Innovative Properties Company | Abrasive article with embossed isolation layer and methods of making and using |
| JP4049510B2 (ja) | 1999-03-24 | 2008-02-20 | 株式会社オハラ | 情報記憶媒体用ガラス基板材またはガラスセラミックス基板材の加工方法 |
| US6319108B1 (en) * | 1999-07-09 | 2001-11-20 | 3M Innovative Properties Company | Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece |
| US6602117B1 (en) * | 2000-08-30 | 2003-08-05 | Micron Technology, Inc. | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| US6551366B1 (en) * | 2000-11-10 | 2003-04-22 | 3M Innovative Properties Company | Spray drying methods of making agglomerate abrasive grains and abrasive articles |
| US6645624B2 (en) * | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
| US20030100246A1 (en) | 2001-02-20 | 2003-05-29 | Kazuto Hirokawa | Polishing apparatus and dressing method |
| US6485355B1 (en) * | 2001-06-22 | 2002-11-26 | International Business Machines Corporation | Method to increase removal rate of oxide using fixed-abrasive |
| CN100360447C (zh) * | 2001-08-02 | 2008-01-09 | 3M创新有限公司 | 玻璃陶瓷 |
| JP2003251560A (ja) * | 2002-02-28 | 2003-09-09 | Sanwa Kenma Kogyo Kk | ドレッシング用成形体およびその製造方法 |
| US6910951B2 (en) | 2003-02-24 | 2005-06-28 | Dow Global Technologies, Inc. | Materials and methods for chemical-mechanical planarization |
| IL156094A0 (en) | 2003-05-25 | 2003-12-23 | J G Systems Inc | Fixed abrasive cmp pad with built-in additives |
| JP4443870B2 (ja) * | 2003-07-07 | 2010-03-31 | 克雄 庄司 | 超砥粒ホイール及びその製造方法 |
| US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
| JP2005271157A (ja) * | 2004-03-25 | 2005-10-06 | Noritake Super Abrasive:Kk | ラップホイール |
-
2005
- 2005-07-28 US US11/191,722 patent/US7169031B1/en not_active Expired - Lifetime
-
2006
- 2006-07-19 CN CN2006800275173A patent/CN101232968B/zh not_active Expired - Fee Related
- 2006-07-19 WO PCT/US2006/028064 patent/WO2007015911A1/en not_active Ceased
- 2006-07-19 DE DE602006007857T patent/DE602006007857D1/de active Active
- 2006-07-19 EP EP06787882A patent/EP1910026B1/en not_active Not-in-force
- 2006-07-19 KR KR1020087002027A patent/KR101299266B1/ko not_active Expired - Fee Related
- 2006-07-19 JP JP2008523966A patent/JP2009502533A/ja active Pending
- 2006-07-27 TW TW095127480A patent/TWI399260B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW348090B (en) * | 1996-05-29 | 1998-12-21 | Speedfam Co Ltd | One side grinding device having dresser |
| TW471996B (en) * | 1997-06-03 | 2002-01-11 | Speedfam Ipec Corp | Method and apparatus for conditioning grinding stones |
| TW431939B (en) * | 1997-09-08 | 2001-05-01 | Rikagaku Kenkyusho | Optical dressing method, dressing apparatus using such optical dressing method, polishing stone and polishing cloth |
| TW467793B (en) * | 1999-05-17 | 2001-12-11 | Ebara Corp | Dressing apparatus and polishing apparatus |
| TW565488B (en) * | 2001-07-20 | 2003-12-11 | 3M Innovative Properties Co | Fixed abrasive articles |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101299266B1 (ko) | 2013-08-23 |
| WO2007015911A1 (en) | 2007-02-08 |
| US7169031B1 (en) | 2007-01-30 |
| TW200720021A (en) | 2007-06-01 |
| EP1910026A1 (en) | 2008-04-16 |
| US20070026774A1 (en) | 2007-02-01 |
| JP2009502533A (ja) | 2009-01-29 |
| DE602006007857D1 (de) | 2009-08-27 |
| CN101232968A (zh) | 2008-07-30 |
| KR20080030054A (ko) | 2008-04-03 |
| EP1910026B1 (en) | 2009-07-15 |
| CN101232968B (zh) | 2010-05-19 |
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