JP2009218562A - トランジスタ及びその製造方法 - Google Patents
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- JP2009218562A JP2009218562A JP2008313263A JP2008313263A JP2009218562A JP 2009218562 A JP2009218562 A JP 2009218562A JP 2008313263 A JP2008313263 A JP 2008313263A JP 2008313263 A JP2008313263 A JP 2008313263A JP 2009218562 A JP2009218562 A JP 2009218562A
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000003780 insertion Methods 0.000 claims abstract description 82
- 230000037431 insertion Effects 0.000 claims abstract description 82
- 239000004065 semiconductor Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 15
- 229910052723 transition metal Inorganic materials 0.000 claims description 8
- 150000003624 transition metals Chemical class 0.000 claims description 8
- 229910052696 pnictogen Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 253
- 108091006146 Channels Proteins 0.000 description 101
- 239000010409 thin film Substances 0.000 description 10
- 229910004438 SUB2 Inorganic materials 0.000 description 8
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 8
- 101150018444 sub2 gene Proteins 0.000 description 8
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 7
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 7
- 229910004444 SUB1 Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 2
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 2
- 229910052795 boron group element Inorganic materials 0.000 description 2
- 229910052800 carbon group element Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thin Film Transistor (AREA)
Abstract
【解決手段】チャンネル層、チャンネル層の両端にそれぞれ接触されたソース及びドレイン、チャンネル層と離隔されたゲート電極、チャンネル層とゲート電極との間に備わったゲート絶縁層、及びチャンネル層とゲート絶縁層との間に備わり、チャンネル層と仕事関数が異なる挿入層を備えるトランジスタである。
【選択図】図1
Description
D1,D2 ドレイン電極
G1,G2 ゲート電極
GI1,GI2 ゲート絶縁層
I1,I2 挿入層
S1,S2 ソース電極
SUB1,SUB2 基板
SS1 第1積層構造物
SS2 第2積層構造物
P1,P2 保護層
Claims (20)
- チャンネル層と、
前記チャンネル層の両端にそれぞれ接触されたソース及びドレインと、
前記チャンネル層と離隔されたゲート電極と、
前記チャンネル層と前記ゲート電極との間に備わったゲート絶縁層と、
前記チャンネル層と前記ゲート絶縁層との間に備わり、前記チャンネル層と仕事関数が異なる挿入層とを備えるトランジスタ。 - 前記チャンネル層は、酸化物を含むことを特徴とする請求項1に記載のトランジスタ。
- 前記酸化物は、Zn酸化物、Cu酸化物及びNi酸化物のうち一つを含むことを特徴とする請求項2に記載のトランジスタ。
- 前記チャンネル層は、n型であることを特徴とする請求項1に記載のトランジスタ。
- 前記挿入層は、p型またはn型半導体層であることを特徴とする請求項4に記載のトランジスタ。
- 前記チャンネル層は、ZnO層であるか、または13族及び14族の元素のうち、少なくとも一つがドーピングされたZnO層であることを特徴とする請求項4に記載のトランジスタ。
- 前記挿入層の仕事関数は、前記チャンネル層の仕事関数より大きいことを特徴とする請求項4に記載のトランジスタ。
- 前記挿入層のエネルギーバンドギャップは、前記チャンネル層のエネルギーバンドギャップより大きいことを特徴とする請求項7に記載のトランジスタ。
- 前記チャンネル層は、p型であることを特徴とする請求項1に記載のトランジスタ。
- 前記挿入層は、n型またはp型半導体層であることを特徴とする請求項9に記載のトランジスタ。
- 前記チャンネル層は、Cu酸化物層、Ni酸化物層、4族遷移金属がドーピングされたNi酸化物層のうちいずれか一つであるか、1族、2族、15族の元素及び遷移金属のうち、少なくともいずれか一つがドーピングされたZnO系酸化物層であることを特徴とする請求項9に記載のトランジスタ。
- 前記挿入層の仕事関数は、前記チャンネル層の仕事関数より小さいことを特徴とする請求項9に記載のトランジスタ。
- 前記挿入層のエネルギーバンドギャップは、前記チャンネル層のバンドギャップより小さいことを特徴とする請求項12に記載のトランジスタ。
- 前記ゲート電極は、前記チャンネル層上に備わることを特徴とする請求項1に記載のトランジスタ。
- 前記ゲート電極は、前記チャンネル層下に備わることを特徴とする請求項1に記載のトランジスタ。
- 基板上に互いに離隔されたチャンネル層とゲート電極とを形成する段階と、
前記チャンネル層の両端にそれぞれ接触されたソース及びドレインを形成する段階と、
前記チャンネル層と前記ゲート電極との間にゲート絶縁層を形成する段階と、
前記チャンネル層と前記ゲート電極との間に、前記チャンネル層と仕事関数が異なる挿入層を形成する段階とを含むことを特徴とするトランジスタの製造方法。 - 前記挿入層は、前記チャンネル層より大きな仕事関数を有することを特徴とする請求項16に記載のトランジスタの製造方法。
- 前記挿入層は、前記チャンネル層より小さな仕事関数を有することを特徴とする請求項16に記載のトランジスタの製造方法。
- 前記ゲート電極は、前記チャンネル層上に備わることを特徴とする請求項16に記載のトランジスタの製造方法。
- 前記ゲート電極は、前記チャンネル層下に備わることを特徴とする請求項16に記載のトランジスタの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080021567A KR101513601B1 (ko) | 2008-03-07 | 2008-03-07 | 트랜지스터 |
KR10-2008-0021567 | 2008-03-07 |
Publications (2)
Publication Number | Publication Date |
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JP2009218562A true JP2009218562A (ja) | 2009-09-24 |
JP5536328B2 JP5536328B2 (ja) | 2014-07-02 |
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JP2008313263A Active JP5536328B2 (ja) | 2008-03-07 | 2008-12-09 | トランジスタ及びその製造方法 |
Country Status (4)
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US (1) | US8669551B2 (ja) |
JP (1) | JP5536328B2 (ja) |
KR (1) | KR101513601B1 (ja) |
CN (1) | CN101527318B (ja) |
Cited By (16)
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JPS6183684A (ja) * | 1984-09-28 | 1986-04-28 | 株式会社日立製作所 | セラミツクスの接合方法 |
WO2011055645A1 (en) * | 2009-11-06 | 2011-05-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
WO2011065243A1 (en) * | 2009-11-28 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP2011228691A (ja) * | 2010-04-02 | 2011-11-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
KR20110128038A (ko) * | 2010-05-20 | 2011-11-28 | 삼성전자주식회사 | 산화물 반도체 박막 트랜지스터 |
WO2012091297A1 (ko) * | 2010-12-30 | 2012-07-05 | 주성엔지니어링㈜ | 박막 트랜지스터 및 그 제조 방법 |
JP2012164978A (ja) * | 2011-01-20 | 2012-08-30 | Semiconductor Energy Lab Co Ltd | 酸化物半導体素子及び半導体装置 |
JP2012169612A (ja) * | 2011-01-27 | 2012-09-06 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
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Also Published As
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KR101513601B1 (ko) | 2015-04-21 |
CN101527318A (zh) | 2009-09-09 |
CN101527318B (zh) | 2014-06-18 |
US20090224238A1 (en) | 2009-09-10 |
US8669551B2 (en) | 2014-03-11 |
JP5536328B2 (ja) | 2014-07-02 |
KR20090096155A (ko) | 2009-09-10 |
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