JP2009502533A - 自蔵型コンディショニング研磨物品 - Google Patents

自蔵型コンディショニング研磨物品 Download PDF

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Publication number
JP2009502533A
JP2009502533A JP2008523966A JP2008523966A JP2009502533A JP 2009502533 A JP2009502533 A JP 2009502533A JP 2008523966 A JP2008523966 A JP 2008523966A JP 2008523966 A JP2008523966 A JP 2008523966A JP 2009502533 A JP2009502533 A JP 2009502533A
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JP
Japan
Prior art keywords
abrasive
hardness
particles
conditioning
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008523966A
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English (en)
Japanese (ja)
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JP2009502533A5 (enExample
Inventor
ティモシー・ディ・フレッチャー
ポール・エス・ラグ
ビンセント・ディ・ロメロ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009502533A publication Critical patent/JP2009502533A/ja
Publication of JP2009502533A5 publication Critical patent/JP2009502533A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2008523966A 2005-07-28 2006-07-19 自蔵型コンディショニング研磨物品 Pending JP2009502533A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/191,722 US7169031B1 (en) 2005-07-28 2005-07-28 Self-contained conditioning abrasive article
PCT/US2006/028064 WO2007015911A1 (en) 2005-07-28 2006-07-19 Self-contained conditioning abrasive article

Publications (2)

Publication Number Publication Date
JP2009502533A true JP2009502533A (ja) 2009-01-29
JP2009502533A5 JP2009502533A5 (enExample) 2009-09-03

Family

ID=37402642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523966A Pending JP2009502533A (ja) 2005-07-28 2006-07-19 自蔵型コンディショニング研磨物品

Country Status (8)

Country Link
US (1) US7169031B1 (enExample)
EP (1) EP1910026B1 (enExample)
JP (1) JP2009502533A (enExample)
KR (1) KR101299266B1 (enExample)
CN (1) CN101232968B (enExample)
DE (1) DE602006007857D1 (enExample)
TW (1) TWI399260B (enExample)
WO (1) WO2007015911A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015510847A (ja) * 2012-03-20 2015-04-13 ジェイエイチ ローデス カンパニー， インコーポレイテッド セルフコンディショニング研磨パッドおよびその作製方法
US9960048B2 (en) 2013-02-13 2018-05-01 Showa Denko K.K. Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate

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US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US7594845B2 (en) * 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US7573073B2 (en) * 2005-11-22 2009-08-11 3M Innovative Properties Company Arrays of light emitting articles and method of manufacturing same
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
US20080098659A1 (en) * 2006-10-26 2008-05-01 Chien-Min Sung Methods for securing individual abrasive particles to a substrate in a predetermined pattern
KR20090089431A (ko) * 2006-11-17 2009-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 광원용 광학 접합 조성물
US20100051970A1 (en) * 2006-11-17 2010-03-04 Ouderkirk Andrew J Planarized led with optical extractor
CN101548398A (zh) * 2006-11-20 2009-09-30 3M创新有限公司 用于led光源的光学粘合组合物
JP4561732B2 (ja) * 2006-11-20 2010-10-13 トヨタ自動車株式会社 移動体位置測位装置
US8323072B1 (en) 2007-03-21 2012-12-04 3M Innovative Properties Company Method of polishing transparent armor
US8038750B2 (en) 2007-07-13 2011-10-18 3M Innovative Properties Company Structured abrasive with overlayer, and method of making and using the same
KR101604505B1 (ko) * 2008-07-03 2016-03-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 고정 연마 입자 및 그로부터 제조된 물품
EP2419243A1 (en) * 2009-04-17 2012-02-22 3M Innovative Properties Company Metal particle transfer article, metal modified substrate, and method of making and using the same
US8603350B2 (en) * 2009-07-17 2013-12-10 Ohara Inc. Method of manufacturing substrate for information storage media
WO2013003816A2 (en) * 2011-06-30 2013-01-03 Saint-Gobain Ceramics & Plastics, Inc. A method of polishing a workpiece with an abrasive segment comprising abrasive aggregates having silicon carbide particles
US20130065490A1 (en) 2011-09-12 2013-03-14 3M Innovative Properties Company Method of refurbishing vinyl composition tile
CN102490111B (zh) * 2011-11-24 2014-06-11 上海华力微电子有限公司 一种固定磨料化学机械研磨装置
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
JP5954293B2 (ja) * 2013-10-17 2016-07-20 信越半導体株式会社 研磨用の発泡ウレタンパッドのドレッシング装置
WO2015088953A1 (en) * 2013-12-09 2015-06-18 3M Innovative Properties Company Conglomerate abrasive particles, abrasive articles including the same, and methods of making the same
EP2928275A1 (en) * 2014-04-04 2015-10-07 ABB Technology Ltd Arrangement for cooling components of a subsea electric system
JP6838811B2 (ja) 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
CN103962973A (zh) * 2014-05-08 2014-08-06 武汉法山磨料磨具有限公司 一种含羧甲基纤维素钠的树脂砂轮的制作方法
US10086500B2 (en) 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10195713B2 (en) 2016-08-11 2019-02-05 3M Innovative Properties Company Lapping pads and systems and methods of making and using the same
US10654146B2 (en) * 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN109894930B (zh) * 2019-03-22 2021-06-25 湖南科技大学 一种缓释型柔性磨具及抛光方法
CN111300224B (zh) * 2020-04-10 2021-05-21 昆山顺天金属制品有限公司 一种磨料精选的精加工打磨机
CN118927171A (zh) * 2024-09-19 2024-11-12 郑州磨料磨具磨削研究所有限公司 一种研抛一体化复合磨具及其制备方法和应用

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JPH04250983A (ja) * 1990-11-01 1992-09-07 Noritake Co Ltd 研削用複合砥石
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015510847A (ja) * 2012-03-20 2015-04-13 ジェイエイチ ローデス カンパニー， インコーポレイテッド セルフコンディショニング研磨パッドおよびその作製方法
US9960048B2 (en) 2013-02-13 2018-05-01 Showa Denko K.K. Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
US10453693B2 (en) 2013-02-13 2019-10-22 Showa Denko K.K. Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate

Also Published As

Publication number Publication date
KR101299266B1 (ko) 2013-08-23
WO2007015911A1 (en) 2007-02-08
US7169031B1 (en) 2007-01-30
TW200720021A (en) 2007-06-01
EP1910026A1 (en) 2008-04-16
US20070026774A1 (en) 2007-02-01
DE602006007857D1 (de) 2009-08-27
CN101232968A (zh) 2008-07-30
TWI399260B (zh) 2013-06-21
KR20080030054A (ko) 2008-04-03
EP1910026B1 (en) 2009-07-15
CN101232968B (zh) 2010-05-19

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